Technical Data Sheet
Black 1:1 Epoxy, Encapsulating & Potting Compound
Description
832HD
potting and encapsulating compound
is a general purpose, hard, black, two-part epoxy that offers
extreme environmental, mechanical and physical protection for printed circuit boards and electronic
assemblies.
Due to its low mixed viscosity, 832HD can easily penetrate small gaps and cavities. It also provides excellent
electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock,
environmental humidity, salt water, fungus, and many harsh chemicals.
This epoxy has a convenient 1:1 volume mix ratio, making it compatible with most dispensing equipment.
832HD can be cured at room temperature or higher.
832HD
Features and Benefits
•
Convenient 1A:1B volume mix ratio
•
Low mixed viscosity of 4 100 cP
•
Extremely high compressive and tensile strength
•
Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics,
and many plastics
•
Excellent electrical insulating characteristics
•
Broad service temperature range -40 to 150 °C (-40 to 302 °F)
•
Extreme resistance to water and humidity (allows for submersion where needed)
•
Solvent-free
ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 May 2019 / Ver. 2.01
Page 1
832HD
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life
Full cure @22 °C [72 °F]
Full cure @65 °C [149 °F]
Full cure @80 °C [176 °F]
Full cure @100 °C [212 °F]
Value
45 min
5y
24 h
2h
1h
20 min
Temperature Ranges
Properties
Constant service temperature
Intermittent temperature limit
a)
Storage temperature of unmixed parts
Value
-40 to 150 °C [-40 to 302 °F]
-50 to 175 °C [-58 to 347 °F]
16 to 27 °C [61 to 81 °F]
a)
Temperature range that can be withstood for short periods without sustaining damage.
ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 May 2019 / Ver. 2.01
Page 2
832HD
Cured Properties
Physical Properties
Color
Density @25 °C [77 °F]
Hardness
Tensile strength
Young’s Modulus
Compressive strength
Lap shear strength (stainless steel)
Lap shear strength (aluminum)
Lap shear strength (copper)
Lap shear strength (brass)
Lap shear strength (ABS)
Lap shear strength (polycarbonate)
Method
Visual
ASTM D 1475
Shore D Durometer
ASTM D 638
ASTM D 638
ASTM D 695
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
Value
a)
Black
1.07 g/mL
80D
32 N/mm
2
[4 600 lb/in
2
]
2 100 N/mm
2
[300 000 lb/in
2
]
75 N/mm
2
[11 000 lb/in
2
]
21 N/mm
2
[3 100 lb/in
2
]
14 N/mm
2
[2 000 lb/in
2
]
15 N/mm
2
[2 200 lb/in
2
]
11 N/mm
2
[1 600 lb/in
2
]
3.9 N/mm
2
[560 lb/in
2
]
2.1 N/mm
2
[300 lb/in
2
]
Note: Specifications are for epoxy samples cured at 80 °C for 1 h and conditioned at ambient temperature
and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 May 2019 / Ver. 2.01
Page 3
832HD
Cured Properties
Electrical Properties
Breakdown voltage @2.5 mm
Dielectric strength @2.5 mm
Breakdown voltage @3.175 mm [1/8"]
Dielectric strength @3.175 mm [1/8"]
Resistivity
Conductivity
Dielectric dissipation, D @1 MHz
Dielectric constant, k´ @1 MHz
Method
ASTM D 149
ASTM D 149
Reference fit
a)
Reference fit
a)
ASTM D 257
ASTM D 257
ASTM D 150-11
ASTM D 150-11
Value
41 700 V [41.7 kV]
400 V/mil [15.8 kV/mm]
45 700 V [45.7 kV]
365 V/mil [14.4 kV/mm]
1.4 x 10
13
Ω·cm
7.1 x 10
-14
S/cm
0.041
2.53
Thermal Properties
Glass transition temperature (T
g
)
CTE
b)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Method
ASTM D 3418
ASTM E 831
ASTM E 831
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1269 01
Value
41 °C [106 °F]
73 ppm/°C [41 ppm/°F]
207 ppm/°C [115 ppm/°F]
0.27 W/(m·K)
0.12 mm
2
/s
2.0 J/(g·K)
Note: Specifications are for epoxy samples cured at 80 °C for 1 h and conditioned at ambient temperature
and humidity.
a)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
b)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 May 2019 / Ver. 2.01
Page 4
832HD
Uncured Properties
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Mix ratio by volume
Mix ratio by weight
Mixture (A:B)
Black
4 100 cP [4.1 Pa·s]
a)
1.04 g/mL
1:1
1.22:1
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Odor
Part A
Black
5 900 cP [5.9 Pa·s]
a)
1.15 g/mL
Mild
Part B
Clear, amber
2 300 cP [2.3 Pa·s]
b)
0.95 g/mL
Ammonia-like
a)
Brookfield viscometer at 100 rpm with spindle LV S64
b)
Brookfield viscometer at 50 rpm with spindle LV S63
ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 06 May 2019 / Ver. 2.01
Page 5
