型号
- 型号
- 关键词
| 型号 | CX28224 | CX28225 | CX28229 |
|---|---|---|---|
| 描述 | ATM/SONET/SDH IC, CMOS, PBGA256 | ATM/SONET/SDH IC, CMOS, PBGA256 | ATM/SONET/SDH IC, CMOS, PBGA256 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 包装说明 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 |
| Reach Compliance Code | compliant | compliant | compliant |
| JESD-30 代码 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
| JESD-609代码 | e0 | e0 | e0 |
| 端子数量 | 256 | 256 | 256 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA |
| 封装等效代码 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 电源 | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM |
| Base Number Matches | 1 | 1 | - |