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ADG3245BCP

IC 8-BIT DRIVER, TRUE OUTPUT, QCC20, 4 X 4 MM, MO-220-VGGD-1, CSP-20, Bus Driver/Transceiver

器件类别:逻辑    逻辑   

厂商名称:ADI(亚德诺半导体)

厂商官网:https://www.analog.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
零件包装代码
QFN
包装说明
4 X 4 MM, MO-220-VGGD-1, CSP-20
针数
20
Reach Compliance Code
not_compliant
ECCN代码
EAR99
JESD-30 代码
S-XQCC-N20
JESD-609代码
e0
长度
4 mm
逻辑集成电路类型
BUS DRIVER
湿度敏感等级
3
位数
8
功能数量
1
端口数量
2
端子数量
20
最高工作温度
85 °C
最低工作温度
-40 °C
输出特性
3-STATE
输出极性
TRUE
封装主体材料
UNSPECIFIED
封装代码
VQCCN
封装等效代码
LCC20,.16SQ,20
封装形状
SQUARE
封装形式
CHIP CARRIER, VERY THIN PROFILE
峰值回流温度(摄氏度)
240
电源
2.5/3.3 V
传播延迟(tpd)
0.225 ns
认证状态
Not Qualified
座面最大高度
1 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.3 V
标称供电电压 (Vsup)
2.5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn85Pb15)
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
30
宽度
4 mm
Base Number Matches
1
文档预览
2.5 V/3.3 V, 8-Bit, 2-Port
Level Translating, Bus Switch
ADG3245
FEATURES
225 ps Propagation Delay through the Switch
4.5 Switch Connection between Ports
Data Rate 1.244 Gbps
2.5 V/3.3 V Supply Operation
Selectable Level Shifting/Translation
Level Translation
3.3 V to 2.5 V
3.3 V to 1.8 V
2.5 V to 1.8 V
Small Signal Bandwidth 610 MHz
20-Lead TSSOP and LFCSP Packages
APPLICATIONS
3.3 V to 1.8 V Voltage Translation
3.3 V to 2.5 V Voltage Translation
2.5 V to 1.8 V Voltage Translation
Bus Switching
Bus Isolation
Hot Swap
Hot Plug
Analog Switch Applications
GENERAL DESCRIPTION
FUNCTIONAL BLOCK DIAGRAM
A0
B0
A7
B7
BE
PRODUCT HIGHLIGHTS
The ADG3245 is a 2.5 V or 3.3 V, 8-bit, 2-port digital switch.
It is designed on Analog Devices’ low voltage CMOS process,
which provides low power dissipation yet gives high switching
speed and very low on resistance, allowing inputs to be connected
to outputs without additional propagation delay or generating
additional ground bounce noise.
The switches are enabled by means of the bus enable (BE) input
signal. These digital switches allow bidirectional signals to be
switched when ON. In the OFF condition, signal levels up to
the supplies are blocked.
This device is ideal for applications requiring level translation.
When operated from a 3.3 V supply, level translation from 3.3 V
inputs to 2.5 V outputs is allowed. Similarly, if the device is
operated from a 2.5 V supply and 2.5 V inputs are applied, the
device will translate the outputs to 1.8 V. In addition to this, a
level translating select pin (SEL) is included. When
SEL
is low,
V
CC
is reduced internally, allowing for level translation between
3.3 V inputs and 1.8 V outputs. This makes the device suited to
applications requiring level translation between different supplies,
such as converter to DSP/microcontroller interfacing.
1.
2.
3.
4.
5.
3.3 V or 2.5 V supply operation
Extremely low propagation delay through switch
4.5
W
switches connect inputs to outputs
Level/voltage translation
20-lead TSSOP and LFCSP (4 mm
¥
4 mm) packages
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© 2003 Analog Devices, Inc. All rights reserved.
ADG3245–SPECIFICATIONS
Parameter
Symbol
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
V
INH
V
INH
Input Low Voltage
V
INL
V
INL
Input Leakage Current
I
I
OFF State Leakage Current
I
OZ
ON State Leakage Current
Maximum Pass Voltage
V
P
1
(V
CC
= 2.3 V to 3.6 V, GND = 0 V, all specifications T
MIN
to T
MAX
, unless
otherwise noted.)
B Version
Typ
2
Max
Conditions
V
CC
= 2.7 V to 3.6 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 2.7 V to 3.6 V
V
CC
= 2.3 V to 2.7 V
0
£
A, B
£
V
CC
0
£
A, B
£
V
CC
V
A
/V
B
= V
CC
=
SEL
= 3.3 V, I
O
= –5
mA
V
A
/V
B
= V
CC
=
SEL
= 2.5 V, I
O
= –5
mA
V
A
/V
B
= V
CC
= 3.3 V,
SEL
= 0 V, I
O
= –5
mA
f = 1 MHz
f = 1 MHz
f = 1 MHz
f = 1 MHz
C
L
= 50 pF, V
CC
=
SEL
= 3 V
V
CC
= 3.0 V to 3.6 V;
SEL
= V
CC
V
CC
= 3.0 V to 3.6 V;
SEL
= V
CC
V
CC
= 3.0 V to 3.6 V;
SEL
= 0 V
V
CC
= 3.0 V to 3.6 V;
SEL
= 0 V
V
CC
= 2.3 V to 2.7 V;
SEL
= V
CC
V
CC
= 2.3 V to 2.7 V;
SEL
= V
CC
V
CC
=
SEL
= 3.3 V; V
A
/V
B
= 2 V
V
CC
=
SEL
= 3.3 V; V
A
/V
B
= 2 V
Min
2.0
1.7
Unit
V
V
V
V
mA
mA
mA
V
V
V
pF
pF
pF
pF
2.0
1.5
1.5
±
0.01
±
0.01
±
0.01
2.5
1.8
1.8
5
5
10
6
0.8
0.7
±
1
±
1
±
1
2.9
2.1
2.1
CAPACITANCE
3
A Port Off Capacitance
B Port Off Capacitance
A, B Port On Capacitance
Control Input Capacitance
SWITCHING CHARACTERISTICS
3
Propagation Delay A to B or B to A, t
PD4
Propagation Delay Matching
5
Bus Enable Time
BE
to A or B
6
Bus Disable Time
BE
to A or B
6
Bus Enable Time
BE
to A or B
6
Bus Disable Time
BE
to A or B
6
Bus Enable Time
BE
to A or B
6
Bus Disable Time
BE
to A or B
6
Maximum Data Rate
Channel Jitter
Operating Frequency—Bus Enable
DIGITAL SWITCH
On Resistance
C
A
OFF
C
B
OFF
C
A
, C
B
ON
C
IN
t
PHL
, t
PLH
t
PZH
, t
PZL
t
PHZ
, t
PLZ
t
PZH
, t
PZL
t
PHZ
, t
PLZ
t
PZH
, t
PZL
t
PHZ
, t
PLZ
1
1
0.5
0.5
0.5
0.5
3.2
3.2
2.2
1.7
2.2
1.75
1.244
50
0.225
22.5
4.8
4.8
3.3
2.9
3
2.6
f
BE
R
ON
V
CC
= 3 V,
SEL
= V
CC
, V
A
= 0 V, I
BA
= 8 mA
V
CC
= 3 V,
SEL
= V
CC
, V
A
= 1.7 V, I
BA
= 8 mA
V
CC
= 2.3 V,
SEL
= V
CC
, V
A
= 0 V, I
BA
= 8 mA
V
CC
= 2.3 V,
SEL
= V
CC
, V
A
= 1 V, I
BA
= 8 mA
V
CC
= 3 V,
SEL
= 0 V V
A
= 0 V, I
BA
= 8 mA
V
CC
= 3 V,
SEL
= 0 V, V
A
= 1 V, I
BA
= 8 mA
V
CC
= 3 V,
SEL
= V
CC
, V
A
= 0 V, I
BA
= 8 mA
V
CC
= 3 V,
SEL
= V
CC
, V
A
= 1 V, I
BA
= 8 mA
2.3
I
CC
I
CC
Digital Inputs = 0 V or V
CC
;
SEL
= V
CC
Digital Inputs = 0 V or V
CC
;
SEL
= 0 V
V
CC
= 3.6 V,
BE
= 3.0 V;
SEL
= V
CC
0.001
0.65
4.5
15
5
11
5
14
0.45
0.65
10
8
28
9
18
8
ns
ps
ns
ns
ns
ns
ns
ns
Gbps
ps p-p
MHz
W
W
W
W
W
W
W
W
V
mA
mA
mA
On Resistance Matching
POWER REQUIREMENTS
V
CC
Quiescent Power Supply Current
Increase in I
CC
per Input
7
R
ON
3.6
1
1.2
130
NOTES
1
Temperature range is as follows: B Version: –40∞C to +85∞C.
2
Typical values are at 25∞C, unless otherwise stated.
3
Guaranteed by design, not subject to production test.
4
The digital switch contributes no propagation delay other than the RC delay of the typical R
ON
of the switch and the load capacitance when driven by an ideal voltage
source. Since the time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay
of the digital switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side.
5
Propagation delay matching between channels is calculated from the on resistance matching and load capacitance of 50 pF.
6
See Timing Measurement Information section.
7
This current applies to the control pin
BE
only. The A and B ports contribute no significant ac or dc currents as they transition.
Specifications subject to change without notice.
–2–
REV. 0
ADG3245
ABSOLUTE MAXIMUM RATINGS*
(T
A
= 25°C, unless otherwise noted.)
V
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
LFCSP Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .30.4°C/W
TSSOP Package
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 143°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235°C
*Stresses
above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
ORDERING GUIDE
Model
ADG3245BCP
ADG3245BCP-REEL7
ADG3245BRU
ADG3245BRU-REEL7
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Package Option
CP-20
CP-20
RU-20
RU-20
Table I. Pin Description
Table II. Truth Table
Mnemonic
BE
SEL
Ax
Bx
Description
Bus Enable (Active Low)
Level Translation Select
Port A, Inputs or Outputs
Port B, Inputs or Outputs
BE
L
L
H
SEL*
L
H
X
Function
A = B, 3.3 V to 1.8 V Level Shifting
A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
Disconnect
*SEL
= 0 V only when V
DD
= 3.3 V
±
10%
PIN CONFIGURATION
20-Lead LFCSP and TSSOP
20 A3
19 A2
18 A1
17 A0
16 V
CC
SEL
1
A0
2
15
BE
14 B0
13 B1
12 B2
11 B3
20
V
CC
19
BE
18
B0
17
B1
SEL
1
A4 2
A5 3
A6 4
A7 5
PIN 1
INDICATOR
A1
3
ADG3245
TOP VIEW
A2
4
A3
5
ADG3245
16
B2
GND 6
B7 7
B6 8
B5 9
B4 10
TOP VIEW
15
B3
A4
6
(Not to Scale)
14
B4
A5
7
A6
8
A7
9
GND
10
13
B5
12
B6
11
B7
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3245 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
–3–
ADG3245
TERMINOLOGY
V
CC
GND
V
INH
V
INL
I
I
I
OZ
I
OL
V
P
R
ON
R
ON
C
X
OFF
C
X
ON
C
IN
I
CC
I
CC
t
PLH
, t
PHL
t
PZH
, t
PZL
t
PHZ
, t
PLZ
Max Data Rate
Channel Jitter
f
BE
Positive Power Supply Voltage.
Ground (0 V) Reference.
Minimum Input Voltage for Logic 1.
Maximum Input Voltage for Logic 0.
Input Leakage Current at the Control Inputs.
OFF State Leakage Current. It is the maximum leakage current at the switch pin in the OFF state.
ON State Leakage Current. It is the maximum leakage current at the switch pin in the ON state.
Maximum Pass Voltage. The maximum pass voltage relates to the clamped output voltage of an NMOS device
when the switch input voltage is equal to the supply voltage.
Ohmic Resistance Offered by a Switch in the ON State. It is measured at a given voltage by forcing a specified
amount of current through the switch.
On Resistance Match between Any Two Channels, i.e., R
ON
Max – R
ON
Min.
OFF Switch Capacitance.
ON Switch Capacitance.
Control Input Capacitance. This consists of
BE
and
SEL.
Quiescent Power Supply Current. This current represents the leakage current between the V
CC
and ground pins.
It is measured when all control inputs are at a logic HIGH or LOW level and the switches are OFF.
Extra power supply current component for the
BE
control input when the input is not driven at the supplies.
Data Propagation Delay through the Switch in the ON State. Propagation delay is related to the RC time constant
R
ON
¥
C
L
, where C
L
is the load capacitance.
Bus Enable Times. These are the times taken to cross the V
T
voltage at the switch output when the switch turns on
in response to the control signal,
BE.
Bus Disable Times. This is the time taken to place the switch in the high impedance OFF state in response to the control
signal. It is measured as the time taken for the output voltage to change by V from the original quiescent level,
with reference to the logic level transition at the control input. (Refer to Figure 3 for enable and disable times.)
Maximum Rate at which Data Can Be Passed through the Switch.
Peak-to-Peak Value of the Sum of the Deterministic and Random Jitter of the Switch Channel.
Operating Frequency of Bus Enable. This is the maximum frequency at which bus enable (BE) can be toggled.
–4–
REV. 0
Typical Performance Characteristics–ADG3245
40
35
30
25
T
A
= 25 C
SEL
= V
CC
V
CC
= 3V
40
35
30
25
T
A
= 25 C
SEL
= V
CC
V
CC
= 2.3V
40
35
30
25
V
CC
= 2.5V
20
15
V
CC
= 2.7V
10
5
0
V
CC
= 3.6V
10
5
0
0.5
1.0
2.0
1.5
V
A
/V
B
– V
2.5
3.0
3.5
0
0
0.5
1.0
2.0
1.5
V
A
/V
B
– V
2.5
3.0
10
5
0
T
A
= 25 C
SEL
= 0V
V
CC
= 3V
R
ON
R
ON
V
CC
= 3.3V
20
15
R
ON
V
CC
= 3.3V
20
15
V
CC
= 3.6V
0
0.5
1.0
1.5
2.0
V
A
/V
B
– V
2.5
3.0
3.5
TPC 1. On Resistance vs.
Input Voltage
TPC 2. On Resistance vs.
Input Voltage
TPC 3. On Resistance vs.
Input Voltage
20
V
CC
= 3.3V
SEL
= V
CC
15
15
V
CC
= 2.5V
SEL
= V
CC
3.0
2.5
T
A
= 25 C
SEL
= V
CC
I
O
= –5 A
V
CC
= 3.6V
R
ON
85 C
V
OUT
– V
10
2.0
1.5
V
CC
= 3.3V
V
CC
= 3V
R
ON
10
85 C
5
5
1.0
40 C
25 C
25 C
40 C
0.5
0
0
0.5
1.0
V
A
/V
B
– V
1.5
2.0
0
0
0
0.5
V
A
/V
B
– V
1.0
1.2
0
0.5
1.0
2.0
1.5
V
CC
– V
2.5
3.0
3.5
TPC 4. On Resistance vs. Input
Voltage for Different Temperatures
TPC 5. On Resistance vs. Input
Voltage for Different Temperatures
TPC 6. Pass Voltage vs. V
CC
2.5
T
A
= 25 C
SEL
= V
CC
I
O
= –5 A
V
CC
= 2.7V
2.5
T
A
= 25 C
SEL
= 0V
I
O
= –5 A
V
CC
= 3.6V
1800
1600
1400
1200
V
CC
= 3.3V,
SEL
= 0V
T
A
= 25 C
2.0
2.0
V
OUT
– V
V
CC
= 2.5V
V
CC
= 2.3V
V
CC
= 3.3V
1.0
V
CC
= 3V
I
CC
– A
1.5
V
OUT
– V
1.5
1000
800
600
1.0
0.5
0.5
400
200
V
CC
=
SEL
= 3.3V
V
CC
=
SEL
= 2.5V
0
2
4
6
8 10 12 14 16 18 20
ENABLE FREQUENCY – MHz
0
0
0.5
1.0
1.5
2.0
V
CC
– V
2.5
3.0
0
0
0.5
1.0
1.5
2.0
V
CC
– V
2.5
3.0
3.5
0
TPC 7. Pass Voltage vs. V
CC
TPC 8. Pass Voltage vs. V
CC
TPC 9. I
CC
vs. Enable Frequency
REV. 0
–5–
查看更多>
参数对比
与ADG3245BCP相近的元器件有:ADG3245BCP-REEL7、ADG3245BRU-REEL7。描述及对比如下:
型号 ADG3245BCP ADG3245BCP-REEL7 ADG3245BRU-REEL7
描述 IC 8-BIT DRIVER, TRUE OUTPUT, QCC20, 4 X 4 MM, MO-220-VGGD-1, CSP-20, Bus Driver/Transceiver IC 8-BIT DRIVER, TRUE OUTPUT, QCC20, 4 X 4 MM, MO-220-VGGD-1, CSP-20, Bus Driver/Transceiver 2.5 V/3.3 V, 8 Bit, 2 Port Level Translator, Bus Switch
是否Rohs认证 不符合 不符合 不符合
零件包装代码 QFN QFN TSSOP
包装说明 4 X 4 MM, MO-220-VGGD-1, CSP-20 4 X 4 MM, MO-220-VGGD-1, CSP-20 TSSOP, TSSOP20,.25
针数 20 20 20
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99
JESD-30 代码 S-XQCC-N20 S-XQCC-N20 R-PDSO-G20
JESD-609代码 e0 e0 e0
长度 4 mm 4 mm 6.5 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER
湿度敏感等级 3 3 1
位数 8 8 8
功能数量 1 1 1
端口数量 2 2 2
端子数量 20 20 20
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE
封装主体材料 UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
封装代码 VQCCN VQCCN TSSOP
封装等效代码 LCC20,.16SQ,20 LCC20,.16SQ,20 TSSOP20,.25
封装形状 SQUARE SQUARE RECTANGULAR
封装形式 CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 240 240 240
电源 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
传播延迟(tpd) 0.225 ns 0.225 ns 0.225 ns
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 1 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.3 V 2.3 V 2.3 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 NO LEAD NO LEAD GULL WING
端子节距 0.5 mm 0.5 mm 0.65 mm
端子位置 QUAD QUAD DUAL
处于峰值回流温度下的最长时间 30 30 30
宽度 4 mm 4 mm 4.4 mm
Base Number Matches 1 1 1
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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