型号
- 型号
- 关键词
| 型号 | 5962-9172601MLA | 5962-9172601M3A | SNJ54BCT8244AFK | SNJ54BCT8244AJT | SN74BCT8244A | SN54BCT8244A |
|---|---|---|---|---|---|---|
| 描述 | Scan Test Devices With Octal Buffers 24-CDIP -55 to 125 | Scan Test Devices With Octal Buffers 28-LCCC -55 to 125 | Scan Test Devices With Octal Buffers 28-LCCC -55 to 125 | Scan Test Devices With Octal Buffers 24-CDIP -55 to 125 | SN74BCT8244A IEEE Std 1149.1 (JTAG) Boundary-Scan Test Device With Octal Buffers | SN54BCT8244A Scan Test Devices With Octal Buffers |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 零件包装代码 | DIP | QLCC | QFN | DIP | - | - |
| 包装说明 | DIP, DIP24,.3 | LCC-28 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | - | - |
| 针数 | 24 | 28 | 28 | 24 | - | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | - | - |
| Factory Lead Time | 1 week | 6 weeks | 1 week | 6 weeks | - | - |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | - |
| 计数方向 | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - | - |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | - | - |
| JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 | - | - |
| 长度 | 32 mm | 11.43 mm | 11.43 mm | 32 mm | - | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | - | - |
| 逻辑集成电路类型 | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | - | - |
| 最大I（ol） | 0.064 A | 0.064 A | 0.064 A | 0.064 A | - | - |
| 位数 | 4 | 4 | 4 | 4 | - | - |
| 功能数量 | 2 | 2 | 2 | 2 | - | - |
| 端口数量 | 2 | 2 | 2 | 2 | - | - |
| 端子数量 | 24 | 28 | 28 | 24 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | DIP | QCCN | QCCN | DIP | - | - |
| 封装等效代码 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | - | - |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | - | - |
| 包装方法 | TUBE | TUBE | TUBE | TUBE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 最大电源电流（ICC） | 52 mA | 52 mA | 52 mA | 52 mA | - | - |
| Prop。Delay @ Nom-Sup | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | - | - |
| 传播延迟（tpd） | 9 ns | 9 ns | 9 ns | 9 ns | - | - |
| 认证状态 | Qualified | Qualified | Not Qualified | Not Qualified | - | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-PRF-38535 | MIL-PRF-38535 | - | - |
| 座面最大高度 | 5.08 mm | 2.03 mm | 2.03 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | NO | YES | YES | NO | - | - |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 翻译 | N/A | N/A | N/A | N/A | - | - |
| 宽度 | 6.92 mm | 11.43 mm | 11.43 mm | 6.92 mm | - | - |