型号 | 935300034118 | 935300033118 | 74HCT10PW-Q100 | 74HC10D-Q100 | 74HC10PW-Q100 | 74HCT10D-Q100 | 935300061118 |
---|---|---|---|---|---|---|---|
描述 | NAND Gate | NAND Gate | NAND Gate | NAND Gate | NAND Gate | NAND Gate | NAND Gate |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | TSSOP, | SOP-14 | TSSOP, | SOP-14 | TSSOP-14 | SOP, | TSSOP, |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant |
系列 | HC/UH | HC/UH | HCT | HC/UH | HC/UH | HCT | HCT |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 5 mm | 8.65 mm | 5 mm | 8.65 mm | 5 mm | 8.65 mm | 5 mm |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
输入次数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SOP | TSSOP | SOP | TSSOP | SOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 145 ns | 145 ns | 36 ns | 145 ns | 145 ns | 36 ns | 36 ns |
筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
座面最大高度 | 1.1 mm | 1.75 mm | 1.1 mm | 1.75 mm | 1.1 mm | 1.75 mm | 1.1 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 5.5 V | 6 V | 6 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | 4.5 V | 2 V | 2 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 4.4 mm | 3.9 mm | 4.4 mm | 3.9 mm | 4.4 mm | 3.9 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
厂商名称 | - | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |