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ATSAM3U_10

32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100
32位, FLASH, 12 MHz, 精简指令集微控制器, PQFP100

器件类别:半导体    嵌入式处理器和控制器   

厂商名称:Atmel (Microchip)

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器件参数
参数名称
属性值
功能数量
1
端子数量
100
最大工作温度
85 Cel
最小工作温度
-40 Cel
最大供电/工作电压
1.95 V
最小供电/工作电压
1.62 V
额定供电电压
1.8 V
外部数据总线宽度
8
输入输出总线数量
96
线速度
12 MHz
加工封装描述
14 × 14 MM, 0.50 MM PITCH, 绿色, MS-026, LQFP-100
状态
EOL/LIFEBUY
包装形状
SQUARE
包装尺寸
FLATPACK, 低 PROFILE, FINE PITCH
表面贴装
Yes
端子形式
GULL WING
端子间距
0.5000 mm
端子涂层
NOT SPECIFIED
端子位置
包装材料
塑料/环氧树脂
温度等级
INDUSTRIAL
ADC通道
Yes
地址总线宽度
24
位数
32
最大FCLK时钟频率
12 MHz
DAC通道
Yes
DMA通道
Yes
微处理器类型
精简指令集微控制器
PWM通道
Yes
ROM编程
FLASH
文档预览
Features
Core
– ARM
®
Cortex
®
-M3 revision 2.0 running at up to 96 MHz
– Memory Protection Unit (MPU)
– Thumb
®
-2 instruction set
Memories
– From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,
dual bank
– From 16 to 48 Kbytes embedded SRAM with dual banks
– 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines
– Static Memory Controller (SMC): SRAM, NOR, NAND support. NAND Flash
controller with 4 Kbytes RAM buffer and ECC
System
– Embedded voltage regulator for single supply operation
– POR, BOD and Watchdog for safe reset
– Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768
kHz for RTC or device clock.
– High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default
Frequency for fast device startup
– Slow Clock Internal RC oscillator as permanent clock for device clock in low power
mode
– One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Device
– Up to 17 peripheral DMA (PDC) channels and 4-channel central DMA
Low Power Modes
– Sleep and Backup modes, down to 2.5 µA in Backup mode
– Backup domain: VDDBU pin, RTC, 32 backup registers
– Ultra low power RTC: 0.6 µA
Peripherals
– USB 2.0 Device: 480 Mbps, 4-kbyte FIFO, up to 7 bidirectional Endpoints,
dedicated DMA
– Up to 4 USARTs (ISO7816, IrDA
®
, Flow Control, SPI, Manchester support) and one
UART
– Up to 2 TWI (I2C compatible), 1 SPI, 1 SSC (I2S), 1 HSMCI (SDIO/SD/MMC)
– 3-Channel 16-bit Timer/Counter (TC) for capture, compare and PWM
– 4-channel 16-bit PWM (PWMC)
– 32-bit Real Time Timer (RTT) and RTC with calendar and alarm features
– 8-channel 12-bit 1MSPS ADC with differential input mode and programmable gain
stage, 8-channel 10-bit ADC
I/O
– Up to 96 I/O lines with external interrupt capability (edge or level sensitivity),
debouncing, glitch filtering and on-die Series Resistor Termination
– Three 32-bit Parallel Input/Outputs (PIO)
Packages
– 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm
– 100-ball LFBGA, 9 x 9 mm, pitch 0.8 mm
– 144-lead LQFP, 20 x 20 mm, pitch 0.5 mm
– 144-ball LFBGA, 10 x 10 mm, pitch 0.8 mm
AT91ARM
Cortex M3-based
Microcontrollers
ATSAM3U Series
Preliminary
Summary
NOTE:
This is a summary document.
The complete document is available on
the Atmel website at www.atmel.com.
6430CS–ATARM–09-Apr-10
1. SAM3U Description
Atmel's SAM3U series is a member of a family of Flash microcontrollers based on the high per-
formance 32-bit ARM Cortex-M3 RISC processor. It operates at a maximum speed of 96 MHz
and features up to 256 Kbytes of Flash and up to 52 Kbytes of SRAM. The peripheral set
includes a High Speed USB Device port with embedded transceiver, a High Speed MCI for
SDIO/SD/MMC, an External Bus Interface with NAND Flash controller, up to 4xUSARTs
(SAM3U1C/2C/4C have 3), up to 2xTWIs (SAM3U1C/2C/4C have 1), up to 5xSPIs
SAM3U1C/2C/4C have 4), as well as 4xPWM timers, 3xgeneral purpose 16-bit timers, an RTC,
a 12-bit ADC and a 10-bit ADC.
The SAM3U architecture is specifically designed to sustain high speed data transfers. It includes
a multi-layer bus matrix as well as multiple SRAM banks, PDC and DMA channels that enable it
to run tasks in parallel and maximize data throughput.
It can operate from 1.62V to 3.6V and comes in 100-pin and 144-pin LQFP and BGA packages.
The SAM3U device is particularly well suited for USB applications: data loggers, PC peripherals
and any high speed bridge (USB to SDIO, USB to SPI, USB to External Bus Interface).
1.1
Configuration Summary
The SAM3U series differ in memory sizes, package and features list.
Table 1-1
summarizes the
configurations of the six devices.
Table 1-1.
Configuration Summary
Flash
Organization SRAM
dual plane
52
Kbytes
36
Kbytes
20
Kbytes
52
Kbytes
36
Kbytes
20
Kbytes
Number
of PIOs
96
Number
of
USARTs
4
Number
of TWI
2
FWUP,
SHDN
pins
Yes
External Bus
Interface
8 or 16 bits,
4 chip selects,
24-bit address
8 or 16 bits,
4 chip selects
24-bit address
8 or 16 bits,
4 chip selects,
24-bit address
8 bits,
2 chip selects,
8-bit address
HSMCI
data
size
8 bits
Device
SAM3U4E
Flash
2x128
Kbytes
128
Kbytes
64
Kbytes
2 x 128
Kbytes
128
Kbytes
64
Kbytes
Package
LQFP144
BGA144
LQFP144
BGA144
LQFP144
BGA144
LQFP100
BGA100
LQFP100
BGA100
LQFP100
BGA100
ADC
2 (8+ 8
channels)
2 (8+ 8
channels)
2 (8+ 8
channels)
2 (4+ 4
channels)
2 (4+ 4
channels)
2 (4+ 4
channels)
SAM3U2E
single plane
96
4
2
Yes
8 bits
SAM3U1E
single plane
96
4
2
Yes
8 bits
SAM3U4C
dual plane
57
3
1
FWUP
4 bits
SAM3U2C
single plane
57
3
1
FWUP
8 bits,
2 chip selects, 8- 4 bits
bit address
8 bits
2 chip selects,
8-bit address
4 bits
SAM3U1C
single plane
57
3
1
FWUP
Note:
1. The SRAM size takes into account the 4-Kbyte RAM buffer of the NAND Flash Controller (NFC) which can be used by the
core if not used by the NFC.
2
SAM3U Series
6430CS–ATARM–09-Apr-10
SAM3U Series
2. SAM3U Block Diagram
Figure 2-1.
144-pin SAM3U4/2/1E Block Diagram
TD
TDI
TMO/T
R
TC S/S AC
K/ WD ES
SW IO W
O
CL
K
D
V B UT
D G MII
F
D S DP
F
D SD
H M
D SD
H P
SD
M
L
SE
JT
AG
DI
MASTER
SLAVE
System Controller
TST
PCK0
-PCK2
JTAG & Serial Wire
HS UTMI
Transceiver
USB
Device
HS
VD
VD
VD
DO
N
UT
PLLA
UPLL
In-Circuit Emulator
SysTick Counter N
V
Cortex-M3 Processor
I
Fmax 96 MHz
C
MPU
I/D
Flash
Unique
Identifier
S
Voltage
Regulator
EBI
XIN
XOUT
OSC
3-20 M
RC Osc.
12/8/4 M
WDT
PMC
NAND Flash
Controller
& ECC
DMA
NANDRDY
D0-D15
A0/NBS0
A1
A2-A20
NCS0
NCS1
NRD
NWR0/NWE
NWR1/NBS1
Static
Memory
Controller
NWAIT
A23
A21/
NANDALE
A22/
NANDCLE
NCS3
SPI
SSC
HSMCI
NCS2
NANDOE,
NANDWE
5-layer AHB Bus Matrix
NAND Flash
SRAM
(4KBytes)
VDDUTMI
VDDCORE
SM
BOD
RC 32K
8
GPBREG
RTT
RTC
XIN32
XOUT32
SHDN
FWUP
VDDBU
NRSTB
ERASE
NRST
OSC
32K
SUPC
POR
FLASH
2x128 KBytes
1x128 KBytes
1x64 KBytes
SRAM0
32 KBytes
16 KBytes
8 KBytes
SRAM1
16 KBytes
16 KBytes
ROM
16 KBytes
APB
Peripheral
DMA
Controller
Peripheral
Bridge
4-Channel
DMA
PDC
8-channel
12-bit ADC
10-bit ADC
PDC
TWI0
TWI1
PDC
PDC
USART0
USART1
USART2
USART3
PDC
PWM
TC0
TC1
TC2
RSTC
PIOA
PIOC
PIOB
UART
AD
VR
E
AD
T
BV
RG VD RE
-A DA F
D1 NA
AD
2
12 A BT
B0 D0 RG
-A -A
D
TW D12 7
TW D
B
C 0- 7
K0 TW
-T D
W 1
C
K
U 1
R
C U XD
TS T
X
RT 0-C D
SC SO TS
R K0 -RT 3
D - S
TXX0 SC 3
D -RDK3
0- X
TX 3
D D3
C
D
0
PW
D RI0
SR
M
PW H D 0
0
T
M -P R0
L0 W
TC -P MH
L WM 3
TI K0- L3
O T
TI A0 CL
O -T K2
N B0- IOA
PC T 2
S0 IOB
-N 2
PC
SP S3
C
M K
O
M SI
IS
O
TK
TF
TD
R
D
R
F
DA RK
0-
DA
C 7
DA
C
K
F-
AD
12
3
6430CS–ATARM–09-Apr-10
Figure 2-2.
100-pin SAM3U4/2/1C Block Diagram
TD
I
TD
O
TM / T
S RA
TC / S C E
K/ WD SW
SW IO O
CL
K
JT
AG
SE
L
D
VB U T
G M
D
II
F
D SD P
FS
D DM
H
D SD
H P
SD
M
N
VD
MASTER
SLAVE
System Controller
TST
PCK0
-PCK2
JTAG & Serial Wire
HS UTMI
Transceiver
USB
Device
HS
VD
VD
DO
DI
UT
PLLA
UPLL
In-Circuit Emulator
SysTick Counter N
V
Cortex-M3 Processor
I
Fmax 96 MHz
C
MPU
I/D
Flash
Unique
Identifier
S
Voltage
Regulator
EBI
XIN
XOUT
OSC
3-20 M
RC Osc.
12/8/4 M
WDT
PMC
NAND Flash
Controller
& ECC
DMA
NANDRDY
D0-D7
A0
A1
A2-A7
NCS0
NCS1
NRD
NWE
Static
Memory
Controller
5-layer AHB Bus Matrix
NAND Flash
SRAM
(4KBytes)
VDDUTMI
VDDCORE
SM
BOD
RC 32K
8
GPBREG
RTT
RTC
XIN32
XOUT32
SHDN
FWUP
VDDBU
NRSTB
ERASE
NRST
OSC
32K
SUPC
POR
FLASH
2x128 KBytes
1x128 KBytes
1x64 KBytes
SRAM0
32 KBytes
16 KBytes
8 KBytes
SRAM1
16 KBytes
16 KBytes
ROM
16 KBytes
APB
Peripheral
DMA
Controller
Peripheral
Bridge
4-Channel
DMA
NANDALE
NANDCLE
PDC
4-channel
12-bit ADC
10-bit ADC
PDC
PDC
PDC
USART0
USART1
USART2
PDC
PWM
TC0
TC1
TC2
SPI
SSC
HSMCI
NANDOE,
NANDWE
RSTC
PIOA
PIOB
TWI
UART
4
SAM3U Series
6430CS–ATARM–09-Apr-10
AD
VR
E
AD
12
AD
B
TR V VR
G DD EF
-A
A
D1 NA
AD
2B
12 A T
B0 D0 RG
-A -A
D
TW D12 3
TW D
B
C 0- 3
K0 TW
-T D
W 1
C
K
U 1
R
C U XD
TS T
X
RT 0-C D
SC SO TS
R K0 -RT 2
D - S
TXX0 SC 2
D -RDK2
0- X
TX 2
D D2
C
D
0
PW
D RI0
SR
M
PW H D 0
0
T
M -P R0
L0 W
M
TC -P H
L WM 3
TI K0- L3
O T
TI A0 CL
O -T K2
N B0- IOA
PC T 2
S0 IOB
-N 2
PC
SP S3
C
M K
O
M SI
IS
O
TK
TF
TD
R
D
R
F
DA RK
0-
DA
3
C
DA
C
K
F-
SAM3U Series
3. Signal Description
Table 3-1
gives details on the signal names classified by peripheral.
Table 3-1.
Signal Name
Signal Description List
Function
Type
Power Supplies
Active
Level
Voltage
Reference Comments
VDDIO
VDDIN
VDDOUT
VDDUTMII
GNDUTMII
VDDBU
GNDBU
VDDPLL
GNDPLL
VDDANA
GNDANA
VDDCORE
GND
Peripherals I/O Lines Power Supply
Voltage Regulator Input
Voltage Regulator Output
USB UTMI+ Interface Power Supply
USB UTMI+ Interface Ground
Backup I/O Lines Power Supply
Backup Ground
PLL A, UPLL and OSC 3-20 MHz Power Supply
PLL A, UPLL and OSC 3-20 MHz Ground
ADC Analog Power Supply
ADC Analog Ground
Core, Memories and Peripherals Chip Power
Supply
Ground
Power
Power
Power
Power
Ground
Power
Ground
Power
Ground
Power
Ground
Power
Ground
1.62V to 3.6V
1.8V to 3.6V
1.8V
3.0V to 3.6V
1.62V to 3.6V
1.62 V to 1.95V
2.0V to 3.6V
1.62V to 1.95V
Clocks, Oscillators and PLLs
XIN
XOUT
XIN32
XOUT32
VBG
PCK0 - PCK2
Main Oscillator Input
Main Oscillator Output
Slow Clock Oscillator Input
Slow Clock Oscillator Output
Bias Voltage Reference
Programmable Clock Output
Input
Output
Input
Output
Analog
Output
Shutdown, Wakeup Logic
push/pull
0: The device is in
backup mode
1: The device is running
(not in backup mode)
Needs external pull-up
VDDIO
VDDBU
VDDPLL
SHDN
Shut-Down Control
Output
VDDBU
FWUP
Force Wake-Up Input
Input
Low
Serial Wire/JTAG Debug Port (SWJ-DP)
TCK/SWCLK
TDI
TDO/TRACESWO
TMS/SWDIO
JTAGSEL
Test Clock/Serial Wire Clock
Test Data In
Test Data Out/Trace Asynchronous Data Out
Test Mode Select/Serial Wire Input/Output
JTAG Selection
Input
Input
Output
Input
Input
High
VDDBU
VDDIO
No pull-up resistor
No pull-up resistor
No pull-up resistor
Internal permanent
pull-down
5
6430CS–ATARM–09-Apr-10
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参数对比
与ATSAM3U_10相近的元器件有:ATSAM3U、ATSAM3U1CA-AU、ATSAM3U1EA-AU、ATSAM3U1EA-CU、ATSAM3U2CA-AU、ATSAM3U2EA-AU、ATSAM3U4CA-AU、ATSAM3U4EA-CU、ATSAM3U4CA-CU。描述及对比如下:
型号 ATSAM3U_10 ATSAM3U ATSAM3U1CA-AU ATSAM3U1EA-AU ATSAM3U1EA-CU ATSAM3U2CA-AU ATSAM3U2EA-AU ATSAM3U4CA-AU ATSAM3U4EA-CU ATSAM3U4CA-CU
描述 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP144 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PQFP100 32-BIT, FLASH, 12 MHz, RISC MICROCONTROLLER, PBGA100
端子数量 100 100 100 144 144 100 144 100 144 100
外部数据总线宽度 8 8 8 8 8 8 8 8 8 8
表面贴装 Yes Yes YES YES YES YES YES YES YES YES
端子形式 GULL WING GULL WING GULL WING GULL WING BALL GULL WING GULL WING GULL WING BALL BALL
端子位置 QUAD QUAD BOTTOM QUAD QUAD QUAD BOTTOM BOTTOM
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
地址总线宽度 24 24 24 24 24 24 24 24 24 24
是否Rohs认证 - - 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 - - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
零件包装代码 - - QFP QFP BGA QFP QFP QFP BGA BGA
包装说明 - - 14 X 14 MM, 0.50 MM PITCH, GREEN, MS-026, LQFP-100 LFQFP, QFP144,.87SQ,20 LFBGA, BGA144,12X12,32 LFQFP, QFP100,.63SQ,20 LFQFP, QFP144,.87SQ,20 LFQFP, QFP100,.63SQ,20 LFBGA, BGA144,12X12,32 TFBGA, BGA100,10X10,32
针数 - - 100 144 144 100 144 100 144 100
Reach Compliance Code - - unknow unknown unknow compliant compliant compliant compli compli
ECCN代码 - - 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2
Factory Lead Time - - 1 week 1 week 1 week - 1 week 1 week 1 week -
具有ADC - - YES YES YES YES YES YES YES YES
位大小 - - 32 32 32 32 32 32 32 32
CPU系列 - - CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3
最大时钟频率 - - 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz
DAC 通道 - - YES YES YES YES YES YES YES YES
DMA 通道 - - YES YES YES YES YES YES YES YES
JESD-30 代码 - - S-PQFP-G100 S-PQFP-G144 S-PBGA-B144 S-PQFP-G100 S-PQFP-G144 S-PQFP-G100 S-PBGA-B144 S-PBGA-B100
长度 - - 14 mm 20 mm 10 mm 14 mm 20 mm 14 mm 10 mm 9 mm
I/O 线路数量 - - 96 96 96 96 96 96 96 96
最高工作温度 - - 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 - - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
PWM 通道 - - YES YES YES YES YES YES YES YES
封装主体材料 - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - - LFQFP LFQFP LFBGA LFQFP LFQFP LFQFP LFBGA TFBGA
封装等效代码 - - QFP100,.63SQ,20 QFP144,.87SQ,20 BGA144,12X12,32 QFP100,.63SQ,20 QFP144,.87SQ,20 QFP100,.63SQ,20 BGA144,12X12,32 BGA100,10X10,32
封装形状 - - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 - - FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
电源 - - 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM(字节) - - 20480 20480 20480 36864 36864 53248 53248 53248
ROM(单词) - - 65536 65536 65536 32768 32768 65536 65536 65536
ROM可编程性 - - FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
座面最大高度 - - 1.6 mm 1.45 mm 1.4 mm 1.6 mm 1.45 mm 1.6 mm 1.4 mm 1.1 mm
速度 - - 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz 12 MHz
最大供电电压 - - 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
最小供电电压 - - 1.62 V 1.62 V 1.62 V 1.62 V 1.62 V 1.62 V 1.62 V 1.62 V
标称供电电压 - - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
技术 - - CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子节距 - - 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm
宽度 - - 14 mm 20 mm 10 mm 14 mm 20 mm 14 mm 10 mm 9 mm
uPs/uCs/外围集成电路类型 - - MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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