型号
- 型号
- 关键词
IC 64 X 5 OTHER FIFO, 108 ns, PDSO20, PLASTIC, SO-20, FIFO
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | 74HCT7404D | 74HCT7404D-T | 74HC7404D-T | 74HCT7404N | 74HC7404N | 74HC7404D |
|---|---|---|---|---|---|---|
| 描述 | IC 64 X 5 OTHER FIFO, 108 ns, PDSO20, PLASTIC, SO-20, FIFO | IC 64 X 5 OTHER FIFO, 108 ns, PDSO20, FIFO | IC 64 X 5 OTHER FIFO, 98 ns, PDSO20, FIFO | IC 64 X 5 OTHER FIFO, 108 ns, PDIP18, PLASTIC, DIP-18, FIFO | IC 64 X 5 OTHER FIFO, 98 ns, PDIP18, PLASTIC, DIP-18, FIFO | IC 64 X 5 OTHER FIFO, 98 ns, PDSO20, PLASTIC, SO-20, FIFO |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | SOP, SOP20,.4 | SOP, | SOP, | DIP, DIP18,.3 | DIP, DIP18,.3 | SOP, SOP20,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 108 ns | 108 ns | 98 ns | 108 ns | 98 ns | 98 ns |
| 其他特性 | REGISTER BASED; BUBBLE BACK 2.7US | REGISTER BASED; BUBBLE BACK 2.7US | REGISTER BASED; BUBBLE BACK 2.7US | REGISTER BASED; BUBBLE BACK 2.7US | REGISTER BASED; BUBBLE BACK 2.7US | REGISTER BASED; BUBBLE BACK 2.7US |
| 周期时间 | 83.33 ns | 83.33 ns | 83.33 ns | 83.33 ns | 83.33 ns | 83.33 ns |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T18 | R-PDIP-T18 | R-PDSO-G20 |
| 内存密度 | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit |
| 内存宽度 | 5 | 5 | 5 | 5 | 5 | 5 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 18 | 18 | 20 |
| 字数 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
| 字数代码 | 64 | 64 | 64 | 64 | 64 | 64 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 6 V | 5.5 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 4.5 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | - | - | DIP | DIP | SOIC |
| 针数 | 20 | - | - | 18 | 18 | 20 |
| 最大时钟频率 (fCLK) | 12 MHz | - | - | 12 MHz | 12 MHz | 12 MHz |
| 内存集成电路类型 | OTHER FIFO | - | - | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 封装等效代码 | SOP20,.4 | - | - | DIP18,.3 | DIP18,.3 | SOP20,.4 |
| 电源 | 5 V | - | - | 5 V | 2/6 V | 2/6 V |
| 最大压摆率 | 0.001 mA | - | - | 0.001 mA | 0.001 mA | 0.001 mA |
| 端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
