Operational Amplifier, 1 Func, 6000uV Offset-Max, CMOS, PDSO5, ROHS COMPLIANT, HVSOF-5
厂商名称:ROHM(罗姆半导体)
器件标准:
下载文档型号 | BU7295SHFV | BU7242SNUX | BU7262SNUX |
---|---|---|---|
描述 | Operational Amplifier, 1 Func, 6000uV Offset-Max, CMOS, PDSO5, ROHS COMPLIANT, HVSOF-5 | Operational Amplifier, 2 Func, 10000uV Offset-Max, CMOS, PDSO8, 2 X 3 MM, ROHS COMPLIANT, VSON-8 | Operational Amplifier, 2 Func, 10000uV Offset-Max, CMOS, PDSO8, 2 X 3 MM, ROHS COMPLIANT, VSON-8 |
是否Rohs认证 | 符合 | 符合 | 符合 |
零件包装代码 | SOF | SON | SON |
包装说明 | VSOF, | 2 X 3 MM, ROHS COMPLIANT, VSON-8 | HVSON, |
针数 | 5 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
标称共模抑制比 | 60 dB | 60 dB | 60 dB |
最大输入失调电压 | 6000 µV | 10000 µV | 10000 µV |
JESD-30 代码 | R-PDSO-F5 | R-PDSO-N8 | R-PDSO-N8 |
长度 | 1.6 mm | 3 mm | 3 mm |
功能数量 | 1 | 2 | 2 |
端子数量 | 5 | 8 | 8 |
最高工作温度 | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VSOF | HVSON | HVSON |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
座面最大高度 | 0.6 mm | 0.6 mm | 0.6 mm |
标称压摆率 | 1 V/us | 0.4 V/us | 1.1 V/us |
供电电压上限 | 7 V | 7 V | 7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES |
技术 | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | FLAT | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
标称均一增益带宽 | 1000 kHz | 900 kHz | 2000 kHz |
宽度 | 1.2 mm | 2 mm | 2 mm |
是否无铅 | 不含铅 | 不含铅 | - |
JESD-609代码 | e2 | e3 | - |
认证状态 | Not Qualified | Not Qualified | - |
端子面层 | TIN COPPER | Matte Tin (Sn) | - |
Base Number Matches | 1 | 1 | - |