型号
- 型号
- 关键词
EEPROM, 64KX8, 120ns, Parallel, CMOS, 1.685 X 0.600 INCH, 0.225 INCH HEIGHT, DIP-32
厂商名称：Xicor Inc
下载文档| 型号 | 5962-9086907MXA | 5962-9086903MYA | 5962-9086905MUC | 5962-9086905MZC | 5962-9086907MUC | 5962-9086907MZC | 5962-9086901MUC |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 64KX8, 120ns, Parallel, CMOS, 1.685 X 0.600 INCH, 0.225 INCH HEIGHT, DIP-32 | EEPROM, 64KX8, 200ns, Parallel, CMOS, 0.560 X 0.458 INCH, 0.120 INCH HEIGHT, LCC-32 | EEPROM, 64KX8, 150ns, Parallel, CMOS, 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36 | EEPROM, 64KX8, 150ns, Parallel, CMOS, 0.830 X 0.416 INCH, 0.120 INCH HEIGHT, FP-32 | EEPROM, 64KX8, 120ns, Parallel, CMOS, CPGA36, 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36 | EEPROM, 64KX8, 120ns, Parallel, CMOS, 0.830 X 0.416 INCH, 0.120 INCH HEIGHT, FP-32 | EEPROM, 64KX8, 250ns, Parallel, CMOS, 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36 |
| 包装说明 | 1.685 X 0.600 INCH, 0.225 INCH HEIGHT, DIP-32 | 0.560 X 0.458 INCH, 0.120 INCH HEIGHT, LCC-32 | 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36 | 0.830 X 0.416 INCH, 0.120 INCH HEIGHT, FP-32 | 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36 | 0.830 X 0.416 INCH, 0.120 INCH HEIGHT, FP-32 | 0.760 X 0.760 INCH, 0.120 INCH HEIGHT, PGA-36 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 120 ns | 200 ns | 150 ns | 150 ns | 120 ns | 120 ns | 250 ns |
| 其他特性 | 100000 ENDURANCE CYCLES | 100000 ENDURANCE CYCLES | 100000 ENDURANCE CYCLES | 100000 ENDURANCE CYCLES | 100000 ENDURANCE CYCLES | 100000 ENDURANCE CYCLES | 100000 ENDURANCE CYCLES |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES |
| 耐久性 | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 代码 | R-XDIP-T32 | R-XQCC-N32 | S-XPGA-P36 | R-XDFP-F32 | S-XPGA-P36 | R-XDFP-F32 | S-XPGA-P36 |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 36 | 32 | 36 | 32 | 36 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIP | QCCN | PGA | DFP | PGA | DFP | PGA |
| 封装等效代码 | DIP32,.6 | LCC32,.45X.55 | PGA36,7X7 | FL28,.4 | PGA36,7X7 | FL28,.4 | PGA36,7X7 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | GRID ARRAY | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY |
| 页面大小 | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 | 38535Q/M;38534H;883B | MIL-STD-883 | 38535Q/M;38534H;883B | MIL-STD-883 |
| 最大待机电流 | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | PIN/PEG | FLAT | PIN/PEG | FLAT | PIN/PEG |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | PERPENDICULAR | DUAL | PERPENDICULAR | DUAL | PERPENDICULAR |
| 切换位 | YES | YES | YES | YES | YES | YES | YES |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e0 | e0 | - | e4 | - | e4 | - |
| 长度 | 42.93 mm | - | 19.304 mm | - | 19.305 mm | - | 19.304 mm |
| 座面最大高度 | 5.89 mm | - | 4.8768 mm | 3.05 mm | 4.8768 mm | 3.05 mm | 4.8768 mm |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | - | GOLD | - | GOLD | - |
| 宽度 | 15.24 mm | - | 19.305 mm | 11.6586 mm | 19.304 mm | 11.6586 mm | 19.305 mm |
