Technical Data Sheet
Black Epoxy, Encapsulating & Potting Compound
Description
832B
potting and encapsulating compound
is a black, general purpose, hard, two-part epoxy that offers
extreme environmental, mechanical and physical protection for printed circuit boards and electronic
assemblies.
Due to its low mixed viscosity, 832B can easily penetrate small gaps and cavities. It also provides excellent
electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock,
environmental humidity, salt water, fungus, and many harsh chemicals.
This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment.
832B can be cured at room temperature or higher.
832B
Features and Benefits
•
Convenient 2A:1B volume mix ratio
•
Low mixed viscosity of 3 300 cP
•
Extremely high compressive and tensile strength
•
Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and
many plastics
•
Excellent electrical insulating characteristics
•
Broad service temperature range -40 to 140 °C (-40 to 284 °F)
•
Extreme resistance to water and humidity (allows for submersion where needed)
•
Solvent-free
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 3.00
Page 1
832B
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life
Full cure @22 °C [72 °F]
Full cure @65 °C [149 °F]
Full cure @80 °C [176 °F]
Full cure @100 °C [212 °F]
Value
1h
5y
24 h
1h
To be determined
To be determined
Temperature Ranges
Properties
Constant service temperature
Maximum intermittent temperature
a)
Storage temperature of unmixed parts
Value
-40 to 140 °C [-40 to 284 °F]
175 °C [347 °F]
16 to 27 °C [61 to 81 °F]
a)
Temperature that can be withstood for short periods without sustaining damage.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 3.00
Page 2
832B
Cured Properties
Physical Properties
Color
Density @26 °C [79 °F]
Hardness
Tensile strength
Elongation %
Lap shear strength (SS 304)
Izod Impact @0.259"
Compressive strength
Flexural strength
Method
Visual
ASTM D 792
Shore D Durometer
ASTM D 638
ASTM D 638
ASTM D 1002
ASTM D 256
ASTM D 695
ASTM D 790
Value
a)
Black
1.11 g/mL
80D
57 N/mm
2
[8 250 lb/in
2
]
3.3%
4.2 N/mm
2
[606 lb/in
2
]
0.93 kJ/m
2
[0.44 ft·lb/in
2
]
155 N/mm
2
[22 400 lb/in
2
]
114 N/mm
2
[16 500 lb/in
2
]
Note: Specifications are for epoxy samples cured at 65 °C for 1 hour and conditioned at ambient
temperature and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 3.00
Page 3
832B
Cured Properties
Electrical Properties
Breakdown voltage @2.8 mm
Dielectric strength @2.8 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8"]
Volume resistivity @0.95"
Volume conductivity @0.95”
Dielectric dissipation, D @1 kHz
@10 kHz
@100 kHz
@1 MHz
Dielectric constant, k’ @1 kHz
@10 kHz
@100 kHz
@1 MHz
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
ASTM D 150-98
Value
51 900 V [51.9 kV]
472 V/mil [18.6 kV/mm]
55 300 V [55.3 kV]
442 V/mil [17.4 kV/mm]
5.3 x 10
12
Ω·cm
1.9 x 10
-13
S/cm
0.008
0.013
0.018
0.017
2.95
2.89
2.83
2.77
Note: Specifications are for epoxy samples cured at 65 °C for 1 hour and conditioned at ambient
temperature and humidity.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 3.00
Page 4
832B
Cured Properties
Thermal Properties
Glass transition temperature (T
g
)
CTE
a)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
@50 °C [122 °F]
@100 °C [212 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Heat Deflection Temperature (HDT)
b)
Method
ASTM D 3418
ASTM E 831
ASTM E 831
ASTM E 1461
ASTM E 1461
ASTM E 1461
ASTM E 1461
ASTM E 1461
ASTM D 648
Value
49 °C [120 °F]
79 ppm/°C [174 ppm/°F]
196 ppm/°C [385 ppm/°F]
0.26 W/(m·K)
0.26 W/(m·K)
0.30 W/(m·K)
0.11 mm
2
/s
2.2 J/(g·K)
47 °C [116 °F]
Note: Specifications are for epoxy samples cured at 65 °C for 1 hour and conditioned at ambient
temperature and humidity.
a)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
b)
HDT under 1820 kPa [264 lb/in
2
] load
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 13 February 2018 / Ver. 3.00
Page 5
DSP 与 ARM 处理器
