型号
- 型号
- 关键词
Video Amplifier, 1 Channel(s), Bipolar, CDFP10, HERMETIC SEALED, FP-10
厂商名称：AMD(超微)
厂商官网：http://www.amd.com
下载文档| 型号 | 733FM | AM733DM | AM733FM | 733DM | 733DC | 733HC | 733HM | 733XC | 733XM |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Video Amplifier, 1 Channel(s), Bipolar, CDFP10, HERMETIC SEALED, FP-10 | Video Amplifier, 1 Channel(s), 1 Func, CDIP14, HERMETIC SEALED, DIP-14 | Video Amplifier, 1 Channel(s), 1 Func, CDFP10, HERMETIC SEALED, FP-10 | Video Amplifier, 1 Channel(s), Bipolar, CDIP14, HERMETIC SEALED, DIP-14 | Video Amplifier, 1 Channel(s), Bipolar, CDIP14, HERMETIC SEALED, DIP-14 | Video Amplifier, 1 Channel(s), Bipolar, MBCY8, METAL CAN, TO-99, 10 PIN | Video Amplifier, 1 Channel(s), Bipolar, MBCY8, METAL CAN, TO-99, 10 PIN | Video Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10 | Video Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10 |
| 零件包装代码 | DFP | DIP | DFP | DIP | DIP | TO-99 | TO-99 | DIE | DIE |
| 包装说明 | DFP, FL10,.3 | HERMETIC SEALED, DIP-14 | HERMETIC SEALED, FP-10 | DIP, DIP14,.3 | DIP, DIP14,.3 | TO-99, CAN10,.23 | TO-99, CAN10,.23 | DIE, DIE OR CHIP | DIE, DIE OR CHIP |
| 针数 | 10 | 14 | 10 | 14 | 14 | 8 | 8 | 10 | 10 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 标称带宽 | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz |
| 商用集成电路类型 | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER |
| 增益 | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB |
| JESD-30 代码 | R-CDFP-F10 | R-CDIP-T14 | R-CDFP-F10 | R-CDIP-T14 | R-CDIP-T14 | O-MBCY-W8 | O-MBCY-W8 | S-XUUC-N10 | S-XUUC-N10 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 14 | 10 | 14 | 14 | 8 | 8 | 10 | 10 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C | - | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | METAL | METAL | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DFP | DIP | DFP | DIP | DIP | TO-99 | TO-99 | DIE | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | ROUND | SQUARE | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | CYLINDRICAL | CYLINDRICAL | UNCASED CHIP | UNCASED CHIP |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 表面贴装 | YES | NO | YES | NO | NO | NO | NO | YES | YES |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | WIRE | WIRE | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | UPPER | UPPER |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 | e0 | - | - |
| 长度 | 6.477 mm | 19.431 mm | 6.477 mm | 19.431 mm | 19.431 mm | - | - | - | - |
| 封装等效代码 | FL10,.3 | - | - | DIP14,.3 | DIP14,.3 | CAN10,.23 | CAN10,.23 | DIE OR CHIP | DIE OR CHIP |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | +-6 V | - | - | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V |
| 座面最大高度 | 2.032 mm | 5.08 mm | 2.032 mm | 5.08 mm | 5.08 mm | - | - | - | - |
| 最大压摆率 | 27 mA | - | - | 27 mA | 27 mA | 27 mA | 27 mA | 27 mA | 27 mA |
| 技术 | BIPOLAR | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 6.35 mm | 7.62 mm | 6.35 mm | 7.62 mm | 7.62 mm | - | - | - | - |
| 厂商名称 | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
