EEPROM SEEPROM, 4K, SPI - 20MHz, Ind Tmp , 11mil Unsawn Wafer
厂商名称:Atmel (Microchip)
下载文档型号 | AT25040B-WWU11L | AT25010B-SSHL-B | AT25020B-SSHL-B | AT25020B-SSHL-T | AT25040B-XHL-B | AT25020B-MAHL-T | AT25040B-MAHL-T |
---|---|---|---|---|---|---|---|
描述 | EEPROM SEEPROM, 4K, SPI - 20MHz, Ind Tmp , 11mil Unsawn Wafer | EEPROM 1K (128 X 8) SPI, 1.8V | EEPROM 2K (256 X 8) SPI, 1.8V | EEPROM 2K (256 X 8) SPI, 1.8V | EEPROM 4K (512 X 8) SPI, 1.8V | EEPROM 2K (256 X 8) SPI, 1.8V | EEPROM 4K (512 X 8) SPI, 1.8V |
零件包装代码 | DIE | SOIC | SOIC | SOIC | TSSOP | SOF | SOF |
包装说明 | DIE, | SOP, SOP8,.25 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | TSSOP, TSSOP8,.25 | HVSON, SOLCC8,.11,20 | HVSON, SOLCC8,.11,20 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | compliant | unknown | unknown | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
JESD-30 代码 | X-XUUC-N | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 |
内存密度 | 4096 bit | 1024 bit | 2048 bit | 2048 bit | 4096 bit | 2048 bit | 4096 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 512 words | 128 words | 256 words | 256 words | 512 words | 256 words | 512 words |
字数代码 | 512 | 128 | 256 | 256 | 512 | 256 | 512 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 512X8 | 128X8 | 256X8 | 256X8 | 512X8 | 256X8 | 512X8 |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIE | SOP | SOP | SOP | TSSOP | HVSON | HVSON |
封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | UNCASED CHIP | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD |
端子位置 | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
数据保留时间-最小值 | - | 100 | 100 | 100 | 100 | 100 | 100 |
耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | - | 4.925 mm | 4.925 mm | 4.925 mm | 4.4 mm | 3 mm | 3 mm |
湿度敏感等级 | - | 3 | 1 | 1 | 3 | 3 | 3 |
封装等效代码 | - | SOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | SOLCC8,.11,20 | SOLCC8,.11,20 |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 250 | 260 | 260 |
电源 | - | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
座面最大高度 | - | 1.75 mm | 1.75 mm | 1.75 mm | 1.2 mm | 0.6 mm | 0.6 mm |
最大待机电流 | - | 5e-7 A | 5e-7 A | 5e-7 A | 5e-7 A | 5e-7 A | 5e-7 A |
最大压摆率 | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
端子面层 | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.5 mm | 0.5 mm |
处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | 40 | 40 | 40 |
宽度 | - | 3.9 mm | 3.9 mm | 3.9 mm | 3 mm | 2 mm | 2 mm |
写保护 | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
厂商名称 | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |