CD4038AK,CD4038AK pdf中文资料,CD4038AK引脚图,CD4038AK电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

RCA

包装说明

DFP, FL16,.3

Reach Compliance Code

unknown

JESD-30 代码

R-XDFP-F16

JESD-609代码

逻辑集成电路类型

ADDER/SUBTRACTOR

端子数量

最高工作温度

125 °C

最低工作温度

-55 °C

封装主体材料

CERAMIC

封装代码

DFP

封装等效代码

FL16,.3

封装形状

RECTANGULAR

封装形式

FLATPACK

认证状态

Not Qualified

表面贴装

YES

技术

CMOS

温度等级

MILITARY

端子面层

Tin/Lead (Sn/Pb)

端子形式

FLAT

端子节距

1.27 mm

端子位置

DUAL

参数对比

与CD4038AK相近的元器件有：CD4032AD、CD4032AE、CD4032AF、CD4032AH、CD4038AD、CD4038AE、CD4038AF、CD4038AH。描述及对比如下：

型号	CD4038AK	CD4032AD	CD4032AE	CD4032AF	CD4032AH	CD4038AD	CD4038AE	CD4038AF	CD4038AH
描述	Adder/Subtractor, CMOS, CDFP16	Adder/Subtractor, CMOS, CDIP16	Adder/Subtractor, CMOS, PDIP16	Adder/Subtractor, CMOS, CDIP16	Adder/Subtractor, CMOS	Adder/Subtractor, CMOS, CDIP16	Adder/Subtractor, CMOS, PDIP16	Adder/Subtractor, CMOS, CDIP16	Adder/Subtractor, CMOS
包装说明	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	, DIE OR CHIP	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	, DIE OR CHIP
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
逻辑集成电路类型	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR
最高工作温度	125 °C	125 °C	85 °C	125 °C	125 °C	125 °C	85 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C
封装等效代码	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIE OR CHIP	DIP16,.3	DIP16,.3	DIP16,.3	DIE OR CHIP
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY
是否Rohs认证	不符合	不符合	不符合	不符合	-	不符合	不符合	不符合	-
厂商名称	RCA	-	-	-	-	RCA	RCA	RCA	RCA
JESD-30 代码	R-XDFP-F16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	-	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	-
JESD-609代码	e0	e0	e0	e0	-	e0	e0	e0	-
端子数量	16	16	16	16	-	16	16	16	-
封装主体材料	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	-	CERAMIC	PLASTIC/EPOXY	CERAMIC	-
封装代码	DFP	DIP	DIP	DIP	-	DIP	DIP	DIP	-
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
封装形式	FLATPACK	IN-LINE	IN-LINE	IN-LINE	-	IN-LINE	IN-LINE	IN-LINE	-
表面贴装	YES	NO	NO	NO	-	NO	NO	NO	-
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
端子形式	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-
端子节距	1.27 mm	2.54 mm	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm	-
端子位置	DUAL	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	-