型号
- 型号
- 关键词
Flash Module, 512KX32, 70ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68
厂商名称：Cobham Semiconductor Solutions
下载文档| 型号 | ACT-F512K32N-070F1Q | ACT-F512K32N-150F1Q | ACT-F512K32N-090F1Q | ACT-F512K32N-120F1Q |
|---|---|---|---|---|
| 描述 | Flash Module, 512KX32, 70ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Flash Module, 512KX32, 150ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Flash Module, 512KX32, 90ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Flash Module, 512KX32, 120ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 |
| 厂商名称 | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 |
| 针数 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 70 ns | 150 ns | 90 ns | 120 ns |
| 其他特性 | USER CONFIGURABLE AS 2M X 8 | USER CONFIGURABLE AS 2M X 8 | USER CONFIGURABLE AS 2M X 8 | USER CONFIGURABLE AS 2M X 8 |
| 备用内存宽度 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 |
| 长度 | 39.624 mm | 39.624 mm | 39.624 mm | 39.624 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFF | QFF | QFF | QFF |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | FLAT | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 39.624 mm | 39.624 mm | 39.624 mm | 39.624 mm |
