型号
- 型号
- 关键词
IC 16-BIT, DSP-PIPELINE REGISTER, CPGA144, CERAMIC, PGA-144, DSP Peripheral
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：ADI(亚德诺半导体)
下载文档| 型号 | ADSP-3128ASG/883B | ADSP-3128AJG | ADSP-3128AKG | ADSP-3128ASG | ADSP-3128ATG | ADSP-3128ATG/883B |
|---|---|---|---|---|---|---|
| 描述 | IC 16-BIT, DSP-PIPELINE REGISTER, CPGA144, CERAMIC, PGA-144, DSP Peripheral | IC 16-BIT, DSP-PIPELINE REGISTER, CPGA144, CERAMIC, PGA-144, DSP Peripheral | IC 16-BIT, DSP-PIPELINE REGISTER, CPGA144, CERAMIC, PGA-144, DSP Peripheral | IC 16-BIT, DSP-PIPELINE REGISTER, CPGA144, CERAMIC, PGA-144, DSP Peripheral | IC 16-BIT, DSP-PIPELINE REGISTER, CPGA144, CERAMIC, PGA-144, DSP Peripheral | IC 16-BIT, DSP-PIPELINE REGISTER, CPGA144, CERAMIC, PGA-144, DSP Peripheral |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | PGA | PGA | PGA | PGA | PGA | PGA |
| 包装说明 | CERAMIC, PGA-144 | CERAMIC, PGA-144 | CERAMIC, PGA-144 | CERAMIC, PGA-144 | CERAMIC, PGA-144 | CERAMIC, PGA-144 |
| 针数 | 144 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A991.A | 3A991.A | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 边界扫描 | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-CPGA-P144 | S-CPGA-P144 | S-CPGA-P144 | S-CPGA-P144 | S-CPGA-P144 | S-CPGA-P144 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 40 mm | 40 mm | 40 mm | 40 mm | 40 mm | 40 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO |
| 端子数量 | 144 | 144 | 144 | 144 | 144 | 144 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | PGA | PGA | PGA | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.19 mm | 4.19 mm | 4.19 mm | 4.19 mm | 4.19 mm | 4.19 mm |
| 最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 40 mm | 40 mm | 40 mm | 40 mm | 40 mm | 40 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |