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CY62138FV30LL-45BVXI

256KX8 STANDARD SRAM, 45ns, PBGA36, 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-36

器件类别:存储    存储   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Rochester Electronics
零件包装代码
BGA
包装说明
6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-36
针数
36
Reach Compliance Code
unknown
最长访问时间
45 ns
JESD-30 代码
R-PBGA-B36
长度
8 mm
内存密度
2097152 bit
内存集成电路类型
STANDARD SRAM
内存宽度
8
湿度敏感等级
NOT SPECIFIED
功能数量
1
端子数量
36
字数
262144 words
字数代码
256000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
256KX8
封装主体材料
PLASTIC/EPOXY
封装代码
VFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
认证状态
COMMERCIAL
座面最大高度
1 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.2 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
NOT SPECIFIED
端子形式
BALL
端子节距
0.75 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
20
宽度
6 mm
文档预览
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CY62138FV30 MoBL
®
2-Mbit (256 K × 8) Static RAM
2-Mbit (256 K × 8) Static RAM
Features
Functional Description
The CY62138FV30 is a high performance CMOS static RAM
organized as 256K words by 8 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life™ (MoBL
) in portable
applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption. Place the device into standby mode reducing
power consumption when deselected (CE
1
HIGH or CE
2
LOW).
To write to the device, take Chip Enable (CE
1
LOW and CE
2
HIGH) and Write Enable (WE) inputs LOW. Data on the eight I/O
pins (I/O
0
through I/O
7
) is then written into the location specified
on the address pins (A
0
through A
17
).
To read from the device, take Chip Enable (CE
1
LOW and CE
2
HIGH) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins appear on the I/O pins.
The eight input and output pins (I/O
0
through I/O
7
) are placed in
a high impedance state when the device is deselected (CE
1
HIGH or CE
2
LOW), the outputs are disabled (OE HIGH), or
during a write operation (CE
1
LOW and CE
2
HIGH and WE
LOW).
Very high-speed: 45 ns
Temperature ranges
Industrial: –40 °C to 85 °C
Automotive-A: –40 °C to 85 °C
Wide voltage range: 2.20 V to 3.60 V
Pin compatible with CY62138CV25/30/33
Ultra low standby power
Typical standby current: 1
A
Maximum standby current: 5
A
Ultra low active power
Typical active current: 1.6 mA at f = 1 MHz
Easy memory expansion with CE
1
, CE
2
, and OE Features
Automatic power down when deselected
Complementary metal oxide semiconductor (CMOS) for
Optimum speed and power
Offered in Pb-free 36-ball VFBGA, 32-pin TSOP II, 32-pin
SOIC, 32-pin TSOP I and 32-pin STSOP packages
Logic Block Diagram
Cypress Semiconductor Corporation
Document #: 001-08029 Rev. *K
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised June 16, 2011
[+] Feedback
CY62138FV30 MoBL
®
Contents
Pin Configuration ............................................................. 3
Product Portfolio .............................................................. 3
Maximum Ratings ............................................................. 4
Operating Range ............................................................... 4
Electrical Characteristics ................................................. 4
Capacitance ...................................................................... 5
Thermal Resistance .......................................................... 5
AC Test Loads and Waveforms ....................................... 5
Data Retention Characteristics ....................................... 6
Data Retention Waveform ................................................ 6
Switching Characteristics ................................................ 7
Switching Waveforms ...................................................... 8
Truth Table ........................................................................ 9
Ordering Information ...................................................... 10
Ordering Code Definitions ......................................... 10
Package Diagrams .......................................................... 11
Acronyms ........................................................................ 16
Document Conventions ................................................. 16
Units of Measure ....................................................... 16
Document History Page ................................................. 17
Sales, Solutions, and Legal Information ...................... 18
Worldwide Sales and Design Support ....................... 18
Products .................................................................... 18
PSoC Solutions ......................................................... 18
Document #: 001-08029 Rev. *K
Page 2 of 18
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CY62138FV30 MoBL
®
Pin Configuration
Figure 1. 36-ball VFBGA (Top View)
[1]
1
A
0
I/O
4
I/O
5
V
SS
V
CC
I/O
6
I/O
7
A
9
OE
A
10
NC
CE
1
A
11
A
17
A
16
A
12
A
15
A
13
2
A
1
A
2
3
CE
2
WE
NC
4
A
3
A
4
A
5
5
A
6
A
7
6
A
8
I/O
0
I/O
1
V
CC
V
SS
I/O
2
I/O
3
A
14
A
B
C
D
E
F
G
H
A
17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
I/O
0
I/O
1
I/O
2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Figure 2. 32-pin SOIC/TSOP II (Top View)
V
CC
A
15
CE
2
WE
A
13
A
8
A
9
A
11
OE
A
10
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
Figure 3. 32-pin TSOP I (Top View)
Figure 4. 32-pin STSOP (Top View)
A
11
A
9
A
8
A
13
WE
CE
2
A
15
V
CC
A
17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TSOP I
Top View
(not to scale)
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A
10
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
GND
I/O
2
I/O
1
I/O
0
A
0
A
1
A
2
A
3
A
11
A
9
A
8
A
13
WE
CE
2
A
15
V
CC
A
17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
25
26
27
26
28
29
30
31
32
1
2
3
4
5
6
7
8
STSOP
Top View
(not to scale)
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
OE
A
10
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
GND
I/O
2
I/O
1
I/O
0
A
0
A
1
A
2
A
3
Product Portfolio
Power Dissipation
Product
Range
V
CC
Range (V)
Min
CY62138FV30LL
Industrial /
Automotive-A
2.2
Typ
[2]
3.0
Max
3.6
45
Speed
(ns)
Operating I
CC
(mA)
f = 1 MHz
Typ
[2]
1.6
Max
2.5
f = f
max
Typ
[2]
13
Max
18
Standby I
SB2
(A)
Typ
[2]
1
Max
5
Notes
1. NC pins are not connected on the die.
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ.)
, T
A
= 25 °C.
Document #: 001-08029 Rev. *K
Page 3 of 18
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CY62138FV30 MoBL
®
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Ambient temperature with
power applied .......................................... –55 °C to +125 °C
Supply voltage to ground
potential .........................................................–0.3 V to 3.9 V
DC voltage applied to outputs
in High Z State
[3, 4]
........................................–0.3 V to 3.9 V
DC input voltage
[3, 4]
.....................................–0.3 V to 3.9 V
Output current into outputs (LOW) ............................. 20 mA
Static Discharge Voltage ........................................ > 2001 V
(MIL-STD-883, Method 3015)
Latch-up current .................................................... > 200 mA
Operating Range
Product
CY62138FV30LL
Range
Industrial /
Automotive-A
Ambient
Temperature
–40 °C to
+85 °C
V
CC
[5]
2.2 V to 3.6 V
Electrical Characteristics
Over the Operating Range
Parameter
V
OH
V
OL
V
IH
V
IL
Description
Output HIGH voltage
Output LOW voltage
Input HIGH voltage
Input LOW voltage
Test Conditions
I
OH
= –0.1 mA
I
OH
= –1.0 mA, V
CC
> 2.70 V
I
OL
= 0.1 mA
I
OL
= 2.1 mA, V
CC
> 2.70 V
V
CC
= 2.2 V to 2.7 V
V
CC
= 2.7 V to 3.6 V
V
CC
= 2.2 V to 2.7 V For BGA package
V
CC
= 2.7 V to 3.6 V
V
CC
= 2.2 V to 3.6 V For other packages
I
IX
I
OZ
I
CC
I
SB1[7]
Input leakage current
Output leakage current
GND < V
I
< V
CC
GND < V
O
< V
CC
, output disabled
f = 1 MHz
Automatic CE Power-down
current–CMOS inputs
V
CC
= V
CCmax
,
I
OUT
= 0 mA,
CMOS levels
1.8
2.2
–0.3
–0.3
–0.3
–1
–1
45 ns (Industrial / Automotive-A)
Min
2.0
2.4
Typ
[6]
13
1.6
1
Max
0.4
0.4
V
CC
+ 0.3 V
V
CC
+ 0.3 V
0.6
0.8
0.6
+1
+1
18
2.5
5
A
Unit
V
V
V
V
V
V
V
V
V
A
A
mA
V
CC
Operating supply current f = f
max
= 1/t
RC
CE
1
> V
CC
– 0.2 V or CE
2
< 0.2 V,
V
IN
> V
CC
– 0.2 V, V
IN
< 0.2 V,
f = f
max
(address and data only),
f = 0 (OE, and WE), V
CC
= 3.60 V
I
SB2 [7]
Automatic CE Power-down
current–CMOS inputs
CE
1
> V
CC
– 0.2 V or CE
2
< 0.2 V,
V
IN
> V
CC
– 0.2 V or V
IN
< 0.2 V,
f = 0, V
CC
= 3.60 V
1
5
A
Notes
3. V
IL(min)
=
2.0 V for pulse durations less than 20 ns.
4. V
IH(max)
= V
CC
+ 0.75 V for pulse durations less than 20 ns.
5. Full device AC operation assumes a 100
s
ramp time from 0 to V
CC
(min) and 200
s
wait time after V
CC
stabilization.
6. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ.)
, T
A
= 25 °C.
7. Chip enables (CE
1
and CE
2
) must be at CMOS level to meet the I
SB1
/ I
SB2
/ I
CCDR
spec. Other inputs can be left floating.
Document #: 001-08029 Rev. *K
Page 4 of 18
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参数对比
与CY62138FV30LL-45BVXI相近的元器件有:CY62138FV30LL-45ZAXA、CY62138FV30LL-45ZAXI、CY62138FV30LL-45ZXI、CY62138FV30LL-45SXI、CY62138FV30LL-45ZSXI。描述及对比如下:
型号 CY62138FV30LL-45BVXI CY62138FV30LL-45ZAXA CY62138FV30LL-45ZAXI CY62138FV30LL-45ZXI CY62138FV30LL-45SXI CY62138FV30LL-45ZSXI
描述 256KX8 STANDARD SRAM, 45ns, PBGA36, 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-36 256KX8 STANDARD SRAM, 45ns, PDSO32, 8 X 13.40 MM, LEAD FREE, STSOP-32 256KX8 STANDARD SRAM, 45ns, PDSO32, 8 X 13.40 MM, LEAD FREE, STSOP-32 256KX8 STANDARD SRAM, 45ns, PDSO32, 8 X 20 MM, LEAD FREE, TSOP1-32 256KX8 STANDARD SRAM, 45ns, PDSO32, 0.450 INCH, LEAD FREE, SOIC-32 256KX8 STANDARD SRAM, 45ns, PDSO32, LEAD FREE, TSOP2-32
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 BGA TSOP TSOP TSOP1 SOIC TSOP2
包装说明 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-36 8 X 13.40 MM, LEAD FREE, STSOP-32 8 X 13.40 MM, LEAD FREE, STSOP-32 8 X 20 MM, LEAD FREE, TSOP1-32 0.450 INCH, LEAD FREE, SOIC-32 LEAD FREE, TSOP2-32
针数 36 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
最长访问时间 45 ns 45 ns 45 ns 45 ns 45 ns 45 ns
JESD-30 代码 R-PBGA-B36 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
长度 8 mm 11.8 mm 11.8 mm 18.4 mm 20.4465 mm 20.95 mm
内存密度 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
端子数量 36 32 32 32 32 32
字数 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
字数代码 256000 256000 256000 256000 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA TSSOP TSSOP TSOP1 SOP TSOP2
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
座面最大高度 1 mm 1.2 mm 1.2 mm 1.2 mm 2.997 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.2 V 2.2 V 2.2 V 2.2 V 2.2 V 2.2 V
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED MATTE TIN NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 BALL GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.75 mm 0.5 mm 0.5 mm 0.5 mm 1.27 mm 1.27 mm
端子位置 BOTTOM DUAL DUAL DUAL DUAL DUAL
宽度 6 mm 8 mm 8 mm 8 mm 11.303 mm 10.16 mm
是否无铅 不含铅 - 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合 符合 符合
湿度敏感等级 NOT SPECIFIED - NOT SPECIFIED 3 3 3
峰值回流温度(摄氏度) 260 - 260 260 260 260
处于峰值回流温度下的最长时间 20 - 20 20 20 20
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