型号
- 型号
- 关键词
| 型号 | CBT3245ABQ,118 | CBT3245APW,112 | CBT3245APW,118 | CBT3245ABQ,115 |
|---|---|---|---|---|
| 描述 | Octal bus switch | Octal bus switch | Octal bus switch | Octal bus switch |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFN | TSSOP2 | TSSOP2 | QFN |
| 包装说明 | HVQCCN, LCC20,.1X.18,20 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | HVQCCN, LCC20,.1X.18,20 |
| 针数 | 20 | 20 | 20 | 20 |
| 制造商包装代码 | SOT764-1 | SOT360-1 | SOT360-1 | SOT764-1 |
| Reach Compliance Code | unknow | compli | compli | compli |
| 系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PQCC-N20 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 4.5 mm | 6.5 mm | 6.5 mm | 4.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 8 | 8 | 1 |
| 功能数量 | 8 | 1 | 1 | 8 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | TSSOP | TSSOP | HVQCCN |
| 封装等效代码 | LCC20,.1X.18,20 | TSSOP20,.25 | TSSOP20,.25 | LCC20,.1X.18,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 传播延迟（tpd） | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.2 mm | 1.2 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4 V | 4 V | 4 V | 4 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
| 宽度 | 2.5 mm | 4.4 mm | 4.4 mm | 2.5 mm |
