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AS1C2M16P-70BIN

静态随机存取存储器 32M 2Mx16 3V 70ns Pseudo 静态随机存取存储器 IT

器件类别:半导体    存储器 IC    静态随机存取存储器   

厂商名称:Alliance Memory

器件标准:

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器件参数
参数名称
属性值
厂商名称
Alliance Memory
产品种类
静态随机存取存储器
存储容量
32 Mbit
组织
2 M x 16
访问时间
70 ns
接口类型
Parallel
电源电压-最大
3.3 V
电源电压-最小
2.6 V
电源电流—最大值
25 mA
最小工作温度
- 40 C
最大工作温度
+ 85 C
安装风格
SMD/SMT
封装 / 箱体
FPBGA-48
封装
Tray
存储类型
SRAM
系列
AS1C2M16P-70
类型
Asynchronous
工厂包装数量
364
文档预览
AS1C2M16P-70BIN
Revision History
32M
(2M x 16 bit)
PSEUDO STATIC RAM
48ball
FPBGA
Package
Revision
Rev 1.0
Details
Preliminary datasheet
Date
Aug 2018
Alliance Memory Inc. 511 Taylor Way, San Carlos, CA 94070 TEL: (650) 610-6800 FAX: (650) 620-9211
Alliance Memory Inc. reserves the right to change products or specification without notice
Confidential
- 1 of 12 -
Rev.1.0 Aug. 2018
AS1C2M16P-70BIN
2Mb x16 Pseudo Static RAM Specification
GENERAL DESCRIPTION
The
AS1C2M16P-70BIN
is 33,554,432 bits of Pseudo SRAM which uses DRAM type memory cells, but
this device has refresh-free operation and extreme low power consumption technology. Furthermore the
interface is compatible to a low power Asynchronous type SRAM. The
AS1C2M16P-70BIN
is
organized as 2,097,152 Words x 16 bit.
FEATURES
- Organization :2M x16
-
Address access speed 70ns
- Power Supply Voltage : 2.6 ~ 3.3V
- Separated I/O power(VccQ) & Core power(Vcc)
- Three state outputs
- Byte read/write control by UB# / LB#
- Auto-TCSR for power saving
- Package type : 48ball-FPBGA
(6.0x7.0)
- Operating Temperature
. Industrial : -40
~ 85
PRODUCT FAMILY
Power Dissipation
Part Number
Operating
Temp.
Power Supply
Speed
(t
RC
)
Operating
I
CC
( Max.)
Standby
(I
SB
, Max.)
I
CC1
( f = 1MHz)
I
CC2
( f = f
max
)
AS1C2M16P-70BIN
-40
to 85
2.6V to 3.3V
70ns
120uA
5mA
25mA
FUNCTION BLOCK DIAGRAM
Self-Refresh
CONTROL
CONTROL
LOGIC
CS#
UB#
LB#
WE#
OE#
COLUMN SELECT
ROW SELECT
A0~A20
ADDRESS
DECODER
Memory Array
2M X 16
DQ0~
DQ15
Din/Dout BUFFER
I/O CIRCUIT
Confidential
- 2 of 12 -
Rev.1.0 Aug. 2018
AS1C2M16P-70BIN
PIN DESCRIPTION ( 48ball-FPBGA-6.00x7.00 )
1
A
LB#
2
OE#
3
A0
4
A1
5
A2
6
NC
B
DQ8
UB#
A3
A4
CS#
DQ0
C
DQ9
DQ10
A5
A6
DQ1
DQ2
D
VSSQ
DQ11
A17
A7
DQ3
VCC
E
VCCQ
DQ12
DNU
A16
DQ4
VSS
F
DQ14
DQ13
A14
A15
DQ5
DQ6
G
H
DQ15
A19
A12
A13
WE#
DQ7
A18
A8
A9
A10
A11
A20
TOP VIEW (Ball Down)
Name
CS#
OE#
WE#
Function
Chip select input
Output enable input
Write enable input
Name
LB#
UB#
VCC
VCCQ
Function
Lower byte (DQ
0~7
)
Upper byte (DQ
8~15
)
Power supply
I/O power supply
DQ
0-15
Data in-out
A
0-20
DNU
Address inputs
Do not use
VSS(Q) Ground
NC
No connection
Confidential
- 3 of 12 -
Rev.1.0 Aug. 2018
AS1C2M16P-70BIN
ABSOLUTE MAXIMUM RATINGS
1)
Parameter
Voltage on Any Pin Relative to Vss
Voltage on Vcc supply relative to Vss
Power Dissipation
Storage Temperature
Operating Temperature
Industrial
Symbol
V
IN
, V
OUT
V
CC
, V
CCQ
P
D
T
STG
T
A
Ratings
-0.2 to V
CCQ
+0.3V
-0.2
2)
V
CCQ
+0.3V
1.0
-65 to 150
-40 to 85
Unit
V
V
W
o
C
o
C
1. Stresses greater than those listed above “Absolute Maximum Ratings” may cause permanent damage to the device.
Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
2. Undershoot at power-off : -1.0V in case of pulse width < 20ns
FUNCTIONAL DESCRIPTION
CS#
H
L
L
L
L
L
L
L
L
OE#
X
H
H
L
L
L
X
X
X
WE#
X
H
H
H
H
H
L
L
L
LB#
X
L
X
L
H
L
L
H
L
UB#
X
X
L
H
L
L
H
L
L
DQ
0~7
High-Z
High-Z
High-Z
Data Out
High-Z
Data Out
Data In
High-Z
Data In
DQ
8~15
High-Z
High-Z
High-Z
High-Z
Data Out
Data Out
High-Z
Data In
Data In
Mode
Deselected
Output Disabled
Output Disabled
Lower Byte Read
Upper Byte Read
Word Read
Lower Byte Write
Upper Byte Write
Word Write
Power
Stand by
Active
Active
Active
Active
Active
Active
Active
Active
Note:
1. X means don’t care. (Must be low or high state)
Confidential
- 4 of 12 -
Rev.1.0 Aug. 2018
AS1C2M16P-70BIN
RECOMMENDED DC OPERATING CONDITIONS
Parameter
Supply voltage
Ground
Input high voltage
Input low voltage
Symbol
V
CC
V
CCQ
V
SS
, V
SSQ
V
IH
V
IL
Min
2.6
2.6
0
0.8 * V
CCQ
-0.2
2)
Typ
3.0
3.0
0
-
-
Max
3.3
3.3
0
V
CCQ
+ 0.2
1)
0.2 * V
CCQ
Unit
V
V
V
V
V
1. Overshoot: V
CC
+1.0 V in case of pulse width < 20ns
2. Undershoot: -1.0 V in case of pulse width < 20ns
3. Overshoot and undershoot are sampled, not 100% tested
.
CAPACITANCE
1)
(f =1MHz, T
A
=25
o
C)
Item
Input capacitance
Input/Output capacitance
1. Capacitance is sampled, not 100% tested
Symbol
C
IN
C
IO
Test Condition
V
IN
=0V
V
IO
=0V
Min
-
-
Max
8
8
Unit
pF
pF
DC AND OPERATING CHARACTERISTICS
Parameter
Input leakage current
Output leakage current
Symbol
I
LI
I
LO
Test Conditions
V
IN
=V
SS
to V
CCQ
, V
CC=
V
CCmax
CS#=V
IH
, OE#=V
IH
or WE#=V
IL
,
V
IO
=V
SS
to V
CCQ
, V
CC=
V
CCmax
Cycle time = 1us, I
IO
=0mA, 100% duty,
Min
-1
-1
Typ
-
-
Max
1
1
Unit
uA
uA
I
CC1
Average operating current
I
CC2
Output low voltage
Output high voltage
V
OL
V
OH
CS#<0.2V, ,
V
IN
<0.2V or V
IN
>V
CCQ
-0.2V
Cycle time = Min, I
IO
=0mA, 100% duty,
CS#=V
IL
, V
IN
=V
IL
or V
IH
I
OL
= 0.5mA, V
CC=
V
CCmin
I
OH
= -0.5mA, V
CC=
V
CCmin
CS#>V
CCQ
-0.2V, Other inputs = 0 ~ V
CCQ
(Typ. condition : V
CC
=3.0V @ 25
o
C)
(Max. condition : V
CC
=3.3V @ 85
o
C)
-
-
5
mA
-
-
0.8*V
CCQ
-
-
-
25
0.2*V
CCQ
mA
V
V
-
Standby current (CMOS)
I
SB
-
-
120
uA
1. Maximum Icc specifications are tested with V
CC
= V
CCmax.
Confidential
- 5 of 12 -
Rev.1.0 Aug. 2018
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参数对比
与AS1C2M16P-70BIN相近的元器件有:AS1C2M16P-70BINTR。描述及对比如下:
型号 AS1C2M16P-70BIN AS1C2M16P-70BINTR
描述 静态随机存取存储器 32M 2Mx16 3V 70ns Pseudo 静态随机存取存储器 IT 静态随机存取存储器 32M 2Mx16 3V 70ns Pseudo 静态随机存取存储器 IT
厂商名称 Alliance Memory Alliance Memory
产品种类 静态随机存取存储器 静态随机存取存储器
存储容量 32 Mbit 32 Mbit
组织 2 M x 16 2 M x 16
访问时间 70 ns 70 ns
接口类型 Parallel Parallel
电源电压-最大 3.3 V 3.3 V
电源电压-最小 2.6 V 2.6 V
电源电流—最大值 25 mA 25 mA
最小工作温度 - 40 C - 40 C
最大工作温度 + 85 C + 85 C
安装风格 SMD/SMT SMD/SMT
封装 / 箱体 FPBGA-48 FPBGA-48
封装 Tray Reel
存储类型 SRAM SRAM
系列 AS1C2M16P-70 AS1C2M16P-70
类型 Asynchronous Asynchronous
工厂包装数量 364 2000
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