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AT49BV512-90PC

Flash, 64KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32

器件类别:存储    存储   

厂商名称:Atmel (Microchip)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Atmel (Microchip)
零件包装代码
DIP
包装说明
0.600 INCH, PLASTIC, DIP-32
针数
32
Reach Compliance Code
compliant
ECCN代码
EAR99
最长访问时间
90 ns
启动块
BOTTOM
命令用户界面
YES
数据轮询
YES
JESD-30 代码
R-PDIP-T32
JESD-609代码
e0
长度
42.05 mm
内存密度
524288 bit
内存集成电路类型
FLASH
内存宽度
8
功能数量
1
部门数/规模
1,1
端子数量
32
字数
65536 words
字数代码
64000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
64KX8
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP32,.6
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
PARALLEL
电源
3/3.3 V
编程电压
2.7 V
认证状态
Not Qualified
座面最大高度
5.59 mm
部门规模
8K,56K
最大待机电流
0.00005 A
最大压摆率
0.05 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
切换位
YES
类型
NOR TYPE
宽度
15.24 mm
文档预览
Features
Single Supply Voltage Range, 2.7V to 3.6V
Single Supply for Read and Write
Fast Read Access Time – 70 ns
Internal Program Control and Timer
8K Bytes Boot Block with Lockout
Fast Erase Cycle Time – 10 Seconds
Byte-by-Byte Programming – 30 µs/Byte Typical
Hardware Data Protection
DATA Polling for End of Program Detection
Low Power Dissipation
– 25 mA Active Current
– 50 µA CMOS Standby Current
Typical 10,000 Write Cycles
Description
The AT49BV512 is a 3-volt only, 512K Flash memories organized as 65,536 words of
8 bits each. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the
devices offer access times to 70 ns with power dissipation of just 90 mW over the
commercial temperature range. When the devices are deselected, the CMOS standby
current is less than 50 µA.
To allow for simple in-system reprogrammability, the AT49BV512 does not require
high input voltages for programming. Three-volt only commands determine the read
and programming operation of the device. Reading data out of the device is similar to
reading from an EPROM. Reprogramming the AT49BV512 is performed by erasing
512K (64K x 8)
Single 2.7-volt
Battery-Voltage
Flash Memory
AT49BV512
Pin Configurations
Pin Name
A0 - A15
CE
OE
WE
I/O0 - I/O7
NC
Function
Addresses
Chip Enable
Output Enable
Write Enable
Data Inputs/Outputs
No Connect
DIP Top View
NC
NC
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
WE
NC
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
VSOP Top View (8 x 14 mm) or
TSOP Top View (8 x 20 mm)
Type 1
A11
A9
A8
A13
A14
NC
WE
VCC
NC
NC
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
PLCC Top View
4
3
2
1
32
31
30
A12
A15
NC
NC
VCC
WE
NC
I/O1
I/O2
GND
I/O3
I/O4
I/O5
I/O6
14
15
16
17
18
19
20
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
Rev. 1026E–FLASH–06/02
1
the entire 1 megabit of memory and then programming on a byte-by-byte basis. The typ-
ical byte programming time is a fast 30 µs. The end of a program cycle can be optionally
detected by the DATA polling feature. Once the end of a byte program cycle has been
detected, a new access for a read or program can begin. The typical number of program
and erase cycles is in excess of 10,000 cycles.
The optional 8K bytes boot block section includes a reprogramming write lock out fea-
ture to provide data integrity. The boot sector is designed to contain user secure code,
and when the feature is enabled, the boot sector is permanently protected from being
reprogrammed.
Block Diagram
VCC
GND
OE
WE
CE
DATA INPUTS/OUTPUTS
I/O0 - I/O7
OE, CE AND WE
LOGIC
DATA LATCH
INPUT/OUTPUT
BUFFERS
Y-GATING
MAIN MEMORY
(56K BYTES)
OPTIONAL BOOT
BLOCK (8K BYTES)
FFFFH
2000H
1FFFH
0000H
Y DECODER
ADDRESS
INPUTS
X DECODER
Device Operation
READ:
The AT49BV512 is accessed like an EPROM. When CE and OE are low and
WE is high, the data stored at the memory location determined by the address pins is
asserted on the outputs. The outputs are put in the high impedance state whenever CE
or OE is high. This dual-line control gives designers flexibility in preventing bus
contention.
ERASURE:
Before a byte can be reprogrammed, the 64K bytes memory array (or 56K
bytes if the boot block featured is used) must be erased. The erased state of the mem-
ory bits is a logical “1”. The entire device can be erased at one time by using a 6-byte
software code. The software chip erase code consists of 6-byte load commands to spe-
cific address locations with a specific data pattern (please refer to the Chip Erase Cycle
Waveforms).
After the software chip erase has been initiated, the device will internally time the erase
operation so that no external clocks are required. The maximum time needed to erase
the whole chip is t
EC
. If the boot block lockout feature has been enabled, the data in the
boot sector will not be erased.
BYTE PROGRAMMING:
Once the memory array is erased, the device is programmed
(to a logical “0”) on a byte-by-byte basis. Please note that a data “0” cannot be pro-
grammed back to a “1”; only erase operations can convert “0”s to “1”s. Programming is
accomplished via the internal device command register and is a 4 bus cycle operation
(please refer to the Command Definitions table). The device will automatically generate
the required internal program pulses.
The program cycle has addresses latched on the falling edge of WE or CE, whichever
occurs last, and the data latched on the rising edge of WE or CE, whichever occurs first.
Programming is completed after the specified t
BP
cycle time. The DATA polling feature
may also be used to indicate the end of a program cycle.
2
AT49BV512
1026E–FLASH–06/02
AT49BV512
BOOT BLOCK PROGRAMMING LOCKOUT:
The device has one designated block
that has a programming lockout feature. This feature prevents programming of data in
the designated block once the feature has been enabled. The size of the block is 8K
bytes. This block, referred to as the boot block, can contain secure code that is used to
bring up the system. Enabling the lockout feature will allow the boot code to stay in the
device while data in the rest of the device is updated. This feature does not have to be
activated; the boot block’s usage as a write protected region is optional to the user. The
address range of the boot block is 0000H to 1FFFH.
Once the feature is enabled, the data in the boot block can no longer be erased or pro-
grammed. Data in the main memory block can still be changed through the regular
programming method. To activate the lockout feature, a series of six program com-
mands to specific addresses with specific data must be performed. Please refer to the
Command Definitions table.
BOOT BLOCK LOCKOUT DETECTION:
A software method is available to determine if
programming of the boot block section is locked out. When the device is in the software
product identification mode (see Software Product Identification Entry and Exit sections)
a read from address location 00002H will show if programming the boot block is locked
out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is
high, the program lockout feature has been activated and the block cannot be pro-
grammed. The software product identification code should be used to return to standard
operation.
PRODUCT IDENTIFICATION:
The product identification mode identifies the device and
manufacturer as Atmel. It may be accessed by hardware or software operation. The
hardware operation mode can be used by an external programmer to identify the correct
programming algorithm for the Atmel product.
For details, see Operating Modes (for hardware operation) or Software Product Identifi-
cation. The manufacturer and device code is the same for both modes.
DATA POLLING:
The AT49BV512 features DATA polling to indicate the end of a pro-
gram cycle. During a program cycle an attempted read of the last byte loaded will result
in the complement of the loaded data on I/O7. Once the program cycle has been com-
pleted, true data is valid on all outputs and the next cycle may begin. DATA polling may
begin at any time during the program cycle.
TOGGLE BIT:
In addition to DATA polling the AT49BV512 provides another method for
determining the end of a program or erase cycle. During a program or erase operation,
successive attempts to read data from the device will result in I/O6 toggling between
one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid
data will be read. Examining the toggle bit may begin at any time during a program
cycle.
HARDWARE DATA PROTECTION:
Hardware features protect against inadvertent pro-
grams to the AT49BV512 in the following ways: (a) V
CC
sense: if V
CC
is below 1.8V
(typical), the program function is inhibited. (b) Program inhibit: holding any one of OE
low, CE high or WE high inhibits program cycles. (c) Noise filter: Pulses of less than
15 ns (typical) on the WE or CE inputs will not initiate a program cycle.
INPUT LEVELS:
While operating with a 2.7V to 3.6V power supply, the address inputs
and control inputs
(OE,
CE and WE) may be driven from 0 to 5.5V without adversely
affecting the operation of the device. The I/O lines can only be driven from 0 to V
CC
+
0.6V.
3
1026E–FLASH–06/02
Command Definition (in Hex)
Command
Sequence
Read
Chip Erase
Byte
Program
Boot Block
Lockout
(1)
Product ID
Entry
Product ID
Exit
(2)
Product ID
Exit
(2)
Notes:
Bus
Cycles
1
6
4
6
3
3
1
1st Bus
Cycle
Addr
Addr
5555
5555
5555
5555
5555
XXXX
Data
D
OUT
AA
AA
AA
AA
AA
F0
2AAA
2AAA
2AAA
2AAA
2AAA
55
55
55
55
55
5555
5555
5555
5555
5555
80
A0
80
90
F0
5555
Addr
5555
AA
D
IN
AA
2AAA
55
5555
40
2AAA
55
5555
10
2nd Bus
Cycle
Addr
Data
3rd Bus
Cycle
Addr
Data
4th Bus
Cycle
Addr
Data
5th Bus
Cycle
Addr
Data
6th Bus
Cycle
Addr
Data
1. The 8K byte boot sector has the address range 0000H to 1FFFH.
2. Either one of the Product ID exit commands can be used.
Absolute Maximum Ratings*
Temperature Under Bias ............................... -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V
CC
+ 0.6V
Voltage on OE
with Respect to Ground ...................................-0.6V to +13.5V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
4
AT49BV512
1026E–FLASH–06/02
AT49BV512
DC and AC Operating Range
AT49BV512-70
Operating
Temperature (Case)
V
CC
Power Supply
Com.
Ind.
0°C - 70°C
-40°C - 85°C
2.7V to 3.6V
AT49BV512-90
0°C - 70°C
-40°C - 85°C
2.7V to 3.6V
AT49BV512-12
0°C - 70°C
-40°C - 85°C
2.7V to 3.6V
AT49BV512-15
0°C - 70°C
-40°C - 85°C
2.7V to 3.6V
Operating Modes
Mode
Read
Program
(2)
Standby/Write Inhibit
Program Inhibit
Program Inhibit
Output Disable
Product Identification
Hardware
V
IL
V
IL
V
IH
A1 - A15 = V
IL
, A9 = V
H
,
(3)
, A0 = V
IL
A1 - A15 = V
IL
, A9 = V
H
,
(3)
, A0 = V
IH
Software
(5)
A0 = V
IL
, A1 - A15 = V
IL
A0 = V
IH
, A1 - A15 = V
IL
Notes:
1.
2.
3.
4.
5.
X can be V
IL
or V
IH
.
Refer to AC Programming Waveforms.
V
H
= 12.0V ± 0.5V.
Manufacturer Code: 1FH, Device Code: 03H.
See details under Software Product Identification Entry/Exit.
Manufacturer Code
(4)
Device Code
(4)
Manufacturer Code
(4)
Device Code
(4)
CE
V
IL
V
IL
V
IH
X
X
X
OE
V
IL
V
IH
X
(1)
X
V
IL
V
IH
WE
V
IH
V
IL
X
V
IH
X
X
High Z
Ai
Ai
Ai
X
I/O
D
OUT
D
IN
High Z
DC Characteristics
Symbol
I
LI
I
LO
I
SB1
I
SB2
I
CC(1)
V
IL
V
IH
V
OL
V
OH
Note:
Parameter
Input Load Current
Output Leakage Current
V
CC
Standby Current CMOS
V
CC
Standby Current TTL
V
CC
Active Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
1. In the erase mode, I
CC
is 50 mA.
I
OL
= 2.1 mA
I
OH
= -100 µA; V
CC
= 3.0V
2.4
2.0
0.45
Condition
V
IN
= 0V to V
CC
V
I/O
= 0V to V
CC
CE = V
CC
- 0.3V to V
CC
CE = 2.0V to V
CC
f = 5 MHz; I
OUT
= 0 mA
Min
Max
10
10
50
1
25
0.6
Units
µA
µA
µA
mA
mA
V
V
V
V
5
1026E–FLASH–06/02
查看更多>
参数对比
与AT49BV512-90PC相近的元器件有:AT49BV512-70TC、AT49BV512-90PI、AT49BV512-70VI、AT49BV512-70JC、AT49BV512-70JI、AT49BV512-70TI、AT49BV512-90VI、AT49BV512-70PI、AT49BV512-70PC。描述及对比如下:
型号 AT49BV512-90PC AT49BV512-70TC AT49BV512-90PI AT49BV512-70VI AT49BV512-70JC AT49BV512-70JI AT49BV512-70TI AT49BV512-90VI AT49BV512-70PI AT49BV512-70PC
描述 Flash, 64KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 64KX8, 70ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 Flash, 64KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 64KX8, 70ns, PDSO32, 8 X 14 MM, PLASTIC, TVSOP1-32 Flash, 64KX8, 70ns, PQCC32, PLASTIC, LCC-32 Flash, 64KX8, 70ns, PQCC32, PLASTIC, LCC-32 Flash, 64KX8, 70ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 Flash, 64KX8, 90ns, PDSO32, 8 X 14 MM, PLASTIC, VSOP-32 Flash, 64KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 64KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP TSOP1 DIP SOIC QFJ QFJ TSOP1 SOIC DIP DIP
包装说明 0.600 INCH, PLASTIC, DIP-32 8 X 20 MM, PLASTIC, TSOP1-32 0.600 INCH, PLASTIC, DIP-32 8 X 14 MM, PLASTIC, TVSOP1-32 PLASTIC, LCC-32 PLASTIC, LCC-32 8 X 20 MM, PLASTIC, TSOP1-32 8 X 14 MM, PLASTIC, VSOP-32 0.600 INCH, PLASTIC, DIP-32 0.600 INCH, PLASTIC, DIP-32
针数 32 32 32 32 32 32 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 90 ns 70 ns 90 ns 70 ns 70 ns 70 ns 70 ns 90 ns 70 ns 70 ns
启动块 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
命令用户界面 YES YES YES YES YES YES YES YES YES YES
数据轮询 YES YES YES YES YES YES YES YES YES YES
JESD-30 代码 R-PDIP-T32 R-PDSO-G32 R-PDIP-T32 R-PDSO-G32 R-PQCC-J32 R-PQCC-J32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32 R-PDIP-T32
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 42.05 mm 18.4 mm 42.05 mm 12.4 mm 13.97 mm 13.97 mm 18.4 mm 12.4 mm 42.037 mm 42.037 mm
内存密度 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1 1
部门数/规模 1,1 1,1 1,1 1,1 1,1 1,1 1,1 1,1 1,1 1,1
端子数量 32 32 32 32 32 32 32 32 32 32
字数 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000 64000 64000 64000 64000 64000 64000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 85 °C 85 °C 85 °C 70 °C
最低工作温度 - - -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C -
组织 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP TSOP1 DIP TSOP1 QCCJ QCCJ TSOP1 TSOP1 DIP DIP
封装等效代码 DIP32,.6 TSSOP32,.8,20 DIP32,.6 TSSOP32,.56,20 LDCC32,.5X.6 LDCC32,.5X.6 TSSOP32,.8,20 TSSOP32,.56,20 DIP32,.6 DIP32,.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE CHIP CARRIER CHIP CARRIER SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
编程电压 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.59 mm 1.2 mm 5.59 mm 1.2 mm 3.56 mm 3.56 mm 1.2 mm 1.2 mm 4.826 mm 4.826 mm
部门规模 8K,56K 8K,56K 8K,56K 8K,56K 8K,56K 8K,56K 8K,56K 8K,56K 8K,56K 8K,56K
最大待机电流 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
最大压摆率 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 NO YES NO YES YES YES YES YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING J BEND J BEND GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 0.5 mm 2.54 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm 0.5 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL QUAD QUAD DUAL DUAL DUAL DUAL
切换位 YES YES YES YES YES YES YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 15.24 mm 8 mm 15.24 mm 8 mm 11.43 mm 11.43 mm 8 mm 8 mm 15.24 mm 15.24 mm
厂商名称 Atmel (Microchip) Atmel (Microchip) - - - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
湿度敏感等级 - 3 - 3 2 2 3 3 - -
峰值回流温度(摄氏度) - 240 - 240 225 225 240 240 - -
处于峰值回流温度下的最长时间 - 30 - 30 30 30 30 30 - -
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