描述 |
CPACK-56, Tube |
CPACK-56, Tube |
Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP56, CERPACK-56 |
CPACK-56, Tube |
Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP56, CERPACK-56 |
Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP56, CERPACK-56 |
零件包装代码 |
CPACK |
CPACK |
DFP |
CPACK |
DFP |
DFP |
包装说明 |
CERPACK-56 |
CERPACK-56 |
DFP, |
CERPACK-56 |
DFP, |
DFP, |
针数 |
56 |
56 |
56 |
56 |
56 |
56 |
Reach Compliance Code |
not_compliant |
not_compliant |
unknown |
not_compliant |
unknown |
unknown |
其他特性 |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
系列 |
FCT |
FCT |
FCT |
FCT |
FCT |
FCT |
JESD-30 代码 |
R-GDFP-F56 |
R-GDFP-F56 |
R-GDFP-F56 |
R-GDFP-F56 |
R-GDFP-F56 |
R-GDFP-F56 |
JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
长度 |
18.415 mm |
18.415 mm |
18.415 mm |
18.415 mm |
18.415 mm |
18.415 mm |
逻辑集成电路类型 |
REGISTERED BUS TRANSCEIVER |
REGISTERED BUS TRANSCEIVER |
REGISTERED BUS TRANSCEIVER |
REGISTERED BUS TRANSCEIVER |
REGISTERED BUS TRANSCEIVER |
REGISTERED BUS TRANSCEIVER |
位数 |
8 |
8 |
8 |
8 |
8 |
8 |
功能数量 |
2 |
2 |
2 |
2 |
2 |
2 |
端口数量 |
2 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
56 |
56 |
56 |
56 |
56 |
56 |
最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
最低工作温度 |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
输出特性 |
3-STATE WITH SERIES RESISTOR |
3-STATE WITH SERIES RESISTOR |
3-STATE WITH SERIES RESISTOR |
3-STATE WITH SERIES RESISTOR |
3-STATE WITH SERIES RESISTOR |
3-STATE WITH SERIES RESISTOR |
输出极性 |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
封装主体材料 |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
封装代码 |
DFP |
DFP |
DFP |
DFP |
DFP |
DFP |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
FLATPACK |
FLATPACK |
FLATPACK |
FLATPACK |
FLATPACK |
FLATPACK |
传播延迟(tpd) |
8 ns |
7.3 ns |
11 ns |
11 ns |
7.3 ns |
8 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
筛选级别 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
座面最大高度 |
2.413 mm |
2.413 mm |
2.413 mm |
2.413 mm |
2.413 mm |
2.413 mm |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
端子面层 |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
端子形式 |
FLAT |
FLAT |
FLAT |
FLAT |
FLAT |
FLAT |
端子节距 |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
宽度 |
9.652 mm |
9.652 mm |
9.652 mm |
9.652 mm |
9.652 mm |
9.652 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
厂商名称 |
IDT (Integrated Device Technology) |
- |
- |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |