REVISIONS
LTR
A
B
C
DESCRIPTION
Change table I parameters V
OO
,
∆V
OO
/∆T, format change.
Add 2nd vendor.
Add vendors, FSCM 63071 and 64762. Remove vendor FSCM
27014. Page 5, figure 1, change terminal connection 9. Editorial
changes throughout.
Add vendor FSCM 27014. Page 4, table I, correct test condition for
V
OUT(2)
.
Convert to military drawing format. Add vendor CAGE 23223. Page
6, Table I, delete I
CC
minimum limit.
Add vendor CAGE 34031. Table I, change test condition R
L
and I
OUT
for R
OUT
test. Editorial changes throughout. Change drawing CAGE
to 67268.
Changed to reflect MIL-H-38534 processing. Remove vendor CAGE
63071. Editorial changes throughout.
Table I, changed SR test to +SR and -SR tests. Editorial changes
throughout. Remove CAGE numbers 29832 and 34031.
Changes in accordance with NOR 5962-R196-93.
Add vendor CAGE 51651 and method 1030 to paragraph 4.2.
Change figure 1, dimension A minimum. Rewrite entire document.
Remove CAGE codes 23223 and 64762. Change to table I.
Corrections to sheet 1. Update drawing boilerplate.
DATE (YR-MO-DA)
83-01-10
83-06-23
84-12-14
APPROVED
N. A. Hauck
N. A. Hauck
N. A. Hauck
D
E
F
85-12-05
87-11-23
89-01-11
N. A. Hauck
R. P. Evans
M. A. Frye
G
H
J
K
L
M
90-01-05
92-03-16
93-06-25
95-09-29
98-07-01
04-02-23
W. Heckman
Alan Barone
K. A. Cottongim
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
C. R. Jackson
CHECKED BY
William E. Shoup
M
1
M
2
M
3
M
4
M
5
M
6
M
7
M
8
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
COLUMBUS, OHIO 43216-5000
http://www.dscc.dla.mil
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
N. A. Hauck
MICROCIRCUIT, HYBRID, LINEAR, BUFFER
AMPLIFIER, THICK FILM
DRAWING APPROVAL DATE
80-12-22
REVISION LEVEL
M
SIZE
A
SHEET
CAGE CODE
14933
1 OF
8
80014
5962-E142-04
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with
MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
80014
Drawing number
01
Device type
(see 1.2.1)
X
Case outline
(see 1.2.2)
C
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
Generic number
0033, MSK 0033H
Circuit function
Voltage follower/buffer amplifier with FET input
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Z
Descriptive designator
See figure 1
Terminals
12
Package style
Can
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings.
Supply voltage range.................................................................
Input voltage range....................................................................
Storage temperature range .......................................................
Maximum power dissipation (P
D
)...............................................
Lead temperature (soldering, 10 seconds)................................
Junction temperature (T
J
) ..........................................................
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
)................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
-55°C to +125°C
±40
V dc maximum
±40
V dc
-65°C to +150°C
1.5 W 1/ 2/
+300°C
+175°C
1/
2/
No heat sink.
Derate 10 mW/°C above +25°C ambient.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
A
REVISION LEVEL
80014
SHEET
M
2
DSCC FORM 2234
APR 97
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-
PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device
manufacturer's Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and
inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the
manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not perform them.
However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
80014
SHEET
M
3
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
R
S
= 100 kΩ
Group A
subgroups
Device
type
Min
Limits
Max
±10
±20
Unit
Output offset voltage
V
OO
1
2,3
01
mV
Temperature coefficient of
V
OO
Voltage gain
%V
OO
/∆T
A
V
2/
1,2,3
01
250
µV/°C
V
IN
= V
RMS
, R
L
= 1 kΩ,
R
L
= 100 kΩ
R
L
= 1 kΩ
R
L
= 100Ω
T
A
= +25°C
1,2,3
01
0.97
1
V/V
Output voltage swing
Output voltage swing
Supply current
Input bias current
V
OUT(1)
V
OUT(2)
I
CC
I
IB
1,2,3
1,2,3
1
1
2,3
01
01
01
01
±12
±9
22
3/
10
V
V
mA
nA
Output impedance
R
OUT
V
IN
= 1 V
RMS
,
2/
100Ω
≤
R
L
≤
1 kΩ,
±1
mA
≤
I
oUT
≤ ±10
mA,
T
A
= +25°C
T
A
= +25°C 2/ 4/
V
IN
=
±10
V, R
S
= 50Ω,
R
L
= 1 kΩ 5/
V
IN
=
±10
V, R
S
= 50Ω,
R
L
= 1 kΩ 5/
V
IN
= 0, T
A
= +25°C 4/
4
01
10
Ω
Input impedance
Positive slew rate
R
IN
+SR
4
4
5,6
01
01
10
10
Ω
V/µs
1000
500
Negative slew rate
-SR
4,5,6
01
500
V/µs
Power consumption
1/
2/
3/
4/
5/
1
01
660
mW
V
C
+ = V+ = +15 V, V
C
- = V- = -15 V, unless otherwise specified.
Parameter shall be guaranteed to the limits specified in table I for all lots not specifically tested.
Normal limit is 2.5 nA. How ever, under pulse test conditions, limit is 0.25 nA.
Tested go/no-go only.
Subgroups 5 and 6 for (+SR) and subgroups 4, 5, and 6 for (-SR) shall be tested for initial device characterization
and after design or process changes that affect these parameters, therefore shall be guaranteed to the limits
specified in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
80014
SHEET
M
4
DSCC FORM 2234
APR 97
FIGURE 1. Case outline Z (12-lead can) and terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
80014
SHEET
M
5
DSCC FORM 2234
APR 97
PCB设计
