参数对比
与A276308A-90相近的元器件有:A276308A、A276308A-70、A276308AL-55、A276308A-55、A276308AL-70、A276308AL-90。描述及对比如下:
型号 |
A276308A-90 |
A276308A |
A276308A-70 |
A276308AL-55 |
A276308A-55 |
A276308AL-70 |
A276308AL-90 |
描述 |
64K X 8 OTP CMOS EPROM |
64K X 8 OTP CMOS EPROM |
64K X 8 OTP CMOS EPROM |
64K X 8 OTP CMOS EPROM |
64K X 8 OTP CMOS EPROM |
64K X 8 OTP CMOS EPROM |
64K X 8 OTP CMOS EPROM |
是否Rohs认证 |
不符合 |
- |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
厂商名称 |
AMICC [AMIC TECHNOLOGY] |
- |
AMICC [AMIC TECHNOLOGY] |
AMICC [AMIC TECHNOLOGY] |
AMICC [AMIC TECHNOLOGY] |
AMICC [AMIC TECHNOLOGY] |
AMICC [AMIC TECHNOLOGY] |
包装说明 |
DIP, DIP28,.6 |
- |
DIP, DIP28,.6 |
QCCJ, LDCC32,.5X.6 |
DIP, DIP28,.6 |
QCCJ, LDCC32,.5X.6 |
QCCJ, LDCC32,.5X.6 |
Reach Compliance Code |
unknow |
- |
unknow |
unknow |
unknow |
unknow |
unknow |
最长访问时间 |
90 ns |
- |
70 ns |
55 ns |
55 ns |
70 ns |
90 ns |
I/O 类型 |
COMMON |
- |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 代码 |
R-PDIP-T28 |
- |
R-PDIP-T28 |
R-PQCC-J32 |
R-PDIP-T28 |
R-PQCC-J32 |
R-PQCC-J32 |
长度 |
37.08 mm |
- |
37.08 mm |
13.97 mm |
37.08 mm |
13.97 mm |
13.97 mm |
内存密度 |
524288 bi |
- |
524288 bi |
524288 bi |
524288 bi |
524288 bi |
524288 bi |
内存宽度 |
8 |
- |
8 |
8 |
8 |
8 |
8 |
功能数量 |
1 |
- |
1 |
1 |
1 |
1 |
1 |
端子数量 |
28 |
- |
28 |
32 |
28 |
32 |
32 |
字数 |
65536 words |
- |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
字数代码 |
64000 |
- |
64000 |
64000 |
64000 |
64000 |
64000 |
工作模式 |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
最高工作温度 |
70 °C |
- |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
组织 |
64KX8 |
- |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
输出特性 |
3-STATE |
- |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
封装主体材料 |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
DIP |
- |
DIP |
QCCJ |
DIP |
QCCJ |
QCCJ |
封装等效代码 |
DIP28,.6 |
- |
DIP28,.6 |
LDCC32,.5X.6 |
DIP28,.6 |
LDCC32,.5X.6 |
LDCC32,.5X.6 |
封装形状 |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
IN-LINE |
- |
IN-LINE |
CHIP CARRIER |
IN-LINE |
CHIP CARRIER |
CHIP CARRIER |
并行/串行 |
PARALLEL |
- |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
电源 |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
认证状态 |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
5.33 mm |
- |
5.33 mm |
3.4 mm |
5.33 mm |
3.4 mm |
3.4 mm |
最大待机电流 |
0.0001 A |
- |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
最大压摆率 |
0.03 mA |
- |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
最大供电电压 (Vsup) |
5.5 V |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
- |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
NO |
- |
NO |
YES |
NO |
YES |
YES |
技术 |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
COMMERCIAL |
- |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
端子形式 |
THROUGH-HOLE |
- |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
J BEND |
J BEND |
端子节距 |
2.54 mm |
- |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
1.27 mm |
端子位置 |
DUAL |
- |
DUAL |
QUAD |
DUAL |
QUAD |
QUAD |
宽度 |
15.24 mm |
- |
15.24 mm |
11.43 mm |
15.24 mm |
11.43 mm |
11.43 mm |
Base Number Matches |
1 |
- |
1 |
1 |
1 |
1 |
1 |