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AT25XE041B-XMHN-T

IC FLASH 4M SPI 85MHZ 8TSSOP

器件类别:存储   

厂商名称:Adesto Technologies

器件标准:

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器件参数
参数名称
属性值
存储器类型
非易失
存储器格式
闪存
技术
FLASH
存储容量
4Mb (512K x 8)
时钟频率
85MHz
写周期时间 - 字,页
8µs,2.75ms
存储器接口
SPI
电压 - 电源
1.65 V ~ 3.6 V
工作温度
-40°C ~ 85°C(TC)
安装类型
表面贴装
封装/外壳
8-TSSOP(0.173",4.40mm 宽)
供应商器件封装
8-TSSOP
文档预览
Fusion XE/Fusion XV
AT25XE/XV Series | Ultra-low Energy Serial Flash
Code Storage Solutions
for the Connected World
Wide-voltage range, ultra-low energy memory technology enabling next generation solutions
for consumer, communication, mobile and industrial applications
As modern electronics evolve, the need for new low density,
low energy code storage memory devices has emerged to
meet the needs of mobile, wearable, and industrial
applications in a connected world.
The Adesto® Fusion AT25XE/XV Series are families of highly
optimized ultra-low energy serial interface Flash memory
devices designed for use in a wide variety of high-volume
low energy consumer and industrial applications.
Targeted to meet the needs of today's connected
applications in the Internet of Things, its granular Page
Erase and Block Erase architecture allows the memory space
to be used much more efficiently supporting data storage
and over-the-air updates. The resulting improvement to
software efficiency allows reduced CPU / MCU overheads to
further reduce system energy usage.
Fusion XE/Fusion XV Serial Flash:
Features and Benefits
Wide Vcc operating range extends system
battery life without sacrificing performance
(Vcc Range: XE 1.65-3.6V or XV 1.65-4.4V)
Ultra deep power down operates at <200nA
significantly reducing system standby power
Low energy operation:
- 4mA Active Read Current (2/4Mb)
- 9mA Active Erase Current (2/4Mb)
Advanced security functions and embedded
serial numbers provide effective anti-tamper
and traceability options
Active Polling (2/4Mb)
For more information on Adesto’s ultra-low
energy code and data storage solutions, please
visit: www.adestotech.com
Fusion XE/Fusion XV Serial Flash
Density
Vcc
Range
Speed
(MHz)
Ultra-Deep
Power Down
Page Erase
Capability
Enhanced
Security
Features
512-Kbit
1-Mbit
2-Mbit
4-Mbit
1.65-3.6V / 1.65-4.4V
1.65-3.6V / 1.65-4.4V
1.65-3.6V or 1.65-4.4V
1.65-3.6V or 1.65-4.4V
104 / 85
104 / 85
85
85
Applications: Program code shadow and storage for wearable,
mobile, Bluetooth low energy and other energy conscious designs.
Features
Single 1.65V-3.6V (XE) or 1.65-4.4V (XV) Supply
Serial Peripheral Interface (SPI) Compatible
- Supports SPI Modes 0 and 3
- Supports Dual Output Read
85/104MHz Maximum Operating Frequency
- Clock-to-Output (tV) of 6 ns
Flexible, Optimized Erase Architecture for Code
and Data Storage Applications
- Uniform 256-Byte Page Erase
- Uniform 4-Kbyte Block Erase
- Uniform 32-Kbyte Block Erase
- Uniform 64-Kbyte Block Erase
- Full Chip Erase
Hardware Controlled Locking of Protected
Sectors via WP Pin
128-Byte Programmable OTP Security Register
Flexible Programming
- Byte/Page Program (1 to 256 Bytes)
Fast Program and Erase times
- 2ms Typical Page Program (256 Bytes) Time
- 45ms Typical 4-Kbyte Block Erase Time
- 360ms Typical 32-Kbyte Block Erase Time
-720ms Typical 64-Kbyte Block Erase Time
Automatic Checking and Reporting of Erase and
Program Failures
Software Controlled Reset
JEDEC Standard Manufacturer and Device ID Read
Low Power Dissipation
- 200nA Ultra Deep Power Down (Typical)
- 5µA Deep Power-Down (Typical)
- 25uA Standby current (Typical)
- 3.5mA Active Read Current (Typical)
Endurance: 100,000 Program/Erase Cycles
Industry Standard Green (Pb/Halide-free/RoHS
Compliant) Package Options
- SOIC, DFN, TSSOP, Die and Wafer Options
- High Temperature and KGD options
Description
The Adesto® AT25XE/XV series is designed for use in a wide variety of high-volume consumer based applications in which
program code is shadowed from Flash memory into embedded or external RAM for execution. The XE/XV families consume
ultra-low energy Read and Erase currents enabling highly-energy conscious designs, perfectly suited to the Internet of
Things and wearable electronics.
With a wide voltage range of 1.65V to 3.6V or 1.65V to 4.4V the new AT25XE/XV Serial Flash families not only use less
power during standard operation but also offer designers the ability to operate over the full Vcc range of the battery --
maximizing on-board energy reserves and eliminating the need for external regulators. The ultra-deep power down mode
allows devices to function with a class leading standby current of 200 nanoamps, an order of magnitude improvement over
standby modes available today. The devices also include a page erase feature for faster programming and updates.
Adesto Technologies
is a leading supplier of value-added semiconductor solutions for code and data storage. Its product
portfolio includes DataFlash®, Fusion Serial Flash, Mavriq™ and Moneta™ serial memory products. Adesto is based in Santa
Clara, California (USA). For more information, visit http://www.adestotech.com.
3600 Peterson Way
Santa Clara, CA 95054
Phone: (+1) 408.400.0578
Email: contact@adestotech.com
Web: http://www.adestotech.com
© 2016 Adesto Technologies. All rights reserved. Adesto
®
, the Adesto logo, CBRAM
®
and Mavriq™ and Moneta™ are trademarks of Adesto Technologies. All other
marks are the property of their respective owners.
2P-XEXV-0816
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参数对比
与AT25XE041B-XMHN-T相近的元器件有:AT25XE021A-SSHN-T、AT25XE021A-MAHN-T、AT25XE041B-MAHN-T、AT25XE041B-SSHN-T、AT25XE041B-MHN-T。描述及对比如下:
型号 AT25XE041B-XMHN-T AT25XE021A-SSHN-T AT25XE021A-MAHN-T AT25XE041B-MAHN-T AT25XE041B-SSHN-T AT25XE041B-MHN-T
描述 IC FLASH 4M SPI 85MHZ 8TSSOP Flash Memory X-Energy, 8-UDFN (2x3x0.6), IND TEMP, 1.65V-3.6V, Tu0026R IC FLASH 4M SPI 85MHZ 8UDFN IC FLASH 4M SPI 85MHZ 8SOIC IC FLASH 4M SPI 85MHZ 8UDFN
存储器类型 非易失 - - 非易失 非易失 非易失
存储器格式 闪存 - - 闪存 闪存 闪存
技术 FLASH - CMOS FLASH FLASH FLASH
存储容量 4Mb (512K x 8) - - 4Mb (512K x 8) 4Mb (512K x 8) 4Mb (512K x 8)
时钟频率 85MHz - - 85MHz 85MHz 85MHz
写周期时间 - 字,页 8µs,2.75ms - - 8µs,2.75ms 8µs,2.75ms 8µs,2.75ms
存储器接口 SPI - - SPI SPI SPI
电压 - 电源 1.65 V ~ 3.6 V - - 1.65 V ~ 3.6 V 1.65 V ~ 3.6 V 1.65 V ~ 3.6 V
工作温度 -40°C ~ 85°C(TC) - - -40°C ~ 85°C(TC) -40°C ~ 85°C(TC) -40°C ~ 85°C(TC)
安装类型 表面贴装 - - 表面贴装 表面贴装 表面贴装
封装/外壳 8-TSSOP(0.173",4.40mm 宽) - - 8-UFDFN 裸露焊盘 8-SOIC(0.154",3.90mm 宽) 8-UDFN 裸露焊盘
供应商器件封装 8-TSSOP - - 8-UDFN(2x3) 8-SOIC 8-UDFN(5x6)
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