Technical Data Sheet
One-part Epoxy, General Purpose Adhesive, High T
g
Description
9310 a is general purpose, one-part epoxy adhesive. It is smooth, thixotropic, self-leveling, and bonds
well to a wide variety of substances. It has an unlimited working life at room temperature and does not
require frozen storage.
This product is designed for use in electronic assembly operations. It does not require mixing and can be
readily used in manual, pneumatic and robotic dispensing processes.
9310 has been formulated to have a high T
g
. For a low T
g
, use 9300.
9310
Features and Benefits
• Minimum cure temperature of 100 °C [212 °F]
• Unlimited working life
• Shelf life: 2 years at room temperature
• Provides strong electrical insulation
• T
g
of 113 °C [235 °F]
• Strong resistance to humidity, salt water, acids, bases, and aliphatic hydrocarbons
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 1
9310
Usage Parameters
Properties
Working life @22 °C [72 °F]
Shelf life @22 °C [72 °F]
Full cure @22 °C [72 °F]
Full cure @100 °C [212 °F]
Full cure @120 °C [248 °F]
Value
Unlimited
2y
Heat cure only
30 min
10 min
Temperature Ranges
Properties
Constant service temperature
Storage temperature
Value
-55 to 140 °C [-67 to 284 °F]
-10 to 27 °C [14 to 81 °F]
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 2
9310
Cured Properties
Physical Properties
Color
Density @25 °C [77 °F]
Hardness
Tensile strength
Compressive strength
Lap shear strength (stainless steel)
Lap shear strength (aluminum)
Lap shear strength (copper)
Lap shear strength (brass)
Lap shear strength (polycarbonate)
Method
Visual
ASTM D 1475
Shore D Durometer
ASTM D 638
ASTM D 695
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
ASTM D 1002
Value
a)
Amber
1.13 g/mL
84D
9.4 N/mm
2
[1 360 lb/in
2
]
103 N/mm
2
[15 000 lb/in
2
]
8.5 N/mm
2
[1 200 lb/in
2
]
6.2 N/mm
2
[890 lb/in
2
]
7.8 N/mm
2
[1 100 lb/in
2
]
6.7 N/mm
2
[980 lb/in
2
]
0.9 N/mm
2
[136 lb/in
2
]
Electrical Properties
Breakdown voltage @4.9 mm
Dielectric strength @4.9 mm
Breakdown voltage @3.175 mm [1/8”]
Dielectric strength @3.175 mm [1/8”]
Volume resistivity
Volume conductivity
Method
ASTM D 149
ASTM D 149
Reference fit
b)
Reference fit
b)
ASTM D 257
ASTM D 257
Value
41 600 V [41.6 kV]
220 V/mil [8.6 kV/mm]
34 000 V [34 kV]
270 V/mil [10 kV/mm]
9.3 x 10
12
Ω·cm
1.1 x 10
-13
S/cm
Note: Specifications are for epoxy samples cured at 100 °C for 30 min and conditioned at ambient
temperature and humidity.
a)
N/mm
2
= mPa; lb/in
2
= psi
b)
To allow comparison between products, the dielectric strength was recalculated with the Tautscher
equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 3
9310
Cured Properties
Thermal Properties
Glass transition temperature (T
g
)
CTE
a)
prior T
g
after T
g
Thermal conductivity @25 °C [77 °F]
@50 °C [122 °F]
@100 °C [212 °F]
Thermal diffusivity @25 °C [77 °F]
Specific heat capacity @25 °C [77 °F]
Method
ASTM E 831
ASTM E 831
ASTM E 831
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
ASTM E 1461 92
Value
113 °C [235 °F]
56 ppm/°C [133 ppm/°F]
185 ppm/°C [365 ppm/°F]
0.24 W/(m·K)
0.26 W/(m·K)
0.29 W/(m·K)
0.2 mm
2
/s
1.4 J/(g·K)
Note: Specifications are for epoxy samples cured at 100 °C for 30 min and conditioned at ambient
temperature and humidity.
a)
Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10
-6
= unit/unit/°C × 10
-6
Uncured Properties
Physical Properties
Color
Viscosity @25 °C [77 °F]
Density
Method
Visual
IPC TM-650
Method 2.4.34.4
ASTM D 1475
Value
Amber
86 500 cP [86.5 Pa·s]
a)
1.15 g/mL
a)
Brookfield viscometer at 3 rpm with spindle RV S92
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 4
9310
Compatibility
Adhesion—9310
epoxy adheres to most
plastics and metals used to house printed
circuit assemblies; however, it is not compatible
with contaminants like water, oil, or greasy
flux residues that may affect adhesion. If
contamination is present, first clean the surface
to be coated with MG Chemicals 824 Isopropyl
Alcohol.
For substrates with weak adhesion strength,
surface preparation (such as sanding, or pre-
coating with a suitable primer) may improve
adhesion.
Chemical—The
cured epoxy adhesive is inert
under normal conditions. It can tolerate short-
term exposure to fuels or similar non-polar
organic solvents, but it may not be suitable for
prolonged exposure. Avoid using with strong
acids, strong bases, or strong oxidizers.
Application Instructions
For best results, follow the procedure below.
This product does not require mixing prior to
use, and can be applied with a spatula, trowel,
or automated dispensing machine.
Syringe or cartridge:
1.
For 10 mL size, twist and remove the cap from
the syringe. Do not discard the cap.
2.
For the 300 mL size, cut the end of the
cartridge tip.
a.
Screw the tip on the cartridge.
b.
Insert the cartridge in a caulking gun.
3.
Dispense the adhesive evenly to both surfaces.
4.
To stop the flow, pull back on the plunger.
5.
Clean nozzle to prevent contamination and
material buildup.
6.
Replace the cap on the cartridge or syringe.
Storage
Store between -10 and 27 °C [14 and 81 °F]
in a dry area, away from sunlight. Some of the
components are sensitive to air. To maximize
shelf life, always recap product firmly when not
in use.
Cure Instructions
Room temperature cure:
Do NOT cure at room temperature. This product
will only cure at elevated temperatures.
Heat cure:
• Put in oven at 100 °C [212 °F] for 30 min.
—OR—
• Put in oven at 120 °C [248 °F] for 10 min.
Health and Safety
Please see the 9310 Safety Data Sheet (SDS)
for further details on transportation, storage,
handling, safety guidelines, and regulatory
compliance.
ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008
Date: 20 March 2018 / Ver. 2.00
Page 5
