型号
- 型号
- 关键词
Analog to Digital Converters - ADC 12Bit ADC
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
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| 型号 | 5962-8759101LA | ICL7109CQH-TD- | 5962-8876401LA | 5962-8876402LA | 5962-8759104LA | ICL7109CMH+ | ICL7109CMH+T | ICL7109CQH+D | ICL7109IQH |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC 12Bit ADC | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC CMOS HIGHSPEED 8-BIT A/D CONVERTER WITH TRACK AND | Analog to Digital Converters - ADC CMOS HIGH-SPEED 8-BIT A/D CONVERTER WITH TRACK AND HOLD | Analog to Digital Converters - ADC | IC ADC 12BIT 3-ST 44-MQFP | IC ADC 12BIT 3-ST 44-MQFP | IC ADC 12BIT 3-ST 44-PLCC | A/D Converter, 13-Bit, 1 Func, CMOS, PQCC44 |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | - | DIP | DIP | DIP | QFP | QFP | LCC | - |
| 包装说明 | LEAD FREE, DIP-24 | - | CERAMIC, DIP-24 | CERAMIC, DIP-24 | LEAD FREE, DIP-24 | 10 X 10 MM, 2.0 MM, LEAD FREE, MQFP-44 | 10 X 10 MM, 2.0 MM, LEAD FREE, MQFP-44 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ |
| 针数 | 24 | - | 24 | 24 | 24 | 44 | 44 | 44 | - |
| Reach Compliance Code | not_compliant | - | not_compliant | not_compliant | not_compliant | compliant | compliant | compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | - |
| 最大模拟输入电压 | 5 V | - | 5 V | 5 V | 5 V | - | - | 3.5 V | 2.048 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | - | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, SUCCESSIVE APPROXIMATION | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | A/D CONVERTER |
| JESD-30 代码 | R-CDIP-T24 | - | R-GDIP-T24 | R-GDIP-T24 | R-CDIP-T24 | S-PQFP-G44 | S-PQFP-G44 | S-PQCC-J44 | S-PQCC-J44 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e3 | e3 | e3 | e0 |
| 最大线性误差 (EL) | 0.0244% | - | 0.3906% | 0.3906% | 0.0244% | - | - | 0.0244% | 0.024% |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 3 | 3 | 3 | - |
| 标称负供电电压 | -15 V | - | - | - | -15 V | -5 V | -5 V | -5 V | -5 V |
| 模拟输入通道数量 | 1 | - | 4 | 4 | 1 | 1 | 1 | 1 | - |
| 位数 | 12 | - | 8 | 8 | 12 | 12 | 12 | 12 | 13 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | - | 24 | 24 | 24 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | - | - | - | -20 °C |
| 输出位码 | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | - | BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, COMPLEMENTARY OFFSET BINARY | BINARY | BINARY | BINARY | BINARY | SIGNED PLUS MAGNITUDE |
| 输出格式 | PARALLEL, 8 BITS | - | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | DIP | DIP | QFP | QFP | QCCJ | QCCJ |
| 封装等效代码 | DIP24,.3 | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | - | - | LDCC44,.7SQ | LDCC44,.7SQ |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 | - | 240 | 240 | 240 | 260 | 260 | 260 | - |
| 电源 | 5,-15 V | - | 5 V | 5 V | 5,-15 V | - | - | +-5 V | +-5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | - | - | - | 5.715 mm | 2.388 mm | 2.388 mm | 4.57 mm | - |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | - | - | CMOS | CMOS |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | J BEND | J BEND |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | 20 | 20 | 30 | 30 | 30 | - |
| 宽度 | 7.62 mm | - | - | - | 7.62 mm | 10.0075 mm | 10.0075 mm | 16.585 mm | - |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
