AFBR-15x1CZ and AFBR-25x1CZ
DC to 5-MBd Versatile Link Fiber Optic Analog
Transmitter and Digital Receiver for 1-mm POF and
200-μm PCS
Data Sheet
Description
The AFBR-15x1CZ analog transmitter utilizes a 650-nm LED
source, and the AFBR-25x1CZ receiver consists of an IC with an
integrated photodiode providing a TTL logic family compatible
output.
AFBR-25x1CZ devices have inverted output signals, which
means that light_on leads to Data_out low.
The transmitter and receiver housing is designed to efficiently
couple into 1-mm Polymer Optical Fiber (POF) and 200-μm
diameter Plastic-Clad Silica (PCS). Links up to 58 m are
supported with 1-mm POF, and up to 500 m with 200-μm PCS.
The transmitter is designed to interoperate with Avago
Technologies’ HFBR-25xxZ and AFBR-26xxZ receivers as well.
A link with AFBR-15x1CZ and AFBR-25x1CZ enables operating
temperatures up to +95 °C.
The transmitter and receiver are 4-pin devices, packed in
Versatile Link housings. Versatile Link components can be
interlocked (N-plexed together) to minimize space and to
provide dual connections with the duplex connectors. Various
simplex and duplex connectors, as well as POF cables, are
available for Versatile Link components.
Available Transmitter AFBR-15x1CZ Options:
Horizontal Package
Vertical Package
Tilted Package
AFBR-1521CZ
AFBR-1531CZ
AFBR-1541CZ
Features
RoHS-compliant
Data transmission at signal rates from DC up to 5 MBd
Up to 58 meters distance with 1-mm Polymer Optical Fiber
(POF) and up to 500 meters with 200-μm PCS
Operating temperature range of –40 °C to +95 °C
Compatible with the Avago Technologies Versatile Link
family of connectors, for easy termination of fiber
Applications
Industrial control and factory automation
Optical transmitter and receiver for 5-MBd systems and
below
Serial field buses
Intra-system links; board-to-board, rack-to-rack
Extension of RS-232 and RS-485
High voltage isolation
Elimination of ground loops
Reduces voltage transient susceptibility
Drivers and inverters
Available Receiver AFBR-25x1CZ Options:
Horizontal Package
Vertical Package
Tilted Package
AFBR-2521CZ
AFBR-2531CZ
AFBR-2541CZ
Broadcom
-1-
AFBR-15x1CZ and AFBR-25x1CZ
Data Sheet
Application Literature
Application Literature
Application Note 1035 (Versatile Link), AV02-0730EN.
Handling
Versatile Link components are auto-insertable. When wave
soldering is performed with Versatile Link components, the
optical port plug should be left in to prevent contamination of
the port. Do not use reflow solder processes (i.e., infrared
reflow or vapor-phase reflow). Non-halogenated water soluble
fluxes (i.e., 0% chloride), not rosin based fluxes, are
recommended for use with Versatile Link components.
Versatile Link components are moisture-sensitive devices and
are shipped in a moisture sealed bag. If the components are
exposed to air for an extended period of time, they may require
a baking step before the soldering process. Refer to the special
labeling on the shipping tube for details.
Package and Handling Information
The compact Versatile Link package is made of a flame
retardant material and uses the same pad layout as a standard,
eight-pin dual-in-line package. Horizontal, Vertical, and Tilted
(30°) packages are available. These low-profile Versatile Link
packages are stackable and are enclosed to provide a
dust-resistant seal. Snap action simplex, simplex latching,
duplex, and duplex latching connectors are offered with
simplex or duplex cables.
Package Housing Color
Versatile Link components and simplex connectors are color
coded to eliminate confusion when making connections.
Receiver packages are black, and transmitters are grey.
Recommended Chemicals for
Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl.
Aliphatics: hexane, heptanes.
Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such as 1,1.1
trichloroethane, ketones such as MEK, acetone, chloroform,
ethyl acetate, methylene dichloride, phenol, methylene
chloride, or N-methylpyrolldone. Broadcom does not
recommend the use of cleaners that use halogenated
hydrocarbons because of their potential environmental harm.
Package Orientation
Performance and pinouts for the horizontal, vertical, and tilted
(30°) packages are identical. To provide additional attachment
support for the vertical Versatile Link housing, the designer has
the option of using a self-tapping screw through a printed
circuit board into a mounting hole at the bottom of the
package. For most applications, this is not necessary.
Broadcom
-2-
AFBR-15x1CZ and AFBR-25x1CZ
Data Sheet
Interlocked (Stacked) Assemblies
Interlocked (Stacked) Assemblies
Refer to
Figure 1.
Horizontal packages can be stacked by placing units with pins
facing upward. Initially engage the interlocking mechanism by
sliding the L bracket body from above into the L slot body of
the lower package. Use a straight edge, such as a ruler, to bring
all stacked units into uniform alignment. This technique
prevents potential harm that could occur to fingers and hands
of assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated stacking
and unstacking causes no damage to individual units.
To stack vertical packages, hold one unit in each hand, with the
pins facing away and the optical ports on the bottom. Slide the
L bracket unit into the L slot unit. The straight edge used for
horizontal package alignment is not needed.
Tilted (30°) Module
Figure 2 Interlocked (Stacked) Tilted (30°) Packages
Stacking Horizontal Modules
Figure 1 Interlocked (Stacked) Horizontal Packages
Stacking Vertical Modules
Figure 3 Interlocked (Stacked) Vertical Packages
Broadcom
-3-
AFBR-15x1CZ and AFBR-25x1CZ
Data Sheet
Mechanical Dimensions
Mechanical Dimensions
Horizontal Module
Figure 4 Mechanical Dimensions - Horizontal Packages
2
[0.08]
Vertical Module
Figure 5 Mechanical Dimensions - Vertical Packages
1
[0.04]
3.6
[0.14]
10.2
[0.40]
5.1
[0.20]
10.2
[0.40]
6.5
[0.26]
18.1
[0.71]
6.5
[0.26]
7.6
[0.30]
18.8
[0.74]
5.1
[0.20]
2
[0.08]
1.7
[0.07]
7.6
[0.30]
18.9
[0.75]
0.6
[0.03]
4.2
[0.17]
0.6
[0.02]
3.8
[
0.15
]
MAX.
7.7
[0.30]
3.6
[
0.14
]
MIN.
3.3
[
0.13
]
MAX
2.8
[
0.11
]
MIN
1.3
[0.05]
0.5
[0.02]
2.54
[0.100]
1.3
[0.05]
0.5
[0.02]
2.54
[0.100]
7.62
[0.300]
[
0.6 ]
3
0.0
[
0.6 3]
0
0.
NOTES:
NOTES:
1) Dimensions: mm [in]
2.8
[0.11]
1.7
[0.07]
1) Dimensions: mm [in]
2) Optional mounting hole for #2 self-tapping-screw
(metric equivalent M2.2 x 0.45)
2)
3.8
[0.15]
Tilted (30°) Module
Figure 6 Mechanical Dimensions - Tilted (30°) Packages
2
[0.08]
A
10.2
[0.40]
30°
0.4
[0.02]
.7
18 4]
7
[0.
6.6
[0.26]
0.6
[0.03]
4.6
[0.18]
15.2
[0.60]
6.5
[0.26]
A
2.54
[0.100]
0.5
[0.02]
1.3
[0.05]
4.6
[0.18]
0.7
[0.03]
7.62
[0.300]
1.1
[0.05]
8.7
[0.34]
10.1
[0.40]
2.2
[0.09]
NOTES:
1) Dimensions: mm [in]
19.3
[0.76]
Broadcom
-4-
3.8
[0.15]
AFBR-15x1CZ and AFBR-25x1CZ
Data Sheet
Versatile Link Printed Board Layout Dimensions
Versatile Link Printed Board Layout
Dimensions
Horizontal Module
Figure 7 PCB Dimensions - Horizontal Packages
7.62
[0.300]
2.54
[0.100]
1
[
4]
0.0
Vertical Module
Figure 9 PCB Dimensions - Vertical Packages
7.62
[0.300]
2.54
[0.100]
[
0.0
1
4]
3.8
[0.15]
2.25 [0.09] clearance hole
for optional vertical mount
self-tapping-screw #2
4
3
2
1
4
3
2
1
7.7
[0.30]
5
8
7.62
[0.300]
PCB EDGE
5
8
PCB EDGE
1.9 MIN.
[0.07]
3.8
[0.15]
1.7
[0.07] MIN.
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
Tilted (30°) Module
Figure 8 PCB Dimensions - Tilted (30°) Packages
7.62
[0.300]
2.54
[0.100]
1
[ 0
.04]
4
3
2
1
5
8
8.7
[0.34]
PCB EDGE
2.2 MIN.
[0.09]
NOTES:
1) Dimensions: mm [in]
Footprint - TOP VIEW
Broadcom
-5-
