AFBR-S10RX021Z, AFBR-S10RX031Z
Analog Receiver with Versatile Link Connector
for Sensing over POF
Data Sheet
Description
The Broadcom® AFBR-S10RX0x1Z receiver provides the system
designer with the ability to implement an optical arc flash
sensor over 1 mm Plastic Optical Fiber (POF). This receiver
features a compact Versatile Link connector. In combination
with AFBR-15x9Z transmitter, an arc flash sensor system with
system self test feature can be realized.
This product is lead free and compliant with RoHS.
Features
Block Diagram
Figure 1 AFBR-S10RX0x1Z Block Diagram
Receiver consisting of a PD and a TIA integrated in a
single IC
High EMI robustness
Temperature compensated output voltage
Fast slew rate
Compact foot print.
Temperature range –40 °C to 85 °C
RoHS compliant
Versatile Link connector system
Applications
Arc Flash Detection
Available Part Numbers
Horizontal Package
Vertical Package
AFBR-S10RX021Z
AFBR-S10RX031Z
Broadcom
-1-
AFBR-S10RX021Z, AFBR-S10RX031Z
Data Sheet
Receiver
Receiver
The receiver utilizes an ASIC with integrated photodiode and a
linear transimpedance amplifier (TIA). It is packaged into a
transfer molded insert, which is furthermore assembled into a
Versatile Link plastic housing. This device couples the optical
power efficiently from POF fiber to the receiving photodiode.
The output voltage is proportional to the coupled input optical
power.
Package Housing Color
Versatile Link components and simplex connectors are
color-coded to eliminate confusion when making connections.
Receiver packages are black.
Handling
Versatile Link components are auto-insertable. When wave
soldering is performed with Versatile Link components, the
optical port plug should be left in to prevent contamination of
the port. Do not use reflow solder processes (i.e., infrared
reflow or vapor-phase reflow). Non-halogenated water-soluble
fluxes (i.e., 0% chloride), not rosin-based fluxes, are
recommended for use with Versatile Link components.
Versatile Link components are moisture-sensitive devices and
are shipped in a moisture-sealed bag. If the components are
exposed to air for an extended period of time, they may require
a baking step before the soldering process. Refer to the special
labeling on the shipping tube for details.
Package and Handling Information
Versatile Link packages are made of a flame-retardant material
and use the same pad layout as a standard, eight pin
dual-in-line package. Versatile Link packages are stackable and
are enclosed to provide a dust-resistant seal. Snap action
simplex, simplex latching, duplex, and duplex latching
connectors are offered with simplex or duplex cables.
Mechanical Dimensions
Figure 2 Package Outline Drawing (Horizontal Module, Left, and Vertical Module, Right)
2
[0.08]
1
[0.04]
3.6
[0.14]
10.2
[0.40]
6.5
[0.26]
10.2
[0.40]
5.1
[0.20]
18.8
[0.74]
5.1
[0.20]
2
[0.08]
6.5
[0.26]
18.1
[0.71]
7.6
[0.30]
0.6
[0.03]
7.6
[0.30]
4.2
[0.17]
1.7
[0.07]
7.7
[0.30]
3.8
[
0.15
]
MAX.
3.6
[
0.14
]
MIN.
1.3
[0.05]
0.5
[0.02]
2.54
[0.100]
1.3
[0.05]
0.5
[0.02]
2.54
[0.100]
[
18.9
[0.75]
0.6
[0.02]
NOTES:
1) Dimensions: mm [in]
2.8
[0.11]
1.7
[0.07]
2.8
[
0.11
]
MIN
3.3
[
0.13
]
MAX
[
0.6 ]
3
0.0
7.62
[0.300]
0.6 3]
0
0.
NOTES:
1) Dimensions: mm [in]
2) Optional mounting hole for #2 self-tapping-screw
(metric equivalent M2.2 x 0.45)
3.8
[0.15]
2)
Broadcom
-2-
3.8
[0.15]
AFBR-S10RX021Z, AFBR-S10RX031Z
Data Sheet
Versatile Link Printed Board Layout Dimensions
Versatile Link Printed Board Layout Dimensions
Figure 3 PCB Footprint (Horizontal Module, Left, and Vertical Module, Right) – Top View
7.62
[0.300]
2.54
[0.100]
1
[
0.0
4]
7.62
[0.300]
2.54
[0.100]
4
[
3
2
1
0.0
1
4]
2.25 [0.09] clearance hole
for optional vertical mount
self-tapping-screw #2
4
3
2
1
7.7
[0.30]
3.8
[0.15]
PCB EDGE
5
8
1.9 MIN.
[0.07]
3.8
[0.15]
5
8
7.62
[0.300]
PCB EDGE
1.7
[0.07] MIN.
Dimensions in mm (in.).
Dimensions in mm (in.).
Interlocked (Stacked) Assemblies
Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the interlocking mechanism by
sliding the L bracket body from above into the L slot body of the lower package. Use a straight edge, such as a ruler, to bring all
stacked units into uniform alignment. This technique prevents potential harm that could occur to fingers and hands of assemblers
from the package pins.
Stacked horizontal packages can be disengaged if necessary. Repeated stacking and unstacking does not cause damage to
individual units.
To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom. Slide the L
bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed.
Figure 4 Stacking Vertical Modules (Stacking Horizontal Modules, Left, Stacking Vertical Modules, Right)
Broadcom
-3-
AFBR-S10RX021Z, AFBR-S10RX031Z
Data Sheet
Pin Description and Application Circuitry
Pin Description and Application Circuitry
Figure 5 Recommended Application Circuit
Pin
1
2
3
4
5
8
VOUT
GND
VCC
N.C.
Name
Description
Output Voltage
Ground
Supply Voltage
Recommended to chassis GND
Recommended to chassis GND
Housing
Housing
Regulatory Compliance Table
Feature
Electrostatic discharge (ESD) to the
electrical Pins
Immunity
Test Method
ESD22-A114
Variation of IEC 61000-4-3
Performance
Withstands up to 2000V HBM applied between the electrical pins.
Typically shows no measurable effect from a 15V/m field swept
from 8MHz to 1GHz applied to the transceiver when mounted on a
circuit board without chassis enclosure.
UL File #: E173874 (P/N has to be added to UL file)
Component recognition
Underwriter Laboratories
Broadcom
-4-
AFBR-S10RX021Z, AFBR-S10RX031Z
Data Sheet
Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause damage to the device. Limits apply to each parameter in isolation, all
other parameters having values within the recommended operation conditions. It should not be assumed that limiting values of
more than one parameter can be applied to the products at the same time. Exposure to the absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Storage and Ambient Temperature
Lead Soldering Temperature
Lead Soldering Time
Receiver Supply Voltage
Electrostatic Discharge Voltage Capability HBM
a.
b.
c.
Symbol
T
S,A
T
sold
t
sold
V
CC
ESD HBM
–40
Min
+85
260
10
6
Max
°C
°C
s
V
V
Unit
a
b
b
Notes
2000
c
Operating the product outside the maximum rated temperature range will compromise its reliability and may damage the product.
The receiver is Pb-free wave solderable.
ESD Capability for all Pins HBM(Human Body Model) according JESD22-A114
Recommended Operating Conditions
Parameter
Ambient Temperature
Receiver Supply Voltage
a.
Symbol
T
A
V
CC
-40
4.75
Min
Typ
+85
5
5.25
Max
°C
V
Unit
a
Notes
Electrical and optical specifications of the product are guaranteed across recommended ambient operating temperature range unless otherwise specified.
Broadcom
-5-
