型号
- 型号
- 关键词
| 型号 | 74CBTLV3251DBQRG4 | SN74CBTLV3251D | SN74CBTLV3251RGYR | SN74CBTLV3251PWR | SN74CBTLV3251DR | SN74CBTLV3251DGVR | SN74CBTLV3251DBQR | 74CBTLV3251PWRG4 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-SSOP -40 to 85 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-SOIC -40 to 85 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-VQFN -40 to 85 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-TSSOP -40 to 85 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-SOIC -40 to 85 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-TVSOP -40 to 85 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-SSOP -40 to 85 | Low-Voltage 1-Of-8 FET Multiplexer/Demultiplexer 16-TSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | QFN | TSSOP | SOIC | SOIC | SOIC | TSSOP |
| 包装说明 | SSOP, SSOP16,.25 | SOIC-16 | QFN-16 | TSSOP, TSSOP16,.25 | SOIC-16 | TSSOP, TSSOP16,.25,16 | SSOP, SSOP16,.25 | TSSOP, TSSOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compli | compliant | compliant | compli | compliant |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| Factory Lead Time | 6 weeks | 1 week | 1 week | 6 weeks | 1 week | 1 week | 6 weeks | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 系列 | - | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | - |
| JESD-30 代码 | - | R-PDSO-G16 | R-PQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | - | 9.9 mm | 4 mm | 5 mm | 9.9 mm | 3.6 mm | 4.9 mm | - |
| 逻辑集成电路类型 | - | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | - |
| 湿度敏感等级 | - | 1 | 2 | 1 | 1 | 1 | 2 | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 输入次数 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 输出次数 | - | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 端子数量 | - | 16 | 16 | 16 | 16 | 16 | 16 | - |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | SOP | HVQCCN | TSSOP | SOP | TSSOP | SSOP | - |
| 封装等效代码 | - | SOP16,.25 | LCC16/20,.14X.16,20 | TSSOP16,.25 | SOP16,.25 | TSSOP16,.25,16 | SSOP16,.25 | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - |
| 包装方法 | - | TUBE | TR | TR | TR | TR | TR | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - |
| 最大电源电流（ICC） | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | - |
| 传播延迟（tpd） | - | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 1.75 mm | 1 mm | 1.2 mm | 1.75 mm | 1.2 mm | 1.75 mm | - |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - |
| 标称供电电压 (Vsup) | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | - | 1.27 mm | 0.5 mm | 0.65 mm | 1.27 mm | 0.4 mm | 0.64 mm | - |
| 端子位置 | - | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 3.91 mm | 3.5 mm | 4.4 mm | 3.91 mm | 4.4 mm | 3.9 mm | - |
