型号
- 型号
- 关键词
| 型号 | ADS6223IRGZ25 | ADS6224IRGZ25 | ADS6222IRGZ25 | ADS6225IRGZ25 |
|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC Dual 12B 80MSPS ADC | Analog to Digital Converters - ADC Dual 12B 105MSPS ADC | Analog to Digital Converters - ADC Dual 12B 65MSPS ADC | Analog to Digital Converters - ADC Dual 12B 125MSPS ADC |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | QFN | QFN | QFN |
| 包装说明 | 7 X 7 MM, GREEN, PLASTIC, VQFN-48 | 7 X 7 MM, GREEN, PLASTIC, VQFN-48 | 7 X 7 MM, GREEN, PLASTIC, VQFN-48 | 7 X 7 MM, GREEN, PLASTIC, VQFN-48 |
| 针数 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | compli | compli | unknow | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N | N |
| 最大模拟输入电压 | 2 V | 2 V | 2 V | 2 V |
| 最小模拟输入电压 | -2 V | -2 V | -2 V | -2 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-N48 | S-PQCC-N48 | S-PQCC-N48 | S-PQCC-N48 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm |
| 最大线性误差 (EL) | 0.0488% | 0.0537% | 0.0488% | 0.061% |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 模拟输入通道数量 | 2 | 2 | 2 | 2 |
| 位数 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC48,.27SQ,20 | LCC48,.27SQ,20 | LCC48,.27SQ,20 | LCC48,.27SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 80 MHz | 105 MHz | 65 MHz | 125 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Factory Lead Time | 1 week | - | 1 week | 1 week |
