型号 | 5962-9951401QXX | 5962-9951401QXA | 5962-9951401QXB | 5962-9951401QYB |
---|---|---|---|---|
描述 | Configuration Memory | Configuration Memory, 1MX1, PDSO20, PLASTIC, SOIC-20 | Configuration Memory, 1MX1, PDSO20, PLASTIC, SOIC-20 | Configuration Memory, 1MX1, Serial, CMOS, CQCC44, CERAMIC, LCC-44 |
包装说明 | , | SOP, | SOP, | QCCJ, |
Reach Compliance Code | unknown | compliant | compliant | compliant |
内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Base Number Matches | 1 | 1 | - | 1 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
零件包装代码 | - | SOIC | SOIC | LCC |
针数 | - | 20 | 20 | 44 |
ECCN代码 | - | EAR99 | 3A001.A.2.C | EAR99 |
JESD-30 代码 | - | R-PDSO-G20 | R-PDSO-G20 | S-GQCC-J44 |
JESD-609代码 | - | e0 | e0 | e0 |
长度 | - | 12.8 mm | 12.8 mm | 16.51 mm |
内存密度 | - | 1048576 bit | 1048576 bit | 1048576 bit |
内存宽度 | - | 1 | 1 | 1 |
功能数量 | - | 1 | 1 | 1 |
端子数量 | - | 20 | 20 | 44 |
字数 | - | 1048576 words | 1048576 words | 1048576 words |
字数代码 | - | 1000000 | 1000000 | 1000000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | -55 °C |
组织 | - | 1MX1 | 1MX1 | 1MX1 |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | - | SOP | SOP | QCCJ |
封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
筛选级别 | - | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q |
座面最大高度 | - | 2.65 mm | 2.65 mm | 4.826 mm |
最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | YES | YES | YES |
温度等级 | - | MILITARY | MILITARY | MILITARY |
端子面层 | - | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | - | GULL WING | GULL WING | J BEND |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL | QUAD |
宽度 | - | 7.5 mm | 7.5 mm | 16.51 mm |