型号
- 型号
- 关键词
| 型号 | 71P71804S200BQ | 71P71804S167BQ | 71P71804S167BQG | 71P71604S167BQ | 71P71804S250BQ | 71P71804S250BQG | 71P71804S200BQG | 71P71604S250BQ | 71P71604S200BQ |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | CABGA-165, Tray | CABGA-165, Tray | CABGA-165, Tray | CABGA-165, Tray | CABGA-165, Tray | CABGA-165, Tray | CABGA-165, Tray | CABGA-165, Tray | CABGA-165, Tray |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
| 零件包装代码 | CABGA | CABGA | CABGA | CABGA | CABGA | CABGA | CABGA | CABGA | CABGA |
| 包装说明 | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1 MM PITCH, GREEN, FBGA-165 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | 13 X 15 MM, 1 MM PITCH, GREEN, FBGA-165 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 |
| 针数 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
| 制造商包装代码 | BQ165 | BQ165 | BQG165 | BQ165 | BQ165 | BQG165 | BQG165 | BQ165 | BQ165 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | not_compliant | unknown | unknown | not_compliant | not_compliant |
| ECCN代码 | 3A991 | 3A991 | 3A991 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991 | 3A991.B.2.A | 3A991.B.2.A |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) |
| 最长访问时间 | 0.45 ns | 0.5 ns | 0.5 ns | 0.5 ns | - | 0.5 ns | 0.5 ns | - | 0.45 ns |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | - | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | - | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 200 MHz | 167 MHz | 167 MHz | 167 MHz | - | 250 MHz | 200 MHz | - | 200 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | - | COMMON | COMMON | - | COMMON |
| JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | - | R-PBGA-B165 | R-PBGA-B165 | - | R-PBGA-B165 |
| JESD-609代码 | e0 | e0 | e1 | e0 | - | e1 | e1 | - | e0 |
| 长度 | 15 mm | 15 mm | 15 mm | 15 mm | - | 15 mm | 15 mm | - | 15 mm |
| 内存密度 | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | - | 18874368 bit | 18874368 bit | - | 18874368 bit |
| 内存集成电路类型 | DDR SRAM | DDR SRAM | DDR SRAM | DDR SRAM | - | DDR SRAM | DDR SRAM | - | DDR SRAM |
| 内存宽度 | 18 | 18 | 18 | 36 | - | 18 | 18 | - | 36 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | - | 3 | 3 | - | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | 165 | 165 | 165 | 165 | - | 165 | 165 | - | 165 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 524288 words | - | 1048576 words | 1048576 words | - | 524288 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 512000 | - | 1000000 | 1000000 | - | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | - | 70 °C |
| 组织 | 1MX18 | 1MX18 | 1MX18 | 512KX36 | - | 1MX18 | 1MX18 | - | 512KX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TBGA | TBGA | TBGA | TBGA | - | TBGA | TBGA | - | TBGA |
| 封装等效代码 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | - | BGA165,11X15,40 | BGA165,11X15,40 | - | BGA165,11X15,40 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | - | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | - | GRID ARRAY, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL |
| 峰值回流温度（摄氏度） | 225 | 225 | 260 | 225 | - | 260 | 260 | - | 225 |
| 电源 | 1.5/1.8,1.8 V | 1.5/1.8,1.8 V | 1.5/1.8,1.8 V | 1.5/1.8,1.8 V | - | 1.5/1.8,1.8 V | 1.5/1.8,1.8 V | - | 1.5/1.8,1.8 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | 1.2 mm | - | 1.2 mm |
| 最大待机电流 | 0.3 A | 0.275 A | 0.275 A | 0.275 A | - | 0.325 A | 0.3 A | - | 0.3 A |
| 最小待机电流 | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V | - | 1.7 V |
| 最大压摆率 | 0.55 mA | 0.475 mA | 0.65 mA | 0.6 mA | - | 0.85 mA | 0.75 mA | - | 0.7 mA |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | - | 1.9 V | 1.9 V | - | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V | - | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | - | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | - | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn63Pb37) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL | BALL | BALL | BALL | - | BALL | BALL | - | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | - | 1 mm | 1 mm | - | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | - | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 | 20 | NOT SPECIFIED | 20 | - | NOT SPECIFIED | NOT SPECIFIED | - | 20 |
| 宽度 | 13 mm | 13 mm | 13 mm | 13 mm | - | 13 mm | 13 mm | - | 13 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |