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COM EXPRESS® COMPACT TYPE 6 MODULE

conga-TCA

COM Express Type 6 Entry-Level-Module

Intel

Atom

™

Dual Core Generation on 32nm

Only 3.5 Watt TDP on Intel

Atom

™

Processor N2600

HD video performance 2D/3D

Up to 4 GB DDR3 memory

Formfactor

CPU

Formfactor COM Express™ Compact | (95 x 95 mm) | Type 6 Connector Layout

Intel

Atom

™

Processors

Intel

Atom

™

D2550

Intel

Atom™ N2800

Intel

Atom

™

N2600

1.86 GHz Dual Core

1.6 GHz Single Core

4 threads

L2 Cache 1MB

10W TDP

6.5W TDP

3.5W TDP

DRAM

Chipset

Ethernet

I/O Interfaces

Sound

Graphics

1 Socket SO-DIMM DDR3 up to 1066MT/s and 4 GByte

Intel® NM10 Express Chipset CG82NM10 PCH | TDP 2.1W

GBE Realtek 8111E

up to 5x PCIe | 2x Serial ATA II with 3 Gb/s

Digital High Definition Audio Interface with support for multiple audio codecs

Integrated Grapics | supporting DirectX 9 | Pixel Shader v3.0 and OGL 3.0

Two independent display pipes

Support full MPEG2 (VLD/iDCT/MC) | WMV | Fast video Composing | HW decode/acceleration for MPEG4 (AVC/H.264) & VC-1; 720p60 | 1080i60

1080p@24 up to 20 Mps

Video Image enhancements

1x24 Bit LVDS (D2550) max. Resolution 1440x900

1x18 Bit LVDS (N2000 Series) max. Resolution 1366x768

Automatic Panel Detection via EDID/EPI

2x DisplayPort 1.1 / TMDS (DVI | HDMI 1.3a)

350 MHz RAMDAC | resolutions up to 1920x1200

Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup

I²C bus (fast mode | 400 kHz | multi-master) | Power Loss Control

AMI Aptio® UEFI 2.x firmware | 4 MByte serial SPI firmware flash

Trusted Platform Module (TPM) optional.

Hash and RSA algorithms | key lengths up to 2,048 bits | real random number generator

ACPI 3.0 with battery support

Microsoft® Windows 8 | Microsoft® Windows 7 | Linux | Microsoft® Windows® embedded Standard

Typ. application: tbd. | see manual for full details | CMOS Battery Backup

Operating: 0 .. +60°C

Storage: -20 .. +80°C

Storage: 5 - 95% r. H. non cond.

LVDS

Digital Display Interface (DDI)

CRT Interface

congatec Board Controller

Embedded BIOS Features

Security

Power Management

Operating Systems

Power Consumption

Temperature

Humidity

Size

Operating: 10 - 90% r. H. non cond.

95 x 95 mm (3.74” x 3.74”)

www.congatec.com

conga-TCA

| Block diagram

A-B

Fan Control

GPIs/GPOs

8x USB 2.0

2x SATA II

PCIe x1

If No USB 3.0

Gbit Ethernet

PCIe x1

SM Bus

PCIe x1

LPC

I²C

SPI

LVDS

HDA

CRT

(Flash)

BIOS

PCIe

Switch

PCIe GBE

RTL8111E

TPM

PCIe x1

SM Bus

PCIe x1

Hardware

Monitoring

Watchdog

congatec

Board Controller

STM32F100R8

Intel

NM10

Express Chipset

GPIs/GPOs

SM Bus

PCIe2USB3

CG82NM10 PCH

DMI

Intel

Atom™

Processor

N2800

N2600

D2550

x2 (N2000)

x4 (D2000)

DDR3-SODIMM

max. 4 GByte

2x DP or HDMI

C-D

conga-TCA

| Order Information

Article

TCA/N2600

TCA/N2800

TCA/D2550

TCA/D2550 xHCI

TCA/HSP-T

TCA/HSP-B

TCA/CSP-T-LF

TCA/CSP-B-LF

TCA/CSP-T-HF

TCA/CSP-B-HF

DDR3-SODIMM-1066 (1GB)

DDR3-SODIMM-1066 (2GB)

DDR3-SODIMM-1066 (4GB)

47001

47002

47003

47004

47032

47033

47030

47031

47034

47035

68750

68760

68765

Description

COM Express Type 6 Compact module with Intel® Atom™ N2600 dual core processor with 1.6GHz, 1MB L2 cache and 800 MT/s DDR3

memory interface.

COM Express Type 6 Compact module with Intel® Atom™ N2800 dual core processor with 1.86GHz, 1MB L2 cache and 1066MT/s

DDR3 memory interface.

COM Express Type 6 Compact module with Intel® Atom™ D2550 dual core processor with 1.86GHz, 1MB L2 cache and 1066MT/s

DDR3 memory interface.

COM Express Type 6 Compact module with Intel® Atom™ D2550 dual core processor with 1.86GHz, 1MB L2 cache and 1066MT/s

DDR3 memory interface. PCI Express to dual port USB 3.0 onboard controller.

Standard heatspreader for COM Express modules conga-TCA and CCA. All standoffs are M2.5 thread.

Standard heatspreader for COM Express modules conga-TCA and CCA. All standoffs are 2.7mm bore hole.

Standard passive cooling solution for COM Express modules conga-TCA and CCA with 3mm fins. All standoffs are M2.5mm thread.

Standard passive cooling solution for COM Express modules conga-TCA and CCA with 3mm fins. All standoffs are with 2.7mm bore

hole.

Standard passive cooling solution for COM Express module conga-TCA and CCA with 10mm fins. All standoffs are M2.5mm thread.

Standard passive cooling solution for COM Express module conga-TCA and CCA with 10mm fins. All standoffs are 2.7mm bore hole.

DDR3 SODIMM memory module with 1066MT/s and 1GB RAM.

DDR3 SODIMM memory module with 1066MT/s and 2GB RAM.

DDR3 SODIMM memory module with 1066MT/s and 4GB RAM.

Accessories

conga-TEVAL

conga-LDVI/EPI

COM-Express-carrier-

board-Socket-5

COM-Express-carrier-

board-Socket-8

065800

011115

400007

400004

Evaluation carrier board for Type 6 COM-Express-modules

LVDS to DVI converter board for digital flat panels with onboard EEPROM

Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces

Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces

All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee

of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their

respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. Novbember 04, 2014 MR

2x USB 3.0

optional

Memory Types

(up to 1066MTs)

www.congatec.com

参数对比

与CONGA-TCA-D2550-USB3相近的元器件有：CONGA-TCA-CSP-T-LF、conga-TCA/CSP-T-HF、CONGA-TCA/HSP-B、conga-TCA/HSP-T、conga-TCA/D2550、conga-TCA/CSP-B-HF、conga-TCA/N2600 USB3、conga-TCA/N2600、conga-TCA/N2800。描述及对比如下：

型号	CONGA-TCA-D2550-USB3	CONGA-TCA-CSP-T-LF	conga-TCA/CSP-T-HF	CONGA-TCA/HSP-B	conga-TCA/HSP-T	conga-TCA/D2550	conga-TCA/CSP-B-HF	conga-TCA/N2600 USB3	conga-TCA/N2600	conga-TCA/N2800
描述	Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Atom D2550 Dual Core Processor with 1.8GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface. PCIe to 2x USB 3.0 controller onboard.	Heat Sinks Standard passive cooling solution for COM Express modules conga-TCA/CCA with 3mm fins. All standoffs are M2.5mm thread.	Heat Sinks Standard passive cooling solution for COM Express module conga-TCA/CCA with 10mm fins. All stand-offs are M2.5mm thread.	Heat Sinks Heatspreader for conga-TCA/CCA, standoff with 2.7mm bore hole	Heat Sinks Heatspreader for conga-TCA/CCA, standoff with M2.5mm threaded	Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Atom D2550 Dual Core Processor with 1.8GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.	Heat Sinks Standard passive cooling solution for COM Express module conga-TCA/CCA with 10mm fins. All standoffs are 2.7mm bore hole.	模块化计算机 - COM COM Express Type 6 Compact module with Intel Atom N2600 Dual Core Processor with 1.6GHz, 1MB L2 cache and 800MT/s DDR3 memory interface. PCIe to 2x USB 3.0 controller onboard.	模块化计算机 - COM COM Express Type 6 Compact module with Intel Atom N2600 Dual Core Processor with 1.6GHz, 1MB L2 cache and 800MT/s DDR3 memory interface.	模块化计算机 - COM COM Express Type 6 Compact module with Intel Atom N2800 Dual Core Processor with 1.86GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	-	-	-
制造商 Manufacturer	congatec	congatec	congatec	congatec	congatec	congatec	congatec	-	-	-
产品种类 Product Category	Computer-On-Modules - COM	Heat Sinks	Heat Sinks	Heat Sinks	Heat Sinks	Computer-On-Modules - COM	Heat Sinks	-	-	-
RoHS	Details	Details	Details	Details	Details	Details	Details	-	-	-
工厂包装数量 Factory Pack Quantity	1	1	1	1	1	1	1	-	-	-