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74HCT74BQ

HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14
HCT系列, 双正边沿D触发器, 互补输出, PDIP14

器件类别:逻辑    逻辑   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
QFN
包装说明
HVQCCN, LCC14,.1X.12,20
针数
14
Reach Compliance Code
compli
系列
HCT
JESD-30 代码
R-PQCC-N14
JESD-609代码
e4
长度
3 mm
负载电容(CL)
50 pF
逻辑集成电路类型
D FLIP-FLOP
最大频率@ Nom-Su
18000000 Hz
最大I(ol)
0.004 A
湿度敏感等级
1
位数
1
功能数量
2
端子数量
14
最高工作温度
125 °C
最低工作温度
-40 °C
输出极性
COMPLEMENTARY
封装主体材料
PLASTIC/EPOXY
封装代码
HVQCCN
封装等效代码
LCC14,.1X.12,20
封装形状
RECTANGULAR
封装形式
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法
TAPE AND REEL
峰值回流温度(摄氏度)
260
电源
5 V
传播延迟(tpd)
53 ns
认证状态
Not Qualified
座面最大高度
1 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
NICKEL PALLADIUM GOLD
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
30
触发器类型
POSITIVE EDGE
宽度
2.5 mm
最小 fmax
18 MHz
文档预览
74HC74; 74HCT74
Dual D-type flip-flop with set and reset; positive edge-trigger
Rev. 4 — 27 August 2012
Product data sheet
1. General description
The 74HC74 and 74HCT74 are dual positive edge triggered D-type flip-flop. They have
individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary
nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time
requirements on the LOW-to-HIGH clock transition, is stored in the flip-flop and appears at
the nQ output. Schmitt-trigger action in the clock input, makes the circuit highly tolerant to
slower clock rise and fall times. Inputs include clamp diodes that enable the use of current
limiting resistors to interface inputs to voltages in excess of V
CC
.
2. Features and benefits
Input levels:
For 74HC74: CMOS level
For 74HCT74: TTL level
Symmetrical output impedance
Low power dissipation
High noise immunity
Balanced propagation delays
Specified in compliance with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC74N
74HCT74N
74HC74D
74HCT74D
74HC74DB
74HCT74DB
40 C
to +125
C
SSOP14
40 C
to +125
C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
plastic shrink small outline package; 14 leads; body
width 5.3 mm
SOT108-1
SOT337-1
40 C
to +125
C
Name
DIP14
Description
plastic dual in-line package; 14 leads (300 mil)
Version
SOT27-1
Type number
NXP Semiconductors
74HC74; 74HCT74
Dual D-type flip-flop with set and reset; positive edge-trigger
Table 1.
Ordering information
…continued
Package
Temperature range
Name
TSSOP14
DHVQFN14
Description
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT402-1
40 C
to +125
C
40 C
to +125
C
Type number
74HC74PW
74HCT74PW
74HC74BQ
74HCT74BQ
plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm
4. Functional diagram
1SD
SD
D
CP
FF
Q
4 10
1SD 2SD
2
12
3
11
1D
D
2D
1CP
CP
2CP
SD
Q
1Q
2Q
5
9
4
3
2
1
S
C1
1D
R
12
S
C1
1D
R
mna419
4
2
3
1D
1CP
Q
1Q
5
1Q
6
RD
5
1
6
10
1RD
2SD
SD
D
CP
FF
8
RD
13
2RD
mna420
2D
2CP
FF
Q
10
1Q
2Q
6
8
11
12
13
mna418
Q
2Q
9
9
11
RD
1RD 2RD
1 13
Q
2Q
8
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Functional diagram
Q
C
C
C
C
D
C
RD
C
C
Q
C
SD
mna421
CP
C
C
Fig 4.
Logic diagram for one flip-flop
74HC_HCT74
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 August 2012
2 of 21
NXP Semiconductors
74HC74; 74HCT74
Dual D-type flip-flop with set and reset; positive edge-trigger
5. Pinning information
5.1 Pinning
+&
+&7
5'






*1'
4

*1'



+&
+&7
5'
'
&3
6'
4
4
*1'







DDD
WHUPLQDO 
LQGH[ DUHD
'
 9
&&
 5'
 '
 &3
 6'

4
 9
&&
 5'
 '
 &3
 6'


4
4
&3
6'
4
4
DDD
7UDQVSDUHQW WRS YLHZ
(1) This is not a supply pin. The substrate is attached to
this pad using conductive die attach material. There
is no electrical or mechanical requirement to solder
this pad. However, if it is soldered, the solder land
should remain floating or be connected to GND.
Fig 5.
Pin configuration for DIP14, SO14 and (T)SSOP14
Fig 6.
Pin configuration for DHVQFN14
5.2 Pin description
Table 2.
Symbol
1RD
1D
1CP
1SD
1Q
1Q
GND
2Q
2Q
2SD
2CP
2D
2RD
V
CC
Pin description
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Description
asynchronous reset-direct input (active LOW)
data input
clock input (LOW-to-HIGH, edge-triggered)
asynchronous set-direct input (active LOW)
output
complement output
ground (0 V)
complement output
output
asynchronous set-direct input (active LOW)
clock input (LOW-to-HIGH, edge-triggered)
data input
asynchronous reset-direct input (active LOW)
supply voltage
74HC_HCT74
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 August 2012
3 of 21
NXP Semiconductors
74HC74; 74HCT74
Dual D-type flip-flop with set and reset; positive edge-trigger
6. Functional description
Table 3.
Input
nSD
L
H
L
[1]
Function table
[1]
Output
nRD
H
L
L
nCP
X
X
X
nD
X
X
X
nQ
H
L
H
nQ
L
H
H
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
Table 4.
Input
nSD
H
H
[1]
Function table
[1]
Output
nRD
H
H
nCP
nD
L
H
nQ
n+1
L
H
nQ
n+1
H
L
H = HIGH voltage level; L = LOW voltage level;
= LOW-to-HIGH transition; Q
n+1
= state after the next LOW-to-HIGH CP transition;
X = don’t care.
7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
I
IK
I
OK
I
O
I
CC
I
GND
T
stg
P
tot
Parameter
supply voltage
input clamping current
output clamping current
output current
supply current
ground current
storage temperature
total power dissipation
DIP14 package
SO14, (T)SSOP14 and DHVQFN14
packages
[1]
For DIP14 package: P
tot
derates linearly with 12 mW/K above 70
C.
For SO14 package: P
tot
derates linearly with 8 mW/K above 70
C.
For (T)SSOP14 packages: P
tot
derates linearly with 5.5 mW/K above 60
C.
For DHVQFN14 packages: P
tot
derates linearly with 4.5 mW/K above 60
C.
[1]
[1]
Conditions
V
I
<
0.5
V or V
I
> V
CC
+ 0.5 V
V
O
<
0.5
V or V
O
> V
CC
+ 0.5 V
V
O
=
0.5
V to (V
CC
+ 0.5 V)
Min
0.5
-
-
-
-
100
65
-
-
Max
+7
20
20
25
+100
-
+150
750
500
Unit
V
mA
mA
mA
mA
mA
C
mW
mW
74HC_HCT74
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 August 2012
4 of 21
NXP Semiconductors
74HC74; 74HCT74
Dual D-type flip-flop with set and reset; positive edge-trigger
8. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter
V
CC
V
I
V
O
T
amb
t/V
supply voltage
input voltage
output voltage
ambient temperature
input transition rise and fall rate
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
Conditions
Min
2.0
0
0
40
-
-
-
74HC74
Typ
5.0
-
-
+25
-
1.67
-
Max
6.0
V
CC
V
CC
+125
625
139
83
Min
4.5
0
0
40
-
-
-
74HCT74
Typ
5.0
-
-
+25
-
1.67
-
Max
5.5
V
CC
V
CC
+125
-
139
-
V
V
V
C
ns/V
ns/V
ns/V
Unit
9. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
74HC74
V
IH
HIGH-level
input voltage
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
V
IL
LOW-level
input voltage
V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
V
OH
HIGH-level
output voltage
V
I
= V
IH
or V
IL
I
O
=
4.0
mA; V
CC
= 4.5 V
I
O
=
5.2
mA; V
CC
= 6.0 V
V
OL
LOW-level
output voltage
V
I
= V
IH
or V
IL
I
O
= 4.0 mA; V
CC
= 4.5 V
I
O
= 5.2 mA; V
CC
= 6.0 V
I
I
I
CC
C
I
74HCT74
V
IH
V
IL
HIGH-level
input voltage
LOW-level
input voltage
V
CC
= 4.5 V to 5.5 V
V
CC
= 4.5 V to 5.5 V
2.0
-
1.6
1.2
-
0.8
2.0
-
-
0.8
V
V
input leakage
current
supply current
input
capacitance
V
I
= V
CC
or GND;
V
CC
= 6.0 V
V
I
= V
CC
or GND; I
O
= 0 A;
V
CC
= 6.0 V
-
-
-
-
0.15
0.16
-
-
3.5
0.33
0.33
1.0
40
-
-
-
-
0.4
0.4
1.0
80
V
V
A
A
pF
3.84
5.34
4.32
5.81
-
-
3.7
5.2
-
-
V
V
1.5
3.15
4.2
-
-
-
1.2
2.4
3.2
0.8
2.1
2.8
-
-
-
0.5
1.35
1.8
1.5
3.15
4.2
-
-
-
-
-
-
0.5
1.35
1.8
V
V
V
V
V
V
Conditions
T
amb
=
40 C
to +85
C
Min
Typ
[1]
Max
T
amb
=
40 C
to +125
C
Min
Max
Unit
74HC_HCT74
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 27 August 2012
5 of 21
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参数对比
与74HCT74BQ相近的元器件有:74HCT74、74HCT74N、74HC74、74HC74N。描述及对比如下:
型号 74HCT74BQ 74HCT74 74HCT74N 74HC74 74HC74N
描述 HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14 HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14
系列 HCT HCT HCT HCT HC/UH
位数 1 1 1 1 1
功能数量 2 2 2 2 2
端子数量 14 14 14 14 14
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子位置 QUAD DUAL DUAL DUAL DUAL
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
是否无铅 不含铅 - 不含铅 - 不含铅
是否Rohs认证 符合 - 符合 - 符合
厂商名称 NXP(恩智浦) - NXP(恩智浦) - NXP(恩智浦)
零件包装代码 QFN - MO-001 - MO-001
包装说明 HVQCCN, LCC14,.1X.12,20 - 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14 - 0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14
针数 14 - 14 - 14
Reach Compliance Code compli - unknow - unknow
JESD-30 代码 R-PQCC-N14 - R-PDIP-T14 - R-PDIP-T14
长度 3 mm - 19.025 mm - 19.025 mm
负载电容(CL) 50 pF - 50 pF - 50 pF
逻辑集成电路类型 D FLIP-FLOP - D FLIP-FLOP - D FLIP-FLOP
最大频率@ Nom-Su 18000000 Hz - 18000000 Hz - 20000000 Hz
最大I(ol) 0.004 A - 0.004 A - 0.004 A
最高工作温度 125 °C - 125 °C - 125 °C
最低工作温度 -40 °C - -40 °C - -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 HVQCCN - DIP - DIP
封装等效代码 LCC14,.1X.12,20 - DIP14,.3 - DIP14,.3
封装形状 RECTANGULAR - RECTANGULAR - RECTANGULAR
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - IN-LINE - IN-LINE
包装方法 TAPE AND REEL - TUBE - TUBE
峰值回流温度(摄氏度) 260 - NOT SPECIFIED - NOT SPECIFIED
电源 5 V - 5 V - 2/6 V
传播延迟(tpd) 53 ns - 53 ns - 265 ns
认证状态 Not Qualified - Not Qualified - Not Qualified
座面最大高度 1 mm - 4.2 mm - 4.2 mm
最大供电电压 (Vsup) 5.5 V - 5.5 V - 6 V
最小供电电压 (Vsup) 4.5 V - 4.5 V - 2 V
标称供电电压 (Vsup) 5 V - 5 V - 5 V
表面贴装 YES - NO - NO
技术 CMOS - CMOS - CMOS
端子面层 NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD - NICKEL/PALLADIUM/GOLD (NI/PD/AU)
端子节距 0.5 mm - 2.54 mm - 2.54 mm
处于峰值回流温度下的最长时间 30 - NOT SPECIFIED - NOT SPECIFIED
宽度 2.5 mm - 7.62 mm - 7.62 mm
最小 fmax 18 MHz - 18 MHz - 24 MHz
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