型号
- 型号
- 关键词
| 型号 | ADC0802LCWMX/NOPB | ADC0802LCN | ADC0803LCN | ADC0804LCWM | ADC0804LCWMX | ADC0804LCJ |
|---|---|---|---|---|---|---|
| 描述 | IC ADC 8BIT MPU COMPAT 20-SOIC | Analog to Digital Converters - ADC ADC07D1520 Ref Board | Analog to Digital Converters - ADC 8B uP Compatible ADC | 8-Bit μP Compatible A/D Converters 20-SOIC 0 to 70 | 8-Bit μP Compatible A/D Converters 20-SOIC 0 to 70 | IC ADC 8BIT MPU COMPAT 20-CDIP |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | DIP | DIP | SOIC | SOIC | DIP |
| 包装说明 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | DIP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | _compli | _compli | _compli | _compli | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5.05 V | 6.35 V | 6.35 V | 6.35 V | 6.35 V | 6.35 V |
| 最小模拟输入电压 | -0.05 V | -0.05 V | -0.05 V | -0.05 V | -0.05 V | -0.05 V |
| 最长转换时间 | 114 µs | 114 µs | 114 µs | 114 µs | 114 µs | 114 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-GDIP-T20 |
| 最大线性误差 (EL) | 0.1953% | 0.1953% | 0.1953% | 0.3906% | 0.3906% | 0.3906% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | SOP | DIP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | e3 | e0 | e0 | e0 | e0 | - |
| 长度 | 12.8015 mm | 26.075 mm | 26.075 mm | 12.8015 mm | 12.8 mm | - |
| 湿度敏感等级 | 3 | 1 | 1 | 2A | 2A | - |
| 封装等效代码 | SOP20,.4 | DIP20,.3 | DIP20,.3 | SOP20,.4 | SOP20,.4 | - |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | 220 | 220 | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 2.642 mm | 5.08 mm | 5.08 mm | 2.642 mm | 2.642 mm | - |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 7.493 mm | 7.62 mm | 7.62 mm | 7.493 mm | 7.493 mm | - |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
WindowsCE
分立器件
嵌入式系统
嵌入式系统
嵌入式系统
MicroPython开源版块
