BM70/71
Bluetooth
®
Low Energy (BLE) Module
Features
• Qualified for Bluetooth SIG v5.0 core specification
• Certified to FCC, ISED, MIC, KCC, NCC, and
SRRC radio regulations
• Certified by European RED Assessed Radio
module
• Compliant to RoHS
• Supports UART interface
• Supports transparent UART data service of BLE
• The BM70 module supports 3-channel pulse-
width modulation (PWM) and the BM71 module
supports 1-channel PWM
• Supports Precision Temperature Sensor (PTS)
for ambient temperature detection
• Supports 12-bit ADC (ENOB=10 or 8 bits) for
battery and voltage detection
• Provides 8-channel ADC for the BM70 module
and 5-channel ADC for the BM71 module
• Features 18 general purpose I/O (GPIO) pins for
the BM70 module and 9 GPIO pins for the BM71
module
• Features integrated 32 MH
Z
crystal
• Small and compact surface mount module
• Castellated surface mount pads for easy and
reliable host PCB mounting
FIGURE 1:
BM70 MODULE
FIGURE 2:
BM71 MODULE
RF Features
•
•
•
•
•
ISM band 2.402 GHz to 2.480 GHz operation
Channels: 0 to 39
Receive Sensitivity: typical -90 dBm (LE)
Transmit Power: 0 dBm (typical)
Received Signal Strength Indication (RSSI)
monitor with 1 dB resolution
Antenna
• Integrated chip antenna (BM7xBLES1FC2)
- Refer to
4.0 “Antenna”,
Table 4-1,
and
Table 4-2
for antenna performance
specifications
• External antenna connection through RF pad
(BM7xBLE01FC2)
MAC/Baseband/Higher Layer Features
• Secure AES128 encryption
• Bluetooth 4.2 specification optional features: GAP,
GATT, SMP, L2CAP and integrated public profile
• To create custom GATT services, refer to the
“BM70/71
Bluetooth® Low Energy Module User’s
Guide”
(DS50002542) for details.
• Configurable role as peripheral/central, client/
server
Power Management
• Two low power modes supported, with wake-up
through GPIO or internal timer
• Average current: Tx=3.3 mA and Rx=3.2 mA with
buck at 3.0V V
BAT
input and 18.75 ms connection
interval, when transmitting full data packets to
achieve a data rate of approximately 8.6 kbps
2015-2018 Microchip Technology Inc.
DS60001372H-Page 1
BM70/71
Operating Conditions
• Operating voltage range: 1.9V to 3.6V
• Operating temperature: -40ºC to +85ºC
Applications
•
•
•
•
•
•
•
Internet of Things (IoT)
Secure Payment
Wearable Devices
Home and Security
Health and Fitness
Beacons
Industrial and Data Logger
General Description
The BM70/71 module offers BLE solutions for embed-
ded applications. It conforms to the Bluetooth 5 core
specification to enhance the throughput and security
for the IoT applications. It also supports beacon
technology to enhance the user experience for the IoT
applications, and enables users to control the cloud
and receive data without opening the application
through a smartphone.
The BM70/71 module has an integrated Bluetooth
stack and is available in different form factors to
optimize space, cost, and RF performance. The power-
optimized design minimizes the current consumption
and extends battery life for portable and wearable
applications.
DS60001372H-Page 2
2015-2018 Microchip Technology Inc.
BM70/71
Table of Contents
1.0 Device Overview .............................................................................................................................................................................. 5
2.0 Application Information .................................................................................................................................................................. 13
3.0 Module Configuration ..................................................................................................................................................................... 25
4.0 Antenna.......................................................................................................................................................................................... 27
5.0 Electrical Characteristics................................................................................................................................................................ 37
6.0 Physical Dimensions ...................................................................................................................................................................... 43
7.0 Soldering Recommendations ......................................................................................................................................................... 51
8.0 Ordering Guide .............................................................................................................................................................................. 53
Appendix A: Certification Notices......................................................................................................................................................... 55
Appendix B: Revision History............................................................................................................................................................... 63
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Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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2015-2018 Microchip Technology Inc.
DS60001372H-Page 3
BM70/71
NOTES:
DS60001372H-Page 4
2015-2018 Microchip Technology Inc.
BM70/71
1.0
DEVICE OVERVIEW
The BM70/71 module is built around Microchip
Technology IS1870/71 BLE Integrated Circuit (IC). The
IS1870/71 IC includes an on board Bluetooth stack, a
power management subsystem, a 2.4 GHz transceiver,
and an RF power amplifier. The user can embed
Bluetooth functionality into any product using the
BM70/71 module.
The BM70/71 module enables the following features:
•
•
•
•
Simple integration and programming
Reduced development time
Superior wireless module with a low-cost system
Interoperability with Apple® iOS and Android™
OS
• A wide range of applications
The BM70/71 module can independently maintain a low
power wireless connection. Low power and flexible
power management features maximize the lifetime of the
BM70/71 module in battery-operated devices. A wide
operating temperature range enables its applications in
indoor and outdoor environments.
The BM70/71 module is a small, compact, and
surface-mounted module with castellated pads for easy
and reliable host PCB mounting. The relatively small
form factor of the module is targeted for applications,
such as wearable sports, fitness devices and so on.
1.1
Interface Description
Figure 1-1
and
Figure 1-2
illustrate an example of the
BM70/71 module-based system.
FIGURE 1-1:
BM70 MODULE BLOCK DIAGRAM
Note 1:
SPI and I
2
C peripherals of the IS1870/71 IC can be enabled on the BM70/71 module by changing the
default firmware. For more details, contact a local Microchip representative.
2015-2018 Microchip Technology Inc.
DS60001372H-Page 5
