型号 | CAT24WC66LA-C | CAT24WC66LE-1.8-C | CAT24WC66LI-GC | CAT24WC66LA-1.8-C | CAT24WC66LI-1.8-GC | CAT24WC66WA-C | CAT24WC66WE-C | CAT24WC66WE-GC | CAT24WC66WI-C |
---|---|---|---|---|---|---|---|---|---|
描述 | IC,SERIAL EEPROM,8KX8,CMOS,DIP,8PIN,PLASTIC | IC,SERIAL EEPROM,8KX8,CMOS,DIP,8PIN,PLASTIC | IC,SERIAL EEPROM,8KX8,CMOS,DIP,8PIN,PLASTIC | IC IC,SERIAL EEPROM,8KX8,CMOS,DIP,8PIN,PLASTIC, Programmable ROM | IC,SERIAL EEPROM,8KX8,CMOS,DIP,8PIN,PLASTIC | IC IC,SERIAL EEPROM,8KX8,CMOS,SOP,8PIN,PLASTIC, Programmable ROM | IC,SERIAL EEPROM,8KX8,CMOS,SOP,8PIN,PLASTIC | IC,SERIAL EEPROM,8KX8,CMOS,SOP,8PIN,PLASTIC | IC,SERIAL EEPROM,8KX8,CMOS,SOP,8PIN,PLASTIC |
是否无铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 不符合 |
包装说明 | DIP-8 | DIP-8 | DIP-8 | DIP-8 | DIP-8 | SOIC-8 | SOIC-8 | SOIC-8 | SOIC-8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
JESD-30 代码 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 9.27 mm | 9.27 mm | 9.27 mm | 9.27 mm | 9.27 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 105 °C | 125 °C | 85 °C | 105 °C | 85 °C | 105 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP | SOP | SOP | SOP | SOP |
封装等效代码 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | NOT SPECIFIED | NOT SPECIFIED | 225 | NOT SPECIFIED |
电源 | 3/5 V | 2/5 V | 3/5 V | 2/5 V | 2/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.33 mm | 5.33 mm | 5.33 mm | 5.33 mm | 5.33 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大待机电流 | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |