型号
- 型号
- 关键词
Flip Flops 9BIT BUS INTERFACE REG 3-ST
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
器件标准：
| 型号 | 74LVC823ADB | 74LVC823AD-T | 74LVC823APW | 74LVC823APW-T | 74LVC823AD |
|---|---|---|---|---|---|
| 描述 | Flip Flops 9BIT BUS INTERFACE REG 3-ST | Flip Flops 9BIT BUS INTERFACE REG 3-ST | Flip Flops 9BIT BUS INTERFACE REG 3-ST | Flip Flops 9BIT BUS INTERFACE REG 3-ST | Flip Flops 9BIT BUS INTERFACE REG 3-ST |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SSOP | SOIC | TSSOP | TSSOP | SOIC |
| 包装说明 | SSOP, SSOP24,.3 | 7.50 MM, PLASTIC, MS-013, SOT-371-1, SO-24 | TSSOP, TSSOP24,.25 | 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24 | 7.50 MM, PLASTIC, MS-013, SOT-371-1, SO-24 |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown |
| 其他特性 | WITH CLEAR AND CLOCK ENABLE | WITH CLEAR AND CLOCK ENABLE | WITH CLEAR AND CLOCK ENABLE | WITH CLEAR AND CLOCK ENABLE | WITH CLEAR AND CLOCK ENABLE |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 8.2 mm | 15.4 mm | 7.8 mm | 7.8 mm | 15.4 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SOP | TSSOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 11.5 ns | 11.5 ns | 11.5 ns | 11.5 ns | 11.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 2.65 mm | 1.1 mm | 1.1 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 5.3 mm | 7.5 mm | 4.4 mm | 4.4 mm | 7.5 mm |
| 最大频率@ Nom-Sup | 150000000 Hz | - | 150000000 Hz | - | 150000000 Hz |
| 最大I（ol） | 0.024 A | - | 0.024 A | - | 0.024 A |
| 封装等效代码 | SSOP24,.3 | - | TSSOP24,.25 | - | SOP24,.4 |
| 电源 | 3.3 V | - | 3.3 V | - | 3.3 V |
| Prop。Delay @ Nom-Sup | 10 ns | - | 10 ns | - | 10 ns |
| 触发器类型 | POSITIVE EDGE | - | POSITIVE EDGE | - | POSITIVE EDGE |
