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CLC115

Quad, Closed-Loop Monolithic Buffer

厂商名称：National Semiconductor（TI ）

厂商官网：http://www.ti.com

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CLC115
Quad, Closed-Loop Monolithic Buffer
June 1999
N
CLC115
Quad, Closed-Loop Monolithic Buffer
General Description
Features
s
s
s
s
s
s
s
Closed-loop, quad buffer
700MHz small-signal bandwidth
270V/µs slew rate
0.08%/0.04° differential gain/phase
60dB channel isolation (10MHz)
-62dBc 2nd and 3rd harmonics at 20MHz
60mA current output per channel
Multi-channel video distribution
Video switching buffers
High-speed analog multiplexing
Channelized EW
High-density buffering
Instrumentation amps
Active filters
Applications
s
s
s
s
s
s
s
CLC115AJP
CLC115AJE
CLC115ALC
CLC115AMC
8-pin plastic DIP
8-pin plastic SOIC
dice
dice qualified to Method 5008,
MIL-STD-883, Level B
MIL-STD-883, Level B
Contact factory for other packages and DESC SMD number.
-40°C
-40°C
-40°C
-55°C
to
to
to
to
+85°C
+85°C
+85°C
+125°C
Pinout
© 1999 National Semiconductor Corporation
Printed in the U.S.A.
http://www.national.com
CLC115 Electrical Characteristics
(V
cc
= +5V, R
L
= 100Ω; unless specified)
Min/max ratings are based on product characterization and simulation. Individual parameters are tested as noted. Outgoing quality levels are
determined from tested parameters.
Package Thermal Resistance
Package
Plastic (AJP)
Surface Mount (AJE)
θ
JC
55
°
C/W
45
°
C/W
θ
JA
105
°
C/W
115
°
C/W
Reliability Information
Transistor Count
http://www.national.com
64
2
CLC115 Typical Performance Characteristics
Ω
(T
A
= +25°, V
CC
= ±5V, R
L
= 100Ω; unless specified)
3
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参数对比
与CLC115相近的元器件有：CLC115AI、CLC115AJE、CLC115AJP、CLC115ALC、CLC115AMC、CLC115MDC。描述及对比如下：
型号 CLC115 CLC115AI CLC115AJE CLC115AJP CLC115ALC CLC115AMC CLC115MDC
描述 Quad, Closed-Loop Monolithic Buffer Quad, Closed-Loop Monolithic Buffer Quad, Closed-Loop Monolithic Buffer Quad, Closed-Loop Monolithic Buffer Quad, Closed-Loop Monolithic Buffer Quad, Closed-Loop Monolithic Buffer Quad, Closed-Loop Monolithic Buffer
零件包装代码 - - SOIC DIP WAFER WAFER WAFER
包装说明 - - SOP, SOP14,.25 DIP, DIP14,.3 DIE, DIE OR CHIP DIE, DIE OR CHIP DIE,
针数 - - 14 14 11 - 11
Reach Compliance Code - - unknow unknow unknow unknow unknow
ECCN代码 - - EAR99 EAR99 EAR99 EAR99 EAR99
放大器类型 - - BUFFER BUFFER BUFFER BUFFER BUFFER
最大平均偏置电流 (IIB) - - 20 µA 20 µA 20 µA 20 µA 20 µA
标称带宽 (3dB) - - 700 MHz 270 MHz 700 MHz 700 MHz 700 MHz
25C 时的最大偏置电流 (IIB) - - 20 µA 20 µA 20 µA 20 µA -
最大输入失调电压 - - 17000 µV 9000 µV 17000 µV 17000 µV -
JESD-30 代码 - - R-PDSO-G14 R-PDIP-T14 X-XUUC-N10 X-XUUC-N10 R-XUUC-N11
负供电电压上限 - - -7 V -7 V -7 V -7 V -7 V
标称负供电电压 (Vsup) - - -5 V -5 V -5 V -5 V -5 V
功能数量 - - 4 4 4 4 1
端子数量 - - 14 14 10 10 11
最高工作温度 - - 85 °C 85 °C 125 °C 125 °C -
最低工作温度 - - -40 °C -40 °C -55 °C -55 °C -
封装主体材料 - - PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 - - SOP DIP DIE DIE DIE
封装等效代码 - - SOP14,.25 DIP14,.3 DIE OR CHIP DIE OR CHIP -
封装形状 - - RECTANGULAR RECTANGULAR UNSPECIFIED UNSPECIFIED RECTANGULAR
封装形式 - - SMALL OUTLINE IN-LINE UNCASED CHIP UNCASED CHIP UNCASED CHIP
电源 - - +-5 V +-5 V +-5 V +-5 V -
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最小摆率 - - 2200 V/us 2200 V/us 2200 V/us 2200 V/us -
标称压摆率 - - 2700 V/us 2700 V/us 2700 V/us 2700 V/us 2700 V/us
最大压摆率 - - 61 mA 61 mA 61 mA 61 mA -
供电电压上限 - - 7 V 7 V 7 V 7 V 7 V
标称供电电压 (Vsup) - - 5 V 5 V 5 V 5 V 5 V
表面贴装 - - YES NO YES YES YES
技术 - - BIPOLAR BIPOLAR BIPOLAR BIPOLAR -
温度等级 - - INDUSTRIAL INDUSTRIAL MILITARY MILITARY -
端子形式 - - GULL WING THROUGH-HOLE NO LEAD NO LEAD NO LEAD
端子位置 - - DUAL DUAL UPPER UPPER UPPER
Base Number Matches - - 1 1 1 1 -
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