8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
8K × 8 I2C/2-线 串行 电可擦除只读存储器, PDIP8
器件类别:存储
厂商名称:Atmel (Microchip)
下载文档型号 | AT24C64 | AT24C32 | AT24C32_03 | AT24C64-10PI-2.7 | AT24C64W-10SI-1.8 | AT24C64N-10SI-2.7 | AT24C64N-10SI-1.8 | AT24C64-10TI-2.7 | AT24C64-10TI-1.8 | AT24C64-10PI-1.8 |
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描述 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 | 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
组织 | 8K X 8 | 8K X 8 | 8K X 8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
是否无铅 | - | - | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
零件包装代码 | - | - | - | DIP | SOIC | SOIC | SOIC | TSSOP | TSSOP | DIP |
包装说明 | - | - | - | DIP, DIP8,.3 | SOP, SOP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | DIP, DIP8,.3 |
针数 | - | - | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | - | - | - | compli | compli | compli | compli | compli | compli | compli |
ECCN代码 | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | - | - | - | DATA RETENTION: 100 YEARS | DATA RETENTION: 100 YEARS | DATA RETENTION: 100 YEARS | DATA RETENTION: 100 YEARS | DATA RETENTION: 100 YEARS | DATA RETENTION: 100 YEARS | DATA RETENTION: 100 YEARS |
最大时钟频率 (fCLK) | - | - | - | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
数据保留时间-最小值 | - | - | - | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
耐久性 | - | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
I2C控制字节 | - | - | - | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
JESD-30 代码 | - | - | - | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
JESD-609代码 | - | - | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | - | - | - | 9.271 mm | 5.31 mm | 4.9 mm | 4.9 mm | 4.4 mm | 4.4 mm | 9.271 mm |
内存密度 | - | - | - | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi |
内存集成电路类型 | - | - | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
字数 | - | - | - | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | - | - | - | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | - | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | - | DIP | SOP | SOP | SOP | TSSOP | TSSOP | DIP |
封装等效代码 | - | - | - | DIP8,.3 | SOP8,.3 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | DIP8,.3 |
封装形状 | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE |
并行/串行 | - | - | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | - | - | - | NOT SPECIFIED | 240 | 240 | 240 | 240 | 240 | NOT SPECIFIED |
电源 | - | - | - | 3/5 V | 2/5 V | 3/5 V | 2/5 V | 3/5 V | 2/5 V | 2/5 V |
认证状态 | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | - | 5.334 mm | 2.03 mm | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm | 5.334 mm |
串行总线类型 | - | - | - | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大待机电流 | - | - | - | 5e-7 A | 1e-7 A | 5e-7 A | 1e-7 A | 5e-7 A | 1e-7 A | 1e-7 A |
最大压摆率 | - | - | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
最大供电电压 (Vsup) | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | - | - | 2.7 V | 1.8 V | 2.7 V | 1.8 V | 2.7 V | 1.8 V | 1.8 V |
标称供电电压 (Vsup) | - | - | - | 3 V | 2.5 V | 3 V | 2.5 V | 3 V | 2.5 V | 2.5 V |
表面贴装 | - | - | - | NO | YES | YES | YES | YES | YES | NO |
技术 | - | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | - | - | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 2.54 mm |
处于峰值回流温度下的最长时间 | - | - | - | NOT SPECIFIED | 30 | 30 | 30 | 30 | 30 | NOT SPECIFIED |
宽度 | - | - | - | 7.62 mm | 5.27 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 7.62 mm |
最长写入周期时间 (tWC) | - | - | - | 10 ms | 20 ms | 10 ms | 20 ms | 10 ms | 20 ms | 20 ms |
写保护 | - | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |