型号
- 型号
- 关键词
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC16, 8 X 8 MM, 1.30 MM HEIGHT, PLASTIC, SOT1301-1, HLQFN-16
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | 935295517518 | 935295517115 | BGU7063,115 |
|---|---|---|---|
| 描述 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC16, 8 X 8 MM, 1.30 MM HEIGHT, PLASTIC, SOT1301-1, HLQFN-16 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC16, 8 X 8 MM, 1.30 MM HEIGHT, PLASTIC, SOT1301-1, HLQFN-16 | IC AMP VGA LOW NOISE 16HLQFN |
| 包装说明 | HQCCN, | HQCCN, | 8 X 8 MM, 1.30 MM HEIGHT, PLASTIC, SOT1301-1, HLQFN-16 |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 代码 | S-PQCC-N16 | S-PQCC-N16 | - |
| 长度 | 8 mm | 8 mm | - |
| 功能数量 | 1 | 1 | - |
| 端子数量 | 16 | 16 | - |
| 最高工作温度 | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | HQCCN | HQCCN | - |
| 封装形状 | SQUARE | SQUARE | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | - |
| 座面最大高度 | 1.4 mm | 1.4 mm | - |
| 标称供电电压 | 5 V | 5 V | - |
| 表面贴装 | YES | YES | - |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | NO LEAD | NO LEAD | - |
| 端子节距 | 1.42 mm | 1.42 mm | - |
| 端子位置 | QUAD | QUAD | - |
| 宽度 | 8 mm | 8 mm | - |
| Base Number Matches | 1 | 1 | - |