型号
- 型号
- 关键词
| 型号 | CD4007UBH | CD4007UBE | CD4007UBF | CD4007UBD |
|---|---|---|---|---|
| 描述 | Gate, CMOS | Gate, CMOS, PDIP14, | Gate, CMOS, CDIP14, | Gate, CMOS, CDIP14, |
| 包装说明 | , DIE OR CHIP | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C |
| 封装等效代码 | DIE OR CHIP | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
| JESD-30 代码 | - | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609代码 | - | e0 | e0 | e0 |
| 端子数量 | - | 14 | 14 | 14 |
| 封装主体材料 | - | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | - | DIP | DIP | DIP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | - | NO | NO | NO |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL |
