ADC14C080 14-Bit, 80-MSPS, 1.0-GHz Input Bandwidth Analog-to-Digital Converter (ADC)
器件标准:
敬请期待型号 | ADC14C080 | ADC14C080CISQ-NOPB | ADC14C080CISQE/NOPB | ADC14C080CISQ/NOPB | ADC14C080CISQE |
---|---|---|---|---|---|
描述 | ADC14C080 14-Bit, 80-MSPS, 1.0-GHz Input Bandwidth Analog-to-Digital Converter (ADC) | Analog to Digital Converters - ADC 14-Bit, 65/80 MSPS A/D Converter 32-WQFN -40 to 85 | 14-Bit, 80-MSPS, 1.0-GHz Input Bandwidth Analog-to-Digital Converter (ADC) 32-WQFN -40 to 85 | Analog to Digital Converters - ADC 14-Bit, 65/80 MSPS A/D Converter 32-WQFN -40 to 85 | IC 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, QCC32, 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, LLP-32, Analog to Digital Converter |
是否无铅 | - | - | 不含铅 | 不含铅 | 含铅 |
是否Rohs认证 | - | - | 符合 | 符合 | 不符合 |
零件包装代码 | - | - | QFN | QFN | QFN |
包装说明 | - | - | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, |
针数 | - | - | 32 | 32 | 32 |
Reach Compliance Code | - | - | compliant | compliant | compliant |
ECCN代码 | - | - | 3A991.C.3 | 3A991.C.3 | 3A991.C.3 |
最大模拟输入电压 | - | - | 1.6 V | 1.6 V | 1.6 V |
最小模拟输入电压 | - | - | 1.4 V | 1.4 V | 1.4 V |
最长转换时间 | - | - | 0.35 µs | 0.35 µs | 0.0125 µs |
转换器类型 | - | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-30 代码 | - | - | S-XQCC-N32 | S-XQCC-N32 | S-XQCC-N32 |
JESD-609代码 | - | - | e3 | e3 | e0 |
长度 | - | - | 5 mm | 5 mm | 5 mm |
最大线性误差 (EL) | - | - | 0.0214% | 0.0214% | 0.0214% |
湿度敏感等级 | - | - | 3 | 3 | 3 |
模拟输入通道数量 | - | - | 1 | 1 | 1 |
位数 | - | - | 14 | 14 | 14 |
功能数量 | - | - | 1 | 1 | 1 |
端子数量 | - | - | 32 | 32 | 32 |
最高工作温度 | - | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C |
输出位码 | - | - | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY |
输出格式 | - | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | - | - | HVQCCN | HVQCCN | HVQCCN |
封装形状 | - | - | SQUARE | SQUARE | SQUARE |
封装形式 | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | - | - | 260 | 260 | 260 |
采样速率 | - | - | 80 MHz | 80 MHz | 80 MHz |
采样并保持/跟踪并保持 | - | - | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | - | - | 0.8 mm | 0.8 mm | 0.8 mm |
标称供电电压 | - | - | 3 V | 3 V | 3 V |
表面贴装 | - | - | YES | YES | YES |
技术 | - | - | CMOS | CMOS | CMOS |
温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | - | Matte Tin (Sn) | Matte Tin (Sn) | TIN LEAD |
端子形式 | - | - | NO LEAD | NO LEAD | NO LEAD |
端子节距 | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | - | - | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | 40 |
宽度 | - | - | 5 mm | 5 mm | 5 mm |