型号
- 型号
- 关键词
| 型号 | AT88SC200-JC | AT88SC200-SI | AT88SC200-W | AT88SC200-JI | AT88SC200-SC | AT88SC200-PC | AT88SC200-PI |
|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 2KX1, CMOS, PQCC8, PLASTIC, LCC-8 | Memory Circuit, 2KX1, CMOS, PDSO8, SOIC-8 | Memory Circuit, 2KX1, CMOS, DIE-8 | Memory Circuit, 2KX1, CMOS, PQCC8, PLASTIC, DCC-8 | Memory Circuit, 2KX1, CMOS, PDSO8, SOIC-8 | Memory Circuit, 2KX1, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Memory Circuit, 2KX1, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | LCC | SOIC | DIE | QFN | SOIC | DIP | DIP |
| 包装说明 | QCCJ, | SOP, | DIE, | QCCJ, | SOP, | DIP, | DIP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-PQCC-J8 | R-PDSO-G8 | X-XUUC-N8 | S-PQCC-J8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 |
| 内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 2KX1 | 2KX1 | 2KX1 | 2KX1 | 2KX1 | 2KX1 | 2KX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | SOP | DIE | QCCJ | SOP | DIP | DIP |
| 封装形状 | SQUARE | RECTANGULAR | UNSPECIFIED | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | UNCASED CHIP | CHIP CARRIER | SMALL OUTLINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | J BEND | GULL WING | NO LEAD | J BEND | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | QUAD | DUAL | UPPER | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 长度 | 11.5062 mm | - | - | 11.5062 mm | - | 9.395 mm | 9.395 mm |
| 座面最大高度 | 4.57 mm | - | - | 4.57 mm | - | 4.32 mm | 4.32 mm |
| 端子节距 | 1.27 mm | - | - | 1.27 mm | - | 2.54 mm | 2.54 mm |
| 宽度 | 11.5062 mm | - | - | 11.5062 mm | - | 7.62 mm | 7.62 mm |
分立器件
嵌入式系统
stm32/stm8
嵌入式系统
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