CPC5610/CPC5611
LITELINK™ II Silicon Data Access Arrangement (DAA) IC
Features
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•
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Full-duplex data and voice transmission
Transformerless telephone line isolation interface
Operates at all modem speeds, including V.90 (56K)
3.3 or 5 V power supply operation
Half-wave ring detector (CPC5610) or full-wave ring
detector (CPC5611)
Caller ID signal reception
Small 32-pin SOIC plastic package
Printed-circuit board space and cost savings
Meets PC Card (PCMCIA) height requirements
Easy interface with modem ICs and voice CODECs
Worldwide dial-up telephone network compatibility
Supplied application circuit complies with the
requirements of TIA/EIA/IS-968 (FCC part 68),
UL1950, UL60950, EN60950, IEC60950,
EN55022B, CISPR22B, EN55024, and TBR-21
CPC5610 and CPC5611 comply with UL1577
TTL compatible logic inputs and outputs
Line-side circuit powered from telephone line
Description
Clare CPC5610 and CPC5611 LITELINKs are silicon
data access arrangement (DAA) ICs used in data and
voice communication applications to make connec-
tions to the public switched telephone network
(PSTN). LITELINK uses on-chip optical components
and a few inexpensive external components to form a
complete voice or high-speed data telephone line
interface.
LITELINK eliminates the need for the large isolation
transformers or capacitors as used in other DAA con-
figurations. It incorporates the required high-voltage
isolation barrier in the surface-mount SOIC package.
The CPC5610 (half-wave ring detect) and CPC5611
(full-wave ring detect) build upon Clare’s existing
LITELINK line, with improved performance and 3.3 V
operation.
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•
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Ordering Information
Applications
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Satellite and cable set-top boxes
V.90 (and other standard) modems
Fax machines
Voicemail systems
Computer telephony
PBXs
Telephony gateways
Embedded modems for such applications as POS
terminals, automated banking, remote metering,
vending machines, security, and surveillance
Part Number
CPC5610A
CPC5610ATR
CPC5611A
CPC5611ATR
Description
32-pin surface mount DAA with half-wave ring
detect, tubed
32-pin surface mount DAA with half-wave ring
detect, tape and reel
32-pin surface mount DAA with full-wave ring
detect, tubed
32-pin surface mount DAA with full-wave ring
detect, tape and reel
Figure 1. CPC5610/CPC5611 Block Diagram
TIP+
Isolation Barrier
Transmit
Isolation
Amplifier
Tx+
Tx-
Transmit
Diff.
Amplifier
Transconductance
Stage
2-4 Wire Hybrid
AC/DC Termination
Hookswitch
VI Slope Control
AC Impedance Control
Current Limit Control
OH
RING
CID
Vref
AGC
Vref
AGC
RING-
Receive
Isolation
Amplifier
Rx+
Rx-
Receive
Diff.
Amplifier
CID/
RING
MUX
C
SNOOP
Snoop Amplifier
C
SNOOP
R
SNOOP
R
SNOOP
DS-CPC5610/5611-R9.0
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1
CPC5610/CPC5611
1 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Resistive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1.1 Resistive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Reactive Termination Application Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.1 Reactive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 Using LITELINK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Switch Hook Control (On-hook and Off-hook States) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 On-hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.1 Ring Signal Detection via the Snoop Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.2 Polarity Reversal Detection with CPC5611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2.3 On-hook Caller ID Signal Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 Off-Hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.1 Receive Signal Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.2 Transmit Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
5
6
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7
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9
10
10
10
10
11
11
11
11
12
12
12
12
13
13
13
4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 LITELINK Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Clare, Inc. Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Third Party Design Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 LITELINK Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3.1 Moisture Reflow Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3.2 Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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18
18
18
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R9.0
CPC5610/CPC5611
1. Electrical Specifications
1.1 Absolute Maximum Ratings
Parameter
Isolation Voltage
Continuous Tip to Ring
Current (R
ZDC
= 5.2Ω)
Total Package Power Dis-
sipation
Operating temperature
Storage temperature
Soldering temperature
0
-40
-
Minimum Maximum
1500
-
150
1
+85
+125
+220
Unit
V
RMS
mA
W
°C
°C
°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure of
the device to the absolute maximum ratings for an
extended period may degrade the device and affect its reli-
ability.
1.2 Performance
Parameter
DC Characteristics
Operating Voltage V
DD
Operating Current I
DD
Operating Voltage V
DDL
Operating Current I
DDL
On-hook Characteristics
Metallic DC Resistance
Longitudinal DC Resistance
Ring Signal Detect Level
Ring Signal Detect Level
Snoop Circuit Frequency Response
Snoop Circuit CMRR
Ringer Equivalence
Longitudinal Balance
Off-Hook Characteristics
AC Impedance
Longitudinal Balance
Return Loss
Transmit and Receive Characteristics
Frequency Response
Trans-Hybrid Loss
Transmit and Receive Insertion Loss
Average In-band Noise
Harmonic Distortion
Rev. 9.0
Minimum
3.0
-
2.8
-
10
10
5
28
166
-
-
60
Typical
-
-
-
10.5
-
-
-
-
-
-40
0.1B
-
Maximum
5.50
10
3.2
12
-
-
-
-
>4000
-
-
-
Unit
V
mA
V
mA
MΩ
MΩ
V
RMS
V
RMS
Hz
dB
REN
dB
Ω
dB
dB
Hz
dB
dB
dBm/Hz
dB
Conditions
Host side
Host side
Line side, derived from tip and ring
Line side, drawn from tip and ring while off-hook
Tip to ring, 100 Vdc applied
150 Vdc applied from tip and ring to Earth ground
68 Hz ring signal applied to tip and ring
15 Hz ring signal applied across tip and ring
-3 dB corner frequency @ 166 Hz
120 V
RMS
60 Hz common mode signal across tip
and ring
Per FCC part 68.3
Tip to ring, using resistive termination application
circuit
Per FCC part 68.3
Into 600
Ω
at 1800 Hz
-3 dB corner frequency 30 Hz
Into 600
Ω
at 1800 Hz, with C18
30 Hz to 4 kHz
4 kHz flat bandwidth
-3 dBm, 600 Hz, 2
nd
harmonic
3
-
40
-
30
-
-1
-
-
600
-
26
-
36
0
-120
-80
-
-
-
4000
-
1
-
-
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CPC5610/CPC5611
Parameter
Transmit Level
Receive Level
RX+/RX- Output Drive Current
TX+/TX- Input Impedance
Isolation Characteristics
Isolation Voltage
Surge Rise Time
OH and CID Control Logic Inputs
Input Threshold Voltage
High Level Input Current
Low Level Input Current
RING Output Logic Levels
Output High Voltage
Output Low Voltage
V
DD
-0.4
-
-
-
-
0.4
V
V
I
OUT
= -400
µA
I
OUT
= 1 mA
0.8
-120
-
-
-
-
2.0
0
-120
V
µA
µA
V
IN
≤
V
DD
V
IN
=GND
1500
2000
-
-
-
-
V
RMS
V/µS
Line side to host side
No damage via tip and ring
Minimum
-
-
-
60
Typical
0
-
-
90
Maximum
2.2
2.2
0.5
120
Unit
V
P-P
V
P-P
mA
kΩ
Conditions
Single-tone sine wave. Or 0 dBm into 600
Ω.
Single-tone sine wave. Or 0 dBm into 600
Ω.
Sink and source
Specifications subject to change without notice. All performance characteristics based on the use of Clare, Inc. application circuits. Functional operation of the
device at conditions beyond those specified here is not implied. Specification conditions: V
DD
= 5V, temperature = 25 °C, unless otherwise indicated.
4
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Rev. 9.0
CPC5610/CPC5611
1.3 Pin Description
Pin
1
2
3
4
5
6
7
8
9
Name
VDD
TXSM
TX-
TX+
TX
REFM
GND
OH
RING
Function
Host (CPE) side power supply
Transmit summing junction
Negative differential transmit signal to DAA
from host
Positive differential transmit signal to DAA from
host
Transmit differential amplifier output
Internal voltage reference
Host (CPE) side analog ground
Assert logic low for off-hook operation
Indicates ring signal, pulsed high to low
Assert logic low while on hook to place CID
information on RX pins.
Negative differential analog signal received
from the telephone line. Must be AC coupled
with 0.1
µF.
Positive differential analog signal received from
the telephone line. Must be AC coupled with
0.1
µF.
Positive differential snoop input
Negative differential snoop input
Receive photodiode amplifier output
Receive photodiode summing junction
Power supply for line side, regulated from tip
and ring.
Receive isolation amp summing junction
Receive LED pre-bias current set
Bridge rectifier return
Electronic inductor and DC current limit
DC feedback output
V to I slope control
0.625 Vdc reference
External MOSFET gate control
Receive signal input
Bridge rectifier return
Transmit photodiode summing junction
Receiver impedance set
Transmit transconductance gain set
Transmit photodiode amplifier output
1.25 Vdc reference
Figure 2. Pinout
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VDD
TXSM
TX-
TX+
TX
REFM
GND
OH
RING
CID
RX-
RX+
SNP+
SNP-
RXF
RX
REFL
TXF
ZTX
ZNT
TXSL
BR-
NTS
GAT
REFB
DCS1
DCS2
ZDC
BR-
RPB
RXS
VDDL
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
10 CID
11 RX-
12 RX+
13 SNP+
14 SNP-
15 RXF
16 RX
17 VDDL
18 RXS
19 RPB
20 BR-
21 ZDC
22 DCS2
23 DCS1
24 REFB
25 GAT
26 NTS
27 BR-
28 TXSL
29 ZNT
30 ZTX
31 TXF
32 REFL
Rev. 9.0
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