型号
- 型号
- 关键词
| 型号 | AM29PDL127H88VKIN | AM29PDL127H53VKIN | AM29PDL127H68VKI |
|---|---|---|---|
| 描述 | IC,EEPROM,NOR FLASH,8MX16,CMOS,BGA,80PIN,PLASTIC | IC,EEPROM,NOR FLASH,8MX16,CMOS,BGA,80PIN,PLASTIC | IC,EEPROM,NOR FLASH,8MX16,CMOS,BGA,80PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| Reach Compliance Code | compliant | compliant | compliant |
| 最长访问时间 | 85 ns | 55 ns | 65 ns |
| 启动块 | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP |
| 命令用户界面 | YES | YES | YES |
| 通用闪存接口 | YES | YES | YES |
| 数据轮询 | YES | YES | YES |
| JESD-30 代码 | R-PBGA-B80 | R-PBGA-B80 | R-PBGA-B80 |
| 内存密度 | 134217728 bit | 134217728 bit | 134217728 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH |
| 部门数/规模 | 16,254 | 16,254 | 16,254 |
| 端子数量 | 80 | 80 | 80 |
| 字数 | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 组织 | 8MX16 | 8MX16 | 8MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | FBGA |
| 封装等效代码 | BGA80,8X12,32 | BGA80,8X12,32 | BGA80,8X12,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 页面大小 | 8 words | 8 words | 8 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 1.8,3/3.3 V | 3/3.3 V | 1.8,3/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | YES | YES |
| 部门规模 | 4K,32K | 4K,32K | 4K,32K |
| 最大待机电流 | 0.000005 A | 0.000005 A | 0.000005 A |
| 最大压摆率 | 0.055 mA | 0.055 mA | 0.055 mA |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM |
| 切换位 | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE |