8331S Technical Data Sheet
Silver Conductive Epoxy Adhesive
Good Conductivity / Slow Cure
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
8331S
Description
This is a two-part, smooth, silver paste adhesive that cures to form a hard, durable polymer. In its cured
state, it is highly electrically and thermally conductive. It adheres strongly to metals and glass, and it
adheres well to most plastics used in electronic assemblies.
It has a convenient 1-to-1 mix ratio and a long 4 hour working time. The mixed adhesive essentially acts
like a one-part adhesive for the duration of a shift. But unlike one-part adhesives, it does not require high
curing temperatures or frozen storage, and it has a very long shelf life.
Applications & Usages
The 8331S is used as a solder replacement for bonding heat-sensitive electronic components and for
making conductive bonds where solder is not an option, such as when bonding to glass, soft metals. or
plastics. It allows for quick cold soldering repairs of electronic devices, makes excellent thermal
connections, provides excellent EMI/RFI shielding, and is very effective at filling in seams between metal
plates. It is useful in applications where the high cure temperatures of one-part epoxy systems can
potentially damage components.
Its primary applications are in assembly of electronic devices. It is used in the automobile, aerospace,
marine, communication, instrumentation, and industrial control equipment industries. It is also widely
used by hobbyists and makers.
Benefits and Features
•
•
•
•
•
•
•
•
•
Electrical resistivity: 0.0060 Ω·cm
Thermal conductivity: 0.85 W/(m·K)
1:1 mix ratio by volume
Working time of 4 hours
Cure time: 2 hours at 65 °C
Good adhesive strength
Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons
Room temperature storage
Shelf life greater than three years
ENVIRONMENT
✓
RoHS
✓
REACH compliant
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Rev. Date: 04 October 2017 / Ver. 2.07
8331S Technical Data Sheet
Silver Conductive Epoxy Adhesive
Good Conductivity / Slow Cure
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
8331S
Usage Parameters
Properties
Working Time
a)
Shelf Life
Full Cure @65 °C [149 °F]
Full Cure @80 °C [176 °F]
Full Cure @100 °C [212 °F]
Value
4h
≥3
y
2h
1h
40 min
Temperature Ranges
Properties
Constant Service
Temperature
Storage Temperature
of Unmixed Parts
Value
-40 to 150 °C
[-40 to 302 °F]
16 to 27 °C
[60 to 80 °F]
a) Cure and life values 5 g unless stated
otherwise.
Principal Components
Name
Part A: Epoxide Resin
Metallic Silver
Part B: Aliphatic Amines
Metallic Silver
CAS Number
28768-32-3
+ 17557-23-3
7440-22-4
68082-29-1, 112-24-3, 68541-13-9, 4246-51-9
7440-22-4
Properties of Cured 8331S
Physical Properties
Color
Density @25 °C [77 °C]
Hardness
Tensile Strength
Elongation
Young’s
Modulus
Lap Shear Strength (Stainless Steel 304)
Lap Shear Strength (Aluminum 5052)
Compressive Strength
Solderable
Outgassing (Total Mass Loss) @24 h
Water vapor release
Collectable Volatile Condensable Material
Water absorption
Method
Visual
ASTM D 1475
Shore D durometer
ASTM D 638
"
"
ASTM D 1002
ASTM D 1002
ASTM D 695
ASTM E 595
"
"
Value
a)
Silver Grey
2.19 g/mL
73D
14 N/mm
2
5.3%
760 MPa
1.1 N/mm
2
4.8 N/mm
2
65 N/mm
2
No
0.43%
0.27%
0.04%
0.12%
[2 000 lb/in
2
]
[160 lb/in
2
]
[690 lb/in
2
]
[9 400 lb/in
2
]
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Rev. Date: 04 October 2017 / Ver. 2.07
8331S Technical Data Sheet
Silver Conductive Epoxy Adhesive
Good Conductivity / Slow Cure
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
8331S
Value
0.0060 Ωcm
~0.35
Ω/sq
0.25–0.40
Ω/sq
0.15–0.20
Ω/sq
0.11–0.15
Ω/sq
Value
0.85 W/(mK)
0.83 W/(mK)
0.96 W/(mK)
34 °C [93 °F]
78 ppm/°C
158 ppm/°C
0.90
J/(g∙K)
Electrical Properties
b)
Volume Resistivity
After 65 °C [149 °F] cure
Surface Resistance
After 25 °C [149 °F] cure after 96 h
After 65 °C [149 °F] cure after 1 h
After 80 °C [176 °F] cure
After 100 °C [212 °F] cure
Thermal Properties
Thermal Conductivity @25 °C [77 °F]
Thermal Conductivity
@50 °C [122 °F]
Thermal Conductivity
@100 °C [212 °F]
Glass Transition Temperature (T
g
)
CTE
c)
prior T
g
CTE
c)
after T
g
Specific Heat @25 °C [77 °F]
Method
Method 5011.5
in MIL-STD-883H
Square
Square
Square
Square
Probe
Probe
Probe
Probe
Method
ASTM E 1461
"
"
ASTM D 3418
ASTM E 831
ASTM E 831
Note:
Specifications are for epoxy samples that were cured at 80 °C for 60 minutes. Additional curing time
at room temperature was given to allow for optimum curing. Samples were conditioned at 23 °C and
50% RH prior to most tests.
a) N/mm
2
= mPa; lb/in
2
= psi
b) The uncured epoxy mixture does not conduct electricity well and can have high resistance. To attain
stated resistivity, ensure that the mix ratio is followed and that the product is fully cured by heat
curing.
c) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
Properties of Uncured 8331S
Physical Properties
Color
Density
a)
Mix Ratio by volume (A:B)
Mix Ratio by weight (A:B)
Solids Content (w/w)
Mixture
Silver Grey
2.49 g/mL
1.0:1.0
1.17:1.0
100%
Physical Properties
Color
Density
Flash Point
Resistivity of uncured material
Part A
Silver Grey
2.55 g/mL
>127 °C [261 °F]
Off-scale (no reading)
Part B
Silver Grey
2.38 g/mL
>93 °C [200 °F]
Off-scale (no reading)
a) Calculated value based on measures densities of each part
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Rev. Date: 04 October 2017 / Ver. 2.07
8331S Technical Data Sheet
Silver Conductive Epoxy Adhesive
Good Conductivity / Slow Cure
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
8331S
Extrusion Rate
The extrusion rate for a ¼” nozzle for each adhesive parts with respect to pressure are given below. For
extrusion rates with respect to other nozzle diameters, contact us at
support@mgchemicals.com.
8331S Extrusion Rates for Part A and B
Pressure
lb/in
2
40
50
60
70
80
90
Rate Part A
g/min
521
628
731
832
931
1027
Rate Part B
g/min
44
86
128
170
211
223
Note:
Nozzle diameter = ¼"
Compatibility
Adhesion—As
seen in the substrate adhesion table, the 8331S epoxy adheres to most materials found on
printed circuit assemblies; however, it is not compatible with contaminants like water, oil, and greasy flux
residues that may affect adhesion. If contamination is present, clean the printed circuit assembly with
electronic cleaner such as MG Chemicals 4050 Safety Wash, 406B Super Wash, or 824 Isopropyl Alcohol.
Substrate Adhesion in Decreasing Order
Physical Properties
Steel
Aluminum
Fiberglass
Wood
Paper, Fiber
Glass
Rubber
Polycarbonate
Acrylic
Polypropylene
a)
a) Does not bond to polypropylene
Adhesion
Stronger
Weaker
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Rev. Date: 04 October 2017 / Ver. 2.07
8331S Technical Data Sheet
Silver Conductive Epoxy Adhesive
Good Conductivity / Slow Cure
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
8331S
Storage
Store between 22 and 27 °C [72 and 80 °F] in dry area away from sunlight. Prolonged storage or storage
at or near freezing temperatures can result in crystallization. If crystallization occurs, reconstitute the
component to its original state by temporarily warming it to 50 to 60 °C [122 to 140 °F]. To ensure full
homogeneity, stir thoroughly the warm component, reincorporating all settled material. Re-secure
container lid and let cool down before use.
Health, Safety, and Environmental Awareness
Please see the 8331S
Safety Data Sheet
(SDS) parts A and B for more details on transportation,
storage, handling and other security guidelines.
Health and Safety:
The 8331S parts can ignite if the liquid is both heated and exposed to flames or
sparks.
Wear safety glasses or goggles and disposable polyvinyl chloride, neoprene, or nitrile gloves while
handling liquids. Part B in particular causes skin burns and may cause sensitization if exposed over a long
period of time. The epoxy will not wash off once cured: wear protective work clothing. Wash hands
thoroughly after use or if skin contact occurs. Do not ingest.
Use in well-ventilated area since vapors may cause irritation of the respiratory tract and cause respiratory
sensitization in susceptible individuals. The cured epoxy resin presents no known hazard.
Part A
HMIS® RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
Part B
HMIS® RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
Approximate HMIS and NFPA Risk Ratings Legend:
0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe)
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Rev. Date: 04 October 2017 / Ver. 2.07
NFPA® 704 CODES
NFPA® 704 CODES
* 2
1
0
1
2
0
* 2
1
0
1
2
0
