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ADP2108ACBZ-3.3-R7

开关稳压器 Compact 600mA 3MHz Step-Down

器件类别:电源/电源管理    电源电路   

厂商名称:ADI(亚德诺半导体)

厂商官网:https://www.analog.com

器件标准:

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器件参数
参数名称
属性值
Brand Name
Analog Devices Inc
是否无铅
含铅
是否Rohs认证
符合
零件包装代码
BGA
包装说明
VFBGA, BGA5,3X3,17/10
针数
5
制造商包装代码
CB-5-3
Reach Compliance Code
compliant
ECCN代码
EAR99
模拟集成电路 - 其他类型
SWITCHING REGULATOR
控制模式
CURRENT-MODE
控制技术
PULSE WIDTH MODULATION
最大输入电压
5.5 V
最小输入电压
2.3 V
标称输入电压
3.6 V
JESD-30 代码
R-PBGA-B5
JESD-609代码
e3
长度
1.45 mm
湿度敏感等级
1
功能数量
1
端子数量
5
最高工作温度
125 °C
最低工作温度
-40 °C
最大输出电流
1.5 A
标称输出电压
3.3 V
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装等效代码
BGA5,3X3,17/10
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
0.657 mm
表面贴装
YES
切换器配置
BUCK
最大切换频率
3500 kHz
温度等级
AUTOMOTIVE
端子面层
Matte Tin (Sn)
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
1.02 mm
Base Number Matches
1
文档预览
Compact, 600 mA, 3 MHz,
Step-Down DC-to-DC Converter
Data Sheet
FEATURES
Peak efficiency: 95%
3 MHz fixed frequency operation
Typical quiescent current: 18 μA
Maximum load current: 600 mA
Input voltage: 2.3 V to 5.5 V
Uses tiny multilayer inductors and capacitors
Current mode architecture for fast load and line
transient response
100% duty cycle low dropout mode
Internal synchronous rectifier
Internal compensation
Internal soft start
Current overload protection
Thermal shutdown protection
Shutdown supply current: 0.2 μA
Available in
5-ball WLCSP
5-lead TSOT
Supported by
ADIsimPower™
design tool
ADP2108
GENERAL DESCRIPTION
The
ADP2108
is a high efficiency, low quiescent current step-
down dc-to-dc converter manufactured in two different
packages. The total solution requires only three tiny external
components. It uses a proprietary, high speed current mode,
constant frequency PWM control scheme for excellent stability
and transient response. To ensure the longest battery life in
portable applications, the
ADP2108
has a power save mode that
reduces the switching frequency under light load conditions.
The
ADP2108
runs on input voltages of 2.3 V to 5.5 V, which
allows for single lithium or lithium polymer cell, multiple alkaline
or NiMH cell, PCMCIA, USB, and other standard power sources.
The maximum load current of 600 mA is achievable across the
input voltage range.
The
ADP2108
is available in fixed output voltages of 3.3 V, 3.0 V,
2.5 V, 2.3 V, 1.82 V, 1.8 V, 1.5 V, 1.3 V, 1.2 V, 1.1 V, and 1.0 V. All
versions include an internal power switch and synchronous rect-
ifier for minimal external part count and high efficiency. The
ADP2108
has an internal soft start and is internally compensated.
During logic controlled shutdown, the input is disconnected
from the output and the
ADP2108
draws less than 1 μA from
the input source.
Other key features include undervoltage lockout to prevent deep
battery discharge and soft start to prevent input current over-
shoot at startup. The
ADP2108
is available in 5-ball WLCSP and
5-lead TSOT packages. The
ADP2109
provides the same features
and operations as the
ADP2108
and has the additional function
of a discharge switch in the WLCSP package.
APPLICATIONS
PDAs and palmtop computers
Wireless handsets
Digital audio, portable media players
Digital cameras, GPS navigation units
TYPICAL APPLICATIONS CIRCUIT
ADP2108
2.3V TO 5.5V
VIN
4.7µF
ON
OFF
EN
FB
GND
07375-003
1µH
SW
1.0V TO 3.3V
10µF
Figure 1.
Rev. H
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Document Feedback
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2008–2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADP2108
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Typical Applications Circuit............................................................ 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ...................................................................... 11
Control Scheme .......................................................................... 11
PWM Mode ................................................................................. 11
Power Save Mode........................................................................ 11
Data Sheet
Enable/Shutdown ....................................................................... 11
Short-Circuit Protection............................................................ 12
Undervoltage Lockout ............................................................... 12
Thermal Protection .................................................................... 12
Soft Start ...................................................................................... 12
Current Limit .............................................................................. 12
100% Duty Operation ................................................................ 12
Applications Information .............................................................. 13
ADIsimPower Design Tool ....................................................... 13
External Component Selection ................................................ 13
Thermal Considerations............................................................ 14
PCB Layout Guidelines.............................................................. 14
Evaluation Board ............................................................................ 15
Outline Dimensions ....................................................................... 16
Ordering Guide .......................................................................... 17
REVISION HISTORY
6/14—Rev. G to Rev. H
Updated Outline Dimensions ....................................................... 16
6/12—Rev. F to Rev. G
Change to Features Section ............................................................. 1
Added ADIsimPower Design Tool Section ................................. 13
Updated Outline Dimensions ....................................................... 16
1/12—Rev. E to Rev. F
Change to Table 3................................................................................... 4
Changes to Output Capacitor Section ......................................... 13
10/10—Rev. D to Rev. E
Changed −40°C to +85°C to −40°C to +125°C Throughout ......... 3
Changes to Ordering Guide .......................................................... 17
1/10—Rev. C to Rev. D
Changes to Ordering Guide .......................................................... 17
4/09—Rev. B to Rev. C
Changes to General Description Section .......................................1
2/09—Rev. A to Rev. B
Added 5-Lead TSOT Package ........................................... Universal
Changes to Absolute Maximum Ratings Section ..........................4
Updated Outline Dimensions ....................................................... 16
Changes to Ordering Guide .......................................................... 17
11/08—Rev. 0 to Rev. A
Changes to Figure 4...........................................................................6
Updated Outline Dimensions ....................................................... 16
9/08—Revision 0: Initial Version
Rev. H | Page 2 of 20
Data Sheet
SPECIFICATIONS
ADP2108
V
IN
= 3.6 V, V
OUT
= 1.8 V, T
J
= −40°C to +125°C for minimum/maximum specifications, and T
A
= 25°C for typical specifications, unless
otherwise noted.
1
Table 1.
Parameter
INPUT CHARACTERISTICS
Input Voltage Range
Undervoltage Lockout Threshold
OUTPUT CHARACTERISTICS
Output Voltage Accuracy
POWER SAVE MODE TO PWM CURRENT THRESHOLD
PWM TO POWER SAVE MODE CURRENT THRESHOLD
INPUT CURRENT CHARACTERISTICS
DC Operating Current
Shutdown Current
SW CHARACTERISTICS
SW On Resistance (WLCSP)
SW On Resistance (TSOT)
Current Limit
ENABLE CHARACTERISTICS
EN Input High Threshold
EN Input Low Threshold
EN Input Leakage Current
OSCILLATOR FREQUENCY
START-UP TIME
THERMAL CHARACTERISTICS
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
1
Test Conditions/Comments
Min
2.3
Typ
Max
5.5
2.3
2.25
+2
+2.5
Unit
V
V
V
%
%
mA
mA
V
IN
rising
V
IN
falling
PWM mode
V
IN
= 2.3 V to 5.5 V, PWM mode
2.05
−2
−2.5
2.15
85
80
I
LOAD
= 0 mA, device not switching
EN = 0 V, T
A
= T
J
= −40°C to +125°C
PFET
NFET
PFET
NFET
PFET switch peak current limit
18
0.2
320
300
380
260
1300
30
1.0
µA
µA
mA
V
V
µA
MHz
µs
°C
°C
1100
1.2
1500
EN = 0 V, 3.6 V
I
LOAD
= 200 mA
−1
2.5
0
3.0
0.4
+1
3.5
550
150
20
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).
Rev. H | Page 3 of 20
ADP2108
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, EN
FB, SW to GND
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature Range
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
ESD Human Body Model
ESD Charged Device Model
ESD Machine Model
Rating
−0.4 V to +6.5 V
−1.0 V to (V
IN
+ 0.2 V)
−40°C to +125°C
−40°C to +125°C
−65°C to +150°C
−65°C to +150°C
300°C
215°C
220°C
±1500 V
±500 V
±100 V
Data Sheet
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (T
J
)
of the device is dependent on the ambient temperature (T
A
),
the power dissipation (P
D
) of the device, and the junction-to-
ambient thermal resistance of the package (θ
JA
). Maximum
junction temperature (T
J
) is calculated from the ambient
temperature (T
A
) and power dissipation (P
D
) using the formula
T
J
= T
A
+ (P
D
× θ
JA
).
THERMAL RESISTANCE
θ
JA
is specified for a device mounted on a JEDEC 2S2P PCB.
Table 3. Thermal Resistance
Package Type
5-Ball WLCSP
5-Lead TSOT
θ
JA
105
170
Unit
°C/W
°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to GND.
The
ADP2108
can be damaged when the junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that T
J
is within the specified temperature limits.
In applications with high power dissipation and poor thermal
resistance, the maximum ambient temperature may have to
be derated.
ESD CAUTION
Rev. H | Page 4 of 20
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
BALL A1
INDICATOR
1
VIN
A
SW
B
EN
C
FB
2
GND
ADP2108
Figure 2. WLCSP Pin Configuration
Table 4. WLCSP Pin Function Descriptions
Pin No.
A1
A2
B
C1
C2
Mnemonic
VIN
GND
SW
EN
FB
Description
Power Source Input. VIN is the source of the PFET high-side switch. Bypass VIN to GND with a 2.2 μF or greater
capacitor as close to the
ADP2108
as possible.
Ground. Connect all the input and output capacitors to GND.
Switch Node Output. SW is the drain of the PFET switch and NFET synchronous rectifier.
Enable Input. Drive EN high to turn on the
ADP2108.
Drive EN low to turn it off and reduce the input current to 0.2 μA.
Feedback Input of the Error Amplifier. Connect FB to the output of the switching regulator.
VIN
1
GND
2
EN
3
ADP2108
TOP VIEW
(Not to Scale)
5
07375-002
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
SW
4
FB
Figure 3. TSOT Pin Configuration
Table 5. TSOT Pin Function Descriptions
Pin No.
1
2
3
4
5
Mnemonic
VIN
GND
EN
FB
SW
Description
Power Source Input. VIN is the source of the PFET high-side switch. Bypass VIN to GND with a 2.2 μf or greater
capacitor as close to the
ADP2108
as possible.
Ground. Connect all the input and output capacitors to GND.
Enable Input. Drive EN high to turn on the
ADP2108.
Drive EN low to turn it off and reduce the input current to 0.1 μA.
Feedback Input of the Error Amplifier. Connect FB to the output of the switching regulator.
Switch Node Output. SW is the drain of the PFET switch and NFET synchronous rectifier.
Rev. H | Page 5 of 20
07375-040
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参数对比
与ADP2108ACBZ-3.3-R7相近的元器件有:ADP2108AUJZ-1.8-R7、ADP2108AUJZ-2.3-R7、ADP2108ACBZ-2.5-R7、ADP2108ACBZ-1.1-R7、ADP2108ACBZ-2.3-R7、ADP2108ACBZ-1.5-R7、PNM1005H1290DBTS、ADP2108-1.1-EVALZ。描述及对比如下:
型号 ADP2108ACBZ-3.3-R7 ADP2108AUJZ-1.8-R7 ADP2108AUJZ-2.3-R7 ADP2108ACBZ-2.5-R7 ADP2108ACBZ-1.1-R7 ADP2108ACBZ-2.3-R7 ADP2108ACBZ-1.5-R7 PNM1005H1290DBTS ADP2108-1.1-EVALZ
描述 开关稳压器 Compact 600mA 3MHz Step-Down 开关稳压器 Compact 600mA 3MHz Step-Down 开关稳压器 Compact 600mA 3MHz Step-Down 开关稳压器 Compact 600mA 3MHz Step-Down 开关稳压器 Compact 600mA 3MHz Step-Down 开关稳压器 Compact 600mA 3MHz Step-Down 开关稳压器 Compact 600mA 3MHz Step-Down Fixed Resistor, Thin Film, 0.25W, 129ohm, 100V, 0.5% +/-Tol, -50,50ppm/Cel, 1105 电源管理IC开发工具 ADP2108-1.1 Eval Brd
Brand Name Analog Devices Inc Analog Devices Inc Analog Devices Inc Analog Devices Inc Analog Devices Inc Analog Devices Inc Analog Devices Inc - -
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 - -
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 不符合 -
零件包装代码 BGA TSOT TSOT BGA BGA BGA BGA - -
包装说明 VFBGA, BGA5,3X3,17/10 ROHS COMPLIANT, MO-193AB, TSOT-5 VSSOP, TSOP5/6,.11,37 VFBGA, BGA5,3X3,17/10 VFBGA, BGA5,3X3,17/10 ROHS COMPLIANT, WLCSP-5 VFBGA, BGA5,3X3,17/10 SMT, 1005 -
针数 5 5 5 5 5 5 5 - -
制造商包装代码 CB-5-3 UJ-5 UJ-5 CB-5-3 CB-5-3 CB-5-3 CB-5-3 - -
Reach Compliance Code compliant compliant compliant compliant compliant unknown compliant compliant -
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 -
模拟集成电路 - 其他类型 SWITCHING REGULATOR SWITCHING REGULATOR SWITCHING REGULATOR SWITCHING REGULATOR SWITCHING REGULATOR SWITCHING REGULATOR SWITCHING REGULATOR - -
控制模式 CURRENT-MODE CURRENT-MODE CURRENT-MODE CURRENT-MODE CURRENT-MODE CURRENT-MODE CURRENT-MODE - -
控制技术 PULSE WIDTH MODULATION PULSE WIDTH MODULATION PULSE WIDTH MODULATION PULSE WIDTH MODULATION PULSE WIDTH MODULATION PULSE WIDTH MODULATION PULSE WIDTH MODULATION - -
最大输入电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V - -
最小输入电压 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V - -
标称输入电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - -
JESD-30 代码 R-PBGA-B5 R-PDSO-G5 R-PDSO-G5 R-PBGA-B5 R-PBGA-B5 R-PBGA-B5 R-PBGA-B5 - -
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e0 -
长度 1.45 mm 2.9 mm 2.9 mm 1.45 mm 1.45 mm 1.45 mm 1.45 mm - -
湿度敏感等级 1 1 1 1 1 1 1 - -
功能数量 1 1 1 1 1 1 1 - -
端子数量 5 5 5 5 5 5 5 2 -
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 155 °C -
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -55 °C -
最大输出电流 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A 1.5 A - -
标称输出电压 3.3 V 1.8 V 2.3 V 2.5 V 1.1 V 2.3 V 1.5 V - -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - -
封装代码 VFBGA VSSOP VSSOP VFBGA VFBGA VFBGA VFBGA - -
封装等效代码 BGA5,3X3,17/10 TSOP5/6,.11,37 TSOP5/6,.11,37 BGA5,3X3,17/10 BGA5,3X3,17/10 BGA5,3X3,17/10 BGA5,3X3,17/10 - -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - -
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMT -
峰值回流温度(摄氏度) 260 260 225 260 225 225 260 - -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - -
座面最大高度 0.657 mm 1 mm 1 mm 0.657 mm 0.657 mm 0.657 mm 0.657 mm - -
表面贴装 YES YES YES YES YES YES YES YES -
切换器配置 BUCK BUCK BUCK BUCK BUCK BUCK BUCK - -
最大切换频率 3500 kHz 3500 kHz 3500 kHz 3500 kHz 3500 kHz 3500 kHz 3500 kHz - -
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - -
端子面层 Matte Tin (Sn) Matte Tin (Sn) MATTE TIN Matte Tin (Sn) MATTE TIN MATTE TIN Matte Tin (Sn) Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier -
端子形式 BALL GULL WING GULL WING BALL BALL BALL BALL - -
端子节距 0.5 mm 0.95 mm 0.95 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm - -
端子位置 BOTTOM DUAL DUAL BOTTOM BOTTOM BOTTOM BOTTOM - -
处于峰值回流温度下的最长时间 30 40 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30 - -
宽度 1.02 mm 1.6 mm 1.6 mm 1.02 mm 1.02 mm 1.02 mm 1.02 mm - -
厂商名称 - ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体) - ADI(亚德诺半导体) - - ADI(亚德诺半导体)
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