LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PQCC20
LVC/LCX/Z 系列, 8位 驱动, 实输出, PQCC20
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
器件标准:
下载文档型号 | 74LVC573ABQ,115 | 74LVC573AD,118 | 74LVC573ADB,118 | 74LVC573APW,118 |
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描述 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PQCC20 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 |
Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconductor |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | QFN | SOP | SSOP2 | TSSOP2 |
包装说明 | HVQCCN, LCC20,.1X.18,20 | 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 | SSOP, SSOP20,.3 | 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 |
针数 | 20 | 20 | 20 | 20 |
制造商包装代码 | SOT764-1 | SOT163-1 | SOT339-1 | SOT360-1 |
Reach Compliance Code | compli | compli | compli | compliant |
系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 4.5 mm | 12.8 mm | 7.2 mm | 6.5 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
湿度敏感等级 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | SOP | SSOP | TSSOP |
封装等效代码 | LCC20,.1X.18,20 | SOP20,.4 | SSOP20,.3 | TSSOP20,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
传播延迟(tpd) | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 2.65 mm | 2 mm | 1.1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
标称供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
宽度 | 2.5 mm | 7.5 mm | 5.3 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
Prop。Delay @ Nom-Su | 8 ns | 8 ns | 8 ns | - |
其他特性 | - | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 |