首页 > 器件类别 > 存储 > 存储

CY62148VLL-70SI

512KX8 STANDARD SRAM, 70ns, PDSO32, 0.450 INCH, PLASTIC, SOIC-32

器件类别:存储    存储   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

下载文档
器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Rochester Electronics
零件包装代码
SOIC
包装说明
SOP,
针数
32
Reach Compliance Code
unknown
最长访问时间
70 ns
其他特性
TTL COMPATIBLE INPUTS/OUTPUTS, LOW STANDBY POWER
JESD-30 代码
R-PDSO-G32
JESD-609代码
e0
长度
20.447 mm
内存密度
4194304 bit
内存集成电路类型
STANDARD SRAM
内存宽度
8
功能数量
1
端子数量
32
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
512KX8
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
COMMERCIAL
筛选级别
MIL-STD-883
座面最大高度
2.9972 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
11.303 mm
文档预览
D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
48V
MoBL
CY62148V MoBL™
512K x 8 MoBL Static RAM
Features
• Low voltage range:
— 2.7V–3.6V
• Ultra low active power
• Low standby power
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
• CMOS for optimum speed/power
The device can be put into standby mode when deselected
(CE HIGH).
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O
pins (I/O
0
through I/O
7
) is then written into the location speci-
fied on the address pins (A
0
through A
18
).
Reading from the device is accomplished by taking Chip En-
able (CE) and Output Enable (OE) LOW while forcing Write
Enable (WE) HIGH. Under these conditions, the contents of
the memory location specified by the address pins will appear
on the I/O pins.
The eight input/output pins (I/O
0
through I/O
7
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), or during a write
operation (CE LOW and WE LOW).
The CY62148V is available in a 36-ball FBGA, 32 pin TSOPII,
and a 32-pin SOIC package.
Functional Description
The CY62148V is a high-performance CMOS static RAM or-
ganized as 524,288 words by 8 bits. This device features ad-
vanced circuit design to provide ultra-low active current. This
is ideal for providing More Battery Life™ (MoBL™) in portable
applications such as cellular telephones. The device also has
an automatic power-down feature that significantly reduces
power consumption by 99% when addresses are not toggling.
Logic Block Diagram
Data in Drivers
I/O
0
I/O
1
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
ROW DECODER
SENSE AMPS
I/O
2
I/O
3
I/O
4
I/O
5
512K x 8
ARRAY
CE
WE
COLUMN
DECODER
POWER
DOWN
I/O
6
I/O
7
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
A
18
OE
62148V-1
Cypress Semiconductor Corporation
Document #: 38-05070 Rev. **
3901 North First Street
San Jose
CA 95134 • 408-943-2600
Revised September 4, 2001
CY62148V MoBL™
Pin Configurations
TSOPII/SOIC
Top View
A
17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
I/O
0
I/O
1
I/O
2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
FBGA
Top View
1
V
CC
A
15
A
18
WE
A
13
A
8
A
9
A
11
OE
A
10
CE
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
A
0
I/O
4
I/O
5
V
SS
V
CC
I/O
6
I/O
7
A
9
OE
A
10
A
18
CE
A
11
A
17
A
16
A
12
A
15
A
13
2
A
1
A
2
3
NC
WE
NC
4
A
3
A
4
A
5
5
A
6
A
7
6
A
8
I/O
0
I/O
1
V
CC
V
SS
I/O
2
I/O
3
A
14
A
B
C
D
E
F
G
H
62148V–2
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................... 55°C to +125°C
Supply Voltage to Ground Potential ............... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High Z State
[1]
....................................–0.5V to V
CC
+ 0.5V
DC Input Voltage
[1]
................................ –0.5V to V
CC
+ 0.5V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage .......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.................................................... >200 mA
Operating Range
Range
Industrial
Ambient Temperature
–40°C to +85°C
V
CC
2.7V to 3.6V
Product Portfolio
Power Dissipation (Industrial)
Product
Min.
CY62148V
2.7V
V
CC
Range
Typ.
[2]
3.0V
Max.
3.6V
Speed
70 ns
Operating (I
CC
)
Typ.
[2]
7
Maximum
15 mA
Ty.p
[2]
2
µA
Standby (I
SB2
)
Maximum
20
µA
Notes:
1. V
IL(min.)
= –2.0V for pulse durations less than 20 ns.
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ.)
, T
A
= 25°C.
Document #: 38-05070 Rev. **
Page 2 of 12
CY62148V MoBL™
Electrical Characteristics
Over the Operating Range
CY62148V
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
Description
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Load Current
Output Leakage Current
V
CC
Operating Supply
Current
GND < V
I
< V
CC
GND < V
O
< V
CC
, Output
Disabled
I
OUT
= 0 mA, (f =
f
MAX
= 1/t
RC
) CMOS
Levels
V
CC
= 3.6V
Test Conditions
I
OH
= –1.0 mA
I
OL
= 2.1 mA
Min.
2.4
0.4
2.2
–0.5
–1
–1
+1
+1
7
V
CC
+ 0.5V
0.8
+1
+1
15
Typ.
[2]
Max.
Unit
V
V
V
V
µA
µA
mA
V
CC
= 2.7V
V
CC
= 2.7V
V
CC
= 3.6V
V
CC
= 2.7V
I
OUT
= 0 mA, f = 1 MHz CMOS Levels
I
SB1
Automatic CE
Power-Down Current—
CMOS Inputs
Automatic CE
Power-Down Current—
CMOS Inputs
CE > V
CC
0.3V,
V
IN
> V
CC
0.3V or
V
IN
< 0.3V, f = f
MAX
CE > V
CC
0.3V
V
IN
> V
CC
0.3V
or V
IN
< 0.3V, f = 0
L
V
CC
=
3.6V
LL
1
2
100
mA
µA
I
SB2
1
2
50
20
µA
µA
Capacitance
[3]
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
Test Conditions
T
A
= 25°C, f = 1 MHz,
V
CC
= 3.0V
Max.
6
8
Unit
pF
pF
Thermal Resistance
Description
Thermal Resistance
(Junction to Ambient)
[3]
Test Conditions
Still Air, soldered on a 4.25 x 1.125 inch, 4-lay-
er printed circuit board
Symbol
Θ
JA
Θ
JC
Others
TBD
TBD
BGA
TBD
TBD
Units
°C/W
°C/W
Thermal Resistance
[3]
(Junction to Case)
Note:
3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05070 Rev. **
Page 3 of 12
CY62148V MoBL™
AC Test Loads and Waveforms
R1
V
CC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
R2
V
CC
Typ
10%
GND
Rise Time: 1 V/ns
ALL INPUT PULSES
90%
90%
10%
Fall time: 1 V/ns
62148V–3
62148V–4
Equivalent to:
THÉVENIN EQUIVALENT
R
TH
V
TH
OUTPUT
Parameters
R1
R2
R
TH
V
TH
3.0V
1105
1550
645
1.75V
Unit
Ohms
Ohms
Ohms
Volts
Data Retention Characteristics
(Over the Operating Range)
Parameter
V
DR
I
CCDR
Description
V
CC
for Data Retention
Data Retention Current
V
CC
= 1.0V
L/ LL
CE > V
CC
0.3V,
V
IN
> V
CC
0.3V or
V
IN
< 0.3V
No input may exceed
V
CC
+0.3V
0
t
RC
Conditions
Min.
1.0
0.2
Typ.
[2]
Max.
3.6
5.5
Unit
V
µA
µA
t
CDR[3]
t
R[4]
Chip Deselect to Data
Retention Time
Operation Recovery
Time
ns
ns
Note:
4. Full Device AC operation requires linear V
CC
ramp from V
DR
to V
CC(min.)
> 10
µ
s or stable at V
CC(min.)
>
10
µ
s.
Data Retention Waveform
DATA RETENTION MODE
V
CC
1.0V
t
CDR
CE
62148V–5
V
DR
> 1.0 V
1.0V
t
R
Document #: 38-05070 Rev. **
Page 4 of 12
查看更多>
参数对比
与CY62148VLL-70SI相近的元器件有:CY62148VLL-70BAIT、CY62148VLL-70BAI。描述及对比如下:
型号 CY62148VLL-70SI CY62148VLL-70BAIT CY62148VLL-70BAI
描述 512KX8 STANDARD SRAM, 70ns, PDSO32, 0.450 INCH, PLASTIC, SOIC-32 512KX8 STANDARD SRAM, 70ns, PBGA36, 7 X 8.50 X 1.50 MM, FINE PITCH, TBGA-36 512KX8 STANDARD SRAM, 70ns, PBGA36, 7 X 8.50 X 1.50 MM, FINE PITCH, TBGA-36
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 SOIC BGA BGA
包装说明 SOP, TFBGA, 7 X 8.50 X 1.50 MM, FINE PITCH, TBGA-36
针数 32 36 36
Reach Compliance Code unknown unknown unknown
最长访问时间 70 ns 70 ns 70 ns
其他特性 TTL COMPATIBLE INPUTS/OUTPUTS, LOW STANDBY POWER TTL COMPATIBLE INPUTS/OUTPUTS, LOW STANDBY POWER TTL COMPATIBLE INPUTS/OUTPUTS, LOW STANDBY POWER
JESD-30 代码 R-PDSO-G32 R-PBGA-B36 R-PBGA-B36
长度 20.447 mm 8.5 mm 8.5 mm
内存密度 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 8 8
功能数量 1 1 1
端子数量 32 36 36
字数 524288 words 524288 words 524288 words
字数代码 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
组织 512KX8 512KX8 512KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TFBGA TFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883
座面最大高度 2.9972 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING BALL BALL
端子节距 1.27 mm 0.75 mm 0.75 mm
端子位置 DUAL BOTTOM BOTTOM
宽度 11.303 mm 7 mm 7 mm
是否无铅 含铅 - 含铅
是否Rohs认证 不符合 - 不符合
JESD-609代码 e0 - e0
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED
端子面层 TIN LEAD - TIN LEAD
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED
热门器件
热门资源推荐
器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
需要登录后才可以下载。
登录取消