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CY7C1338F-117AXI

Cache SRAM, 128KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Cypress(赛普拉斯)
零件包装代码
QFP
包装说明
LQFP,
针数
100
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
最长访问时间
7.5 ns
其他特性
FLOW-THROUGH ARCHITECTURE
JESD-30 代码
R-PQFP-G100
JESD-609代码
e3
长度
20 mm
内存密度
4194304 bit
内存集成电路类型
CACHE SRAM
内存宽度
32
湿度敏感等级
3
功能数量
1
端子数量
100
字数
131072 words
字数代码
128000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
128KX32
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
1.6 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
MATTE TIN
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
40
宽度
14 mm
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CY7C1338F
4-Mb (128K x 32) Flow-Through Sync SRAM
Features
128K X 32 common I/O
3.3V –5% and +10% core power supply (V
DD
)
2.5V or 3.3V I/O supply (V
DDQ
)
Fast clock-to-output times
— 6.5 ns (133-MHz version)
— 7.5 ns (117-MHz version)
— 8.0 ns (100-MHz version)
— 11.0 ns (66-MHz version)
Provide high-performance 2-1-1-1 access rate
User-selectable burst counter supporting Intel
Pentium
interleaved or linear burst sequences
Separate processor and controller address strobes
Synchronous self-timed write
Asynchronous output enable
Offered in JEDEC-standard 100-pin TQFP and 119-ball
BGA packages
“ZZ” Sleep Mode option
6.5 ns (133-MHz version). A 2-bit on-chip counter captures the
first address in a burst and increments the address automati-
cally for the rest of the burst access. All synchronous inputs
are gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE
1
), depth-expansion Chip Enables (CE
2
and CE
3
), Burst
Control inputs (ADSC, ADSP, and ADV), Write Enables
(BW
[A:D]
, and BWE), and Global Write (GW). Asynchronous
inputs include the Output Enable (OE) and the ZZ pin.
The CY7C1338F allows either interleaved or linear burst
sequences, selected by the MODE input pin. A HIGH selects
an interleaved burst sequence, while a LOW selects a linear
burst sequence. Burst accesses can be initiated with the
Processor Address Strobe (ADSP) or the cache Controller
Address Strobe (ADSC) inputs. Address advancement is
controlled by the Address Advancement (ADV) input.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
The CY7C1338F operates from a +3.3V core power supply
while all outputs may operate with either a +2.5 or +3.3V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
Functional Description
[1]
The CY7C1338F is a 131,072 x 32 synchronous cache RAM
designed to interface with high-speed microprocessors with
minimum glue logic. Maximum access delay from clock rise is
Logic Block Diagram
A0, A1, A
ADDRESS
REGISTER
A
[1:0]
MODE
ADV
CLK
BURST Q1
COUNTER
AND LOGIC
Q0
CLR
ADSC
ADSP
DQ
D
BYTE
BW
D
WRITE REGISTER
DQ
D
BYTE
WRITE REGISTER
BW
C
DQ
C
BYTE
WRITE REGISTER
DQ
C
BYTE
WRITE REGISTER
DQ
B
BYTE
BW
B
DQ
B
BYTE
WRITE REGISTER
DQ
A
BYTE
BW
A
BWE
GW
CE1
CE2
CE3
OE
DQ
A
BYTE
WRITE REGISTER
WRITE REGISTER
WRITE REGISTER
MEMORY
ARRAY
SENSE
AMPS
OUTPUT
BUFFERS
DQs
ENABLE
REGISTER
INPUT
REGISTERS
ZZ
SLEEP
CONTROL
Note:
1. For best–practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05218 Rev. *A
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised February 2, 2004
CY7C1338F
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum Standby Current
133 MHz
6.5
225
40
117 MHz
7.5
220
40
100 MHz
8.0
205
40
66 MHz
11.0
195
40
Unit
ns
mA
mA
Shaded areas contain advance information.
Please contact your local Cypress sales representative for availablity of these parts.
Pin Configurations
100-Pin TQFP
BW
D
BW
C
BW
B
BW
A
CE
3
CE
1
V
DD
V
SS
OE
ADSC
ADSP
ADV
86
85
84
83
CE
2
CLK
GW
BWE
A
A
82
A
99
98
97
96
95
94
93
92
91
90
89
88
87
NC
DQ
C
DQ
C
V
DDQ
V
SSQ
DQ
C
DQ
C
BYTE C
DQ
C
DQ
C
V
SSQ
V
DDQ
DQ
C
DQ
C
NC
V
DD
NC
V
SS
DQ
D
DQ
D
V
DDQ
V
SSQ
DQ
D
DQ
D
DQ
D
DQ
D
V
SSQ
V
DDQ
DQ
D
DQ
D
NC
BYTE D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
100
81
A
CY7C1338F
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
44
45
46
47
48
49
50
NC
DQ
B
DQ
B
V
DDQ
V
SSQ
DQ
B
DQ
B
DQ
B
DQ
B
V
SSQ
V
DDQ
DQ
B
DQ
B
V
SS
NC
V
DD
ZZ
DQ
A
DQ
A
V
DDQ
V
SSQ
DQ
A
DQ
A
DQ
A
DQ
A
V
SSQ
V
DDQ
DQ
A
DQ
A
NC
BYTE B
BYTE A
38
39
40
41
V
DD
42
NC
NC
MODE
A
V
SS
NC
NC
A
A
A
1
A
0
A
A
A
43
A
A
A
A
Document #: 38-05218 Rev. *A
A
Page 2 of 17
CY7C1338F
Pin Configurations
(continued)
119-Ball BGA
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
DDQ
NC
NC
DQ
C
DQ
C
V
DDQ
DQ
C
DQ
C
V
DDQ
DQ
D
DQ
D
V
DDQ
DQ
D
DQ
D
NC
NC
V
DDQ
2
A
CE
2
A
NC
DQ
C
DQ
C
DQ
C
DQ
C
V
DD
DQ
D
DQ
D
DQ
D
DQ
D
NC
A
NC
NC
3
A
A
A
V
SS
V
SS
V
SS
BW
C
V
SS
NC
V
SS
BW
D
V
SS
V
SS
V
SS
MODE
A
NC
4
ADSP
ADSC
V
DD
NC
CE
1
OE
ADV
GW
V
DD
CLK
NC
BWE
A1
A0
V
DD
A
NC
5
A
A
A
V
SS
V
SS
V
SS
BW
B
V
SS
NC
V
SS
BW
A
V
SS
V
SS
V
SS
NC
A
NC
6
A
NC
A
NC
DQ
B
DQ
B
DQ
B
DQ
B
V
DD
DQ
A
DQ
A
DQ
A
DQ
A
NC
A
NC
NC
7
V
DDQ
NC
NC
DQ
B
DQ
B
V
DDQ
DQ
B
DQ
B
V
DDQ
DQ
A
DQ
A
V
DDQ
DQ
A
DQ
A
NC
ZZ
V
DDQ
Pin Descriptions
Name
A0, A1, A
TQFP
BGA
I/O
Description
Input-
Address Inputs used to select one of the 128K address locations.
37,36,32, P4,N4,A2,
33,34,35, A3,A5,A6, Synchronous Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW,
44,45,46, B3,B5,C2,
and CE
1
, CE
2
, and CE
3
are sampled active. A
[1:0]
feed the 2-bit counter.
47,48,49, C3,C5,C6,
50,81,82, R2,R6,T3,
T4,T5
99,100
93,94,95, L5,G5,G3,
Input-
Byte Write Select Inputs, active LOW.
Qualified with BWE to conduct
96
L3
Synchronous byte writes to the SRAM. Sampled on the rising edge of CLK.
88
H4
Input-
Global Write Enable Input, active LOW.
When asserted LOW on the
Synchronous rising edge of CLK, a global write is conducted (ALL bytes are written,
regardless of the values on BW
[A:D]
and BWE).
Input-
Byte Write Enable Input, active LOW.
Sampled on the rising edge of
Synchronous CLK. This signal must be asserted LOW to conduct a byte write.
Input-Clock
Clock Input.
Used to capture all synchronous inputs to the device. Also
used to increment the burst counter when ADV is asserted LOW, during a
burst operation.
Input-
Chip Enable 1 Input, active LOW.
Sampled on the rising edge of CLK.
Synchronous Used in conjunction with CE
2
and CE
3
to select/deselect the device. ADSP
is ignored if CE
1
is HIGH.
Input-
Chip Enable 2 Input, active HIGH.
Sampled on the rising edge of CLK.
Synchronous Used in conjunction with CE
1
and CE
3
to select/deselect the device.
Input-
Chip Enable 3 Input, active LOW.
Sampled on the rising edge of CLK.
Synchronous Used in conjunction with CE
1
and CE
2
to select/deselect the device.
Input-
Output Enable, asynchronous input, active LOW.
Controls the direction
Asynchronous of the I/O pins. When LOW, the I/O pins behave as outputs. When
deasserted HIGH, I/O pins are three-stated, and act as input data pins. OE
is masked during the first clock of a read cycle when emerging from a
deselected state.
Page 3 of 17
BW
A,
BW
B
BW
C,
BW
D
GW
BWE
CLK
87
89
M4
K4
CE
1
CE
2
CE
3
OE
98
E4
97
92
86
B2
-
F4
Document #: 38-05218 Rev. *A
CY7C1338F
Pin Descriptions
(continued)
Name
ADV
ADSP
TQFP
83
84
BGA
G4
A4
I/O
Description
Input-
Advance Input signal, sampled on the rising edge of CLK.
When
Synchronous asserted, it automatically increments the address in a burst cycle.
Input-
Address Strobe from Processor, sampled on the rising edge of CLK,
Synchronous
active LOW.
When asserted LOW, addresses presented to the device are
captured in the address registers. A
[1:0]
are also loaded into the burst
counter. When ADSP and ADSC are both asserted, only ADSP is recog-
nized. ASDP is ignored when CE
1
is deasserted HIGH
Input-
Address Strobe from Controller, sampled on the rising edge of CLK,
Synchronous
active LOW.
When asserted LOW, addresses presented to the device are
captured in the address registers. A
[1:0]
are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only ADSP is recognized.
Input-
ZZ “sleep” Input, active HIGH.
When asserted HIGH places the device
Asynchronous in a non-time-critical “sleep” condition with data integrity preserved. For
normal operation, this pin has to be LOW or left floating. ZZ pin has an
internal pull-down.
ADSC
85
B4
ZZ
64
T7
DQs
52,53,56,
57,58,59,
62,63,68,
69,72,73,
74,75,78,
79,2,3,6,
7,8,9,12,
13,18,19,
22,23,24,
25,28,29
15,41,65,
91
I/O-
Bidirectional Data I/O lines.
As inputs, they feed into an on-chip data
K6,K7,L6,
L7,M6,N6, Synchronous register that is triggered by the rising edge of CLK. As outputs, they deliver
the data contained in the memory location specified by the addresses
N7,P7,D7,
presented during the previous clock rise of the read cycle. The direction of
E6,E7,F6,
the pins is controlled by OE. When OE is asserted LOW, the pins behave
G6,G7,H6,
H7,D1,E1,
as outputs. When HIGH, DQs are placed in a three-state condition.
E2,F2,G1,
G2,H1,H2,
K1,K2,L1,
L2,M2,N1
N2,P1
C4,J2,J4,
R4,J6
Power
Supply
Ground
Power supply inputs to the core of the device.
Ground for the core of the device.
V
DD
V
SS
17,40,67, D3,D5,E3,
90
E5,F3,F5,
H3,H5,K3,
K5,M3,M5,
N3,N5,P3,
P5
4,11,20, A1,A7,F1,
27,54,61, F7,J1,J7,
70,77
M1,M7,U1,
U7
5,10,21,55
,60,71,76
31
R3
V
DDQ
I/O Power
Power supply for the I/O circuitry.
Supply
V
SSQ
MODE
I/O Ground
Ground for the I/O circuitry.
Input-
Static
Selects Burst Order.
When tied to GND selects linear burst sequence.
When tied to V
DD
or left floating selects interleaved burst sequence. This
is a strap pin and should remain static during device operation. Mode Pin
has an internal pull-up.
No Connects.
Not Internally connected to the die.
NC
14,16,38, B1,B6,B7,
39,42,43, C1,C7,D4,
66,51,80, J3,J5,L4,
1,30
R1,R5,R7,
T1,T2,T6,
U2,U3,U4,
U5,U6,P6,
D6,D2,P2
Document #: 38-05218 Rev. *A
Page 4 of 17
CY7C1338F
Functional Overview
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. Maximum access delay from
the clock rise (t
C0
) is 6.5 ns (133-MHz device).
The CY7C1338F supports secondary cache in systems
utilizing either a linear or interleaved burst sequence. The
interleaved burst order supports Pentium
®
and i486
processors. The linear burst sequence is suited for processors
that utilize a linear burst sequence. The burst order is
user-selectable, and is determined by sampling the MODE
input. Accesses can be initiated with either the Processor
Address Strobe (ADSP) or the Controller Address Strobe
(ADSC). Address advancement through the burst sequence is
controlled by the ADV input. A two-bit on-chip wraparound
burst counter captures the first address in a burst sequence
and automatically increments the address for the rest of the
burst access.
Byte write operations are qualified with the Byte Write Enable
(BWE) and Byte Write Select (BW
[A:D]
) inputs. A Global Write
Enable (GW) overrides all byte write inputs and writes data to
all four bytes. All writes are simplified with on-chip
synchronous self-timed write circuitry.
Three synchronous Chip Selects (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output three-state control. ADSP is ignored if
CE
1
is HIGH.
Single Read Accesses
A single read access is initiated when the following conditions
are satisfied at clock rise: (1) CE
1
, CE
2
, and CE
3
are all
asserted active, and (2) ADSP or ADSC is asserted LOW (if
the access is initiated by ADSC, the write inputs must be
deasserted during this first cycle). The address presented to
the address inputs is latched into the address register and the
burst counter/control logic and presented to the memory core.
If the OE input is asserted LOW, the requested data will be
available at the data outputs a maximum to t
CDV
after clock
rise. ADSP is ignored if CE
1
is HIGH.
Single Write Accesses Initiated by ADSP
This access is initiated when the following conditions are
satisfied at clock rise: (1) CE
1
, CE
2
, CE
3
are all asserted
active, and (2) ADSP is asserted LOW. The addresses
presented are loaded into the address register and the burst
inputs (GW, BWE, and BW[
A:D
] )are ignored during this first
clock cycle. If the write inputs are asserted active (see Write
Cycle Descriptions table for appropriate states that indicate a
write) on the next clock rise,the appropriate data will be latched
and written into the device. Byte writes are allowed. During
byte writes, BW
A
controls DQ
A
and BWB controls DQ
B
. BWC
controls DQ
C
, and BW
D
controls DQ
D
. All I/Os are three-stated
during a byte write.Since this is a common I/O device, the
asynchronous OE input signal must be deasserted and the
I/Os must be three-stated prior to the presentation of data to
DQs. As a safety precaution, the data lines are three-stated
once a write cycle is detected, regardless of the state of OE.
Single Write Accesses Initiated by ADSC
This write access is initiated when the following conditions are
satisfied at clock rise: (1) CE
1
, CE
2
, and CE
3
are all asserted
active, (2) ADSC is asserted LOW, (3) ADSP is deasserted
HIGH, and (4) the write input signals (GW, BWE, and BW
[A:D]
)
indicate a write access. ADSC is ignored if ADSP is active
LOW.
The addresses presented are loaded into the address register
and the burst counter/control logic and delivered to the
memory core. The information presented to DQ
[A:D]
will be
written into the specified address location. Byte writes are
allowed. During byte writes, BW
A
controls DQ
A
, BW
B
controls
DQ
B
, BW
C
controls DQ
C
, and BW
D
controls DQ
D
. All I/Os are
three-stated when a write is detected, even a byte write. Since
this is a common I/O device, the asynchronous OE input signal
must be deasserted and the I/Os must be three-stated prior to
the presentation of data to DQs. As a safety precaution, the
data lines are three-stated once a write cycle is detected,
regardless of the state of OE.
Burst Sequences
The CY7C1338F provides an on-chip two-bit wraparound
burst counter inside the SRAM. The burst counter is fed by
A[1:0], and can follow either a linear or interleaved burst order.
The burst order is determined by the state of the MODE input.
A LOW on MODE will select a linear burst sequence. A HIGH
on MODE will select an interleaved burst order. Leaving
MODE unconnected will cause the device to default to a inter-
leaved burst sequence.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CEs, ADSP, and ADSC must remain
inactive for the duration of t
ZZREC
after the ZZ input returns
LOW.
Interleaved Burst Address Table
(MODE = Floating or V
DD
)
First
Address
A1, A0
00
01
10
11
Second
Address
A1, A0
01
00
11
10
Third
Address
A1, A0
10
11
00
01
Fourth
Address
A1, A0
11
10
01
00
Linear Burst Address Table (MODE = GND)
First
Address
A
1
, A
0
00
01
10
11
Second
Address
A
1
, A
0
01
10
11
00
Third
Address
A
1
, A
0
10
11
00
01
Fourth
Address
A
1
, A
0
11
00
01
10
Page 5 of 17
Document #: 38-05218 Rev. *A
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参数对比
与CY7C1338F-117AXI相近的元器件有:CY7C1338F-117AXC、CY7C1338F-133AXI、CY7C1338F-100AXI、CY7C1338F-100AXC、CY7C1338F-133AXC、CY7C1338F-66AXC、CY7C1338F-66AXI。描述及对比如下:
型号 CY7C1338F-117AXI CY7C1338F-117AXC CY7C1338F-133AXI CY7C1338F-100AXI CY7C1338F-100AXC CY7C1338F-133AXC CY7C1338F-66AXC CY7C1338F-66AXI
描述 Cache SRAM, 128KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX32, 6.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX32, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX32, 6.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX32, 11ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 128KX32, 11ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 LQFP, LQFP, LQFP, LQFP, LQFP, LQFP, LQFP, LQFP,
针数 100 100 100 100 100 100 100 100
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 7.5 ns 7.5 ns 6.5 ns 8 ns 8 ns 6.5 ns 11 ns 11 ns
其他特性 FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 代码 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3
长度 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
内存密度 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
内存集成电路类型 CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
内存宽度 32 32 32 32 32 32 32 32
湿度敏感等级 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1
端子数量 100 100 100 100 100 100 100 100
字数 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000 128000 128000 128000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C
组织 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 40 40 40 40 40 40 40 40
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) - Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
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